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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LFX125EB-04F256C~~

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LFX125EB-04F256C - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LFX125EB-04F256C
Brand: Lattice Semiconductor Corporation
SKU: LFX125EB-04F256C
Availability: InStock
Rating: 5 (4 reviews)

Manufacturer Part Number: LFX125EB-04F256C

Manufacturer: Lattice Semiconductor

Allelco Part Number: 32D-LFX125EB-04F256C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 9,930 pcs available, New & Original

Parts Description: IC FPGA 160 I/O 256FBGA

Package: 256-FPBGA (17x17)

Data sheet: LFX125EB-04F256.pdf

Datasheets
LFX-ispXPGA Family.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Manufacturer Information
Product Transfer 10/Mar/2016.pdf

PCN Obsolescence/ EOL
Tin/Lead Devices 23/Jun/2015.pdf

RoHs Status

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Our certification

In stock: 9930

Specifications

LFX125EB-04F256C Tech Specifications
Lattice Semiconductor Corporation - LFX125EB-04F256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX125EB-04F256C

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.3V ~ 3.6V
Total RAM Bits	94208
Supplier Device Package	256-FPBGA (17x17)
Series	ispXPGA®
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	1936
Number of I/O	160
Number of Gates	139000
Mounting Type	Surface Mount
Base Product Number	LFX125

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

LFX125EB-04F256C (1)

Manufacturer Part Number

LFX125EB-04F256C

Manufacturer

Lattice Semiconductor

Introduction

The LFX125EB-04F256C is an FPGA (Field Programmable Gate Array) from Lattice Semiconductor's ispXPGA® series. It offers a compact and flexible solution for embedded system designs, providing a high-density programmable logic platform with a range of advanced features and capabilities.

Product Features and Performance

1,936 Logic Elements/Cells

94,208 Total RAM Bits

160 I/O Pins

139,000 Gates

Operating Voltage Range: 2.3V to 3.6V

Surface Mount Packaging

Operating Temperature Range: 0°C to 85°C

Product Advantages

Configurable and reconfigurable design for adaptable system requirements

Efficient power consumption and thermal management

High-density logic and memory resources for complex embedded applications

Comprehensive development tools and ecosystem support

Key Reasons to Choose

Flexible and scalable FPGA solution for diverse embedded system designs

Optimized performance and power efficiency

Robust development tools and technical support from Lattice Semiconductor

Long-term availability and product lifecycle management

Quality and Safety Features

Rigorously tested and qualified for reliability and performance

Compliance with industry standards and safety regulations

Robust package and thermal design for reliable operation

Compatibility

The LFX125EB-04F256C is compatible with a wide range of embedded system architectures and can be seamlessly integrated into various application environments.

Application Areas

Industrial automation and control

Automotive and transportation systems

Medical equipment and instrumentation

Telecommunications and networking equipment

Aerospace and defense applications

Product Lifecycle

The LFX125EB-04F256C is currently an obsolete product. Lattice Semiconductor may have equivalent or alternative FPGA models available. Customers are advised to contact our website's sales team for the latest product information and availability.

Frequently Asked Questions(FAQ)

What is the maximum number of logic cells available in the LFX125EB-04F256C FPGA, and how does this compare to other FPGAs in the same power and package category?: The LFX125EB-04F256C provides 1936 logic elements, which aligns with mid-range FPGAs designed for low-power, space-constrained applications. When compared to similarly packaged 256-BGA devices in the 2.3V–3.6V supply range, such as Xilinx Spartan-6 LX9 or Microsemi IGLOO2 equivalents, the Lattice ispXPGA architecture typically offers slightly fewer logic resources but emphasizes lower static power and deterministic timing—making it suitable for control-intensive tasks rather than high-throughput signal processing.

How should the LFX125EB-04F256C be thermally managed given its operating temperature range of 0°C to 85°C junction temperature?: With a maximum junction temperature of 85°C, thermal design must ensure that ambient conditions and PCB layout do not cause localized hotspots. Given its 256-FPBGA (17x17) package, proper solder joint integrity and adequate copper pour on adjacent layers are essential. In most embedded systems, passive cooling suffices; however, if the device drives high fanout nets or operates near full utilization, airflow or heatsinking may be necessary to maintain long-term reliability.

Can the LFX125EB-04F256C support dynamic reconfiguration without disrupting system operation, and what constraints apply during configuration mode?: The LFX125EB-04F256C supports partial reconfiguration only under limited circumstances defined by the ispXPGA design flow. Unlike newer FPGA families with hardened configuration controllers, reconfiguration requires careful partitioning and state management. During active configuration, I/O pins default to high-impedance unless explicitly controlled, so external circuitry must tolerate transient states. Full-system reinitialization is recommended for major logic changes.

What are the key differences between the LFX125EB-04F256C and the LFXP2-5E-5FTN256C substitute regarding logic density and power characteristics?: While both use the 256-FPBGA package and share similar supply voltage ranges, the LFXP2-5E-5FTN256C belongs to a later-generation architecture offering higher logic capacity—approximately 5,000 logic elements—compared to the LFX125EB-04F256C’s 1,936. This increase comes with modestly higher static current, though both remain in the ultra-low-power segment. Designers selecting between them should evaluate whether additional logic justifies any rise in quiescent power for their specific application duration and duty cycle.

Is it feasible to cascade multiple LFX125EB-04F256C devices for expanded functionality, and what synchronization challenges might arise?: Inter-device communication is possible via the 160 I/O pins, but timing closure becomes critical due to propagation delays across die and interconnect. Without dedicated high-speed serial transceivers, parallel interfaces require careful skew management. Additionally, global clock distribution networks must account for skew accumulation. For most applications, internal block RAM and logic resources suffice; external expansion is typically reserved for specialized extensions like high-speed ADC interfaces.

How does the base product number LFX125 relate to the specific variant LFX125EB-04F256C, and what role does the “EB” suffix play in device qualification?: The base part LFX125 defines the core logic fabric, while LFX125EB-04F256C specifies a particular engineering batch with extended temperature binning and enhanced electrical performance. The “EB” indicates a commercial-grade version optimized for industrial environments, supporting tighter voltage tolerances and improved noise margins over standard grades. The “04” denotes speed grade, meaning the device meets timing at 4 ns equivalent delay, useful for moderate-frequency designs up to ~250 MHz.

What precautions should be taken when designing PCB routing for the LFX125EB-04F256C’s 256-ball FPBGA package to avoid signal integrity issues?: Due to the dense 17x17 mm footprint and fine-pitch BGA (typically 0.8 mm pitch), controlled impedance traces are essential for high-speed signals. Decoupling capacitors must be placed within 1 cm of each VCC/VSS pair, with at least one per power rail quadrant. Clock and differential pairs should be length-matched to within 100 mils to prevent jitter. Avoid routing sensitive nets beneath the device to minimize crosstalk from switching I/O banks.

How reliable is the LFX125EB-04F256C in high-vibration environments, and does its Moisture Sensitivity Level (MSL 3) affect assembly planning?: As a surface-mount component with standard lead-free soldering requirements, the LFX125EB-04F256C exhibits good mechanical robustness when properly assembled. MSL 3 mandates storage below 60% humidity and use of moisture barrier bags with desiccant, with floor life typically limited to 168 hours post-opening. In vibration-prone systems, conformal coating or strain relief on adjacent connectors can further enhance durability, though the ceramic substrate itself resists fatigue well.

Can the LFX125EB-04F256C interface directly with DDR2 memory modules, or does it require level shifting and PHY support?: Native DDR2 support is not available in the ispXPGA family. While LVCMOS-compatible I/O allows connection to DDR2 SDRAM, designers must implement external memory controllers using soft IP cores. Timing constraints are manageable up to ~100 MHz, but precise DQS alignment and address/command setup/hold margins demand rigorous simulation. External pull-up/pull-down resistors on data lines may be needed depending on board stack-up.

What tools and licenses are required to synthesize and deploy code onto the LFX125EB-04F256C, and how do they impact development timelines?: Lattice Diamond or Radiant software is required for synthesis, place-and-route, and bitstream generation. Free versions exist for non-commercial use, but production designs often need paid licenses for scripting and optimization features. Compilation times are generally shorter than larger FPGA families due to smaller die size, but iterative debugging cycles can extend overall project duration if timing closure proves challenging.

Does the LFX125EB-04F256C include integrated flash memory for configuration storage, and what happens during power-up sequencing?: Yes, the device includes embedded flash memory that stores the configuration bitstream internally. Upon power-up, the device auto-reloads from flash without requiring external SPI or parallel PROMs. Power sequencing must follow VCC rising before or simultaneously with VREF to avoid latch-up. A soft-start regulator is recommended to limit inrush current and stabilize supplies within 50 ms.

How does the RoHS non-compliance status of the LFX125EB-04F256C affect procurement and end-of-life considerations?: RoHS non-compliance means the part contains restricted substances above threshold limits, limiting use in EU-regulated markets. Procurement teams must verify alternate sources early, as newer variants may replace it. However, many legacy industrial systems still accept non-RoHS parts under derogation clauses. Always confirm current status via distributor portals before committing to large-volume designs.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX125EB-04F256C

Product Attribute
Part Number	LFX125EB-04FN256C	LFX125EB-03F256C	LFX125EB-03FN256C	LFX125EB-04F256I
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Total RAM Bits	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Voltage - Supply	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Gates	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Number of I/O	-	-	-	-
Series	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-

LFX125EB-04F256C Datasheet PDF

Download LFX125EB-04F256C pdf datasheets and Lattice Semiconductor Corporation documentation for LFX125EB-04F256C - Lattice Semiconductor Corporation.

Datasheets: LFX-ispXPGA Family.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Manufacturer Information: Product Transfer 10/Mar/2016.pdf
PCN Obsolescence/ EOL: Tin/Lead Devices 23/Jun/2015.pdf

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
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