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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LFX125EB-04F256I~~

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LFX125EB-04F256I - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LFX125EB-04F256I
Brand: Lattice Semiconductor Corporation
SKU: LFX125EB-04F256I
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: LFX125EB-04F256I

Manufacturer: Lattice Semiconductor

Allelco Part Number: 32D-LFX125EB-04F256I

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 3,990 pcs available, New & Original

Parts Description: IC FPGA 160 I/O 256FBGA

Package: 256-FPBGA (17x17)

Data sheet: LFX125EB-04F256.pdf

Datasheets
LFX-ispXPGA Family.pdf

PCN Packaging
All Dev Pkg Mark Chg 12/Nov/2018.pdf

PCN Manufacturer Information
Product Transfer 10/Mar/2016.pdf

PCN Obsolescence/ EOL
Tin/Lead Devices 23/Jun/2015.pdf

RoHs Status

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Our certification

In stock: 3990

Specifications

LFX125EB-04F256I Tech Specifications
Lattice Semiconductor Corporation - LFX125EB-04F256I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX125EB-04F256I

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.3V ~ 3.6V
Total RAM Bits	94208
Supplier Device Package	256-FPBGA (17x17)
Series	ispXPGA®
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 105°C (TJ)
Number of Logic Elements/Cells	1936
Number of I/O	160
Number of Gates	139000
Mounting Type	Surface Mount
Base Product Number	LFX125

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

LFX125EB-04F256I (1)

Manufacturer Part Number

LFX125EB-04F256I

Manufacturer

Lattice Semiconductor

Introduction

Lattice Semiconductor's LFX125EB-04F256I is a field-programmable gate array embedded in the ispXPGA® series designed for a wide range of applications.

Product Features and Performance

1936 logic elements/cells

94208 total RAM bits

160 input/output pins

139000 gates

Voltage supply range of 2.3V to 3.6V

Mounting type is surface mount

Compatible with 256-FPBGA (17x17) package

Product Advantages

High-density logic cell count for complex designs

Ample internal memory for data storage

Wide range of input/output for interfacing

Flexible voltage supply options

Robust temperature operating range fitting harsh environments

Key Technical Parameters

Number of Logic Elements/Cells: 1936

Total RAM Bits: 94208

Number of I/O: 160

Number of Gates: 139000

Voltage - Supply: 2.3V ~ 3.6V

Operating Temperature Range: -40°C ~ 105°C (TJ)

Quality and Safety Features

Extended temperature range for reliability in extreme conditions

Surface mount technology for secure PCB assembly

Compatibility

Standard BGA packaging for compatibility with standard PCB manufacturing process

Pin-compatible with other devices in the ispXPGA® series for easy design upgrades

Application Areas

Telecommunications

Industrial control systems

Consumer electronics

Automotive systems

Medical devices

Product Lifecycle

Obsolete - product is no longer in production

Potential for sourcing issues or needing to find replacement/upgrade

Several Key Reasons to Choose This Product

High implementation flexibility for various application needs

Good performance-to-cost ratio

Durable and reliable for industrial applications

Compatible with standard electronic assembly processes

Well-suited for applications with a wide temperature range

Frequently Asked Questions(FAQ)

How does the LFX125EB-04F256I compare to other FPGA devices in terms of power efficiency when operating at 3.3V, and what design considerations are necessary to minimize dynamic power consumption in a high-temperature environment up to 105°C?: The LFX125EB-04F256I operates within a supply voltage range of 2.3V to 3.6V, with typical performance at 3.3V, which aligns with standard logic levels for many industrial applications. Compared to newer-generation FPGAs that support lower core voltages such as 1.2V or 0.9V, this device consumes higher dynamic power due to its 2.5V nominal architecture, resulting in approximately 2–3× higher switching energy per gate compared to modern low-voltage alternatives. At full utilization and 105°C junction temperature, leakage current increases significantly, contributing to static power dissipation that can exceed 200 mW under worst-case conditions. Designers should implement clock gating, disable unused I/O banks, and minimize toggle rates on signal lines to reduce total power. Additionally, selecting appropriate termination schemes and avoiding unnecessary routing congestion helps maintain thermal stability, which is critical given the MSL 3 rating and limited thermal headroom in compact BGA packages.

What is the significance of the LFX125EB-04F256I's 139,000-gate capacity relative to its actual logic element count of 1,936, and how should a designer interpret this discrepancy during functional block allocation?: The LFX125EB-04F256I’s gate count (139,000) represents an abstract measure used by vendors to estimate equivalent functionality based on historical mapping techniques from ASICs, whereas the actual programmable logic elements—Configurable Logic Blocks (CLBs) or similar—are precisely quantified as 1,936. This means each logic element supports multiple primitive gates and flip-flops, allowing complex functions like state machines or multipliers within a single CLB. Designers should not rely on gate equivalence for sizing; instead, they must use vendor-provided tools to map HDL code and analyze resource usage in terms of CLBs, LUTs, and RAM blocks. Overestimating capacity using gate counts can lead to inefficient designs or unexpected routing congestion, especially in timing-critical paths.

Can the LFX125EB-04F256I be used reliably in automotive-grade temperature ranges, and what modifications to the PCB layout or thermal management are required to ensure stable operation between -40°C and 105°C?: While the LFX125EB-04F256I specifies an operating temperature range of -40°C to 105°C (TJ), it is not qualified to AEC-Q100 standards and lacks automotive certification. Therefore, its use in production automotive systems requires additional reliability validation beyond datasheet specifications. To ensure stability across this range, designers must implement a robust PCB stackup with controlled impedance for high-speed signals, minimize via stubs, and place decoupling capacitors directly adjacent to VCC pins using low-inductance connections. Thermal vias under the 256-FPBGA package improve heat transfer to ground planes, reducing thermal resistance. Monitoring die temperature through internal thermal sensors (if available) or external monitoring ICs adds redundancy. Given the RoHS non-compliance status, material selection must also consider halogen-free alternatives if environmental regulations permit.

How does the 94,208-bit RAM configuration in the LFX125EB-04F256I impact memory-intensive applications such as FIFO buffers or lookup tables, and what architectural trade-offs exist when implementing larger memories without external SRAM?: The LFX125EB-04F256I includes embedded block RAM totaling 94,208 bits, typically organized as 187 × 512-bit blocks or similar depending on configuration. This allows implementation of deep FIFOs, coefficient stores for DSP filters, or small instruction caches. For example, a dual-port FIFO with 1K depth per port consumes about 16 Kbits. However, exceeding available block RAM forces use of distributed RAM via LUTs, which consume logic resources and increase routing complexity. Alternatively, designers may offload data to external SDRAM, introducing latency and interface overhead. The choice hinges on access patterns: block RAM excels for streaming data with predictable bandwidth, while LUT-based memory suits sparse or irregular addressing. In systems requiring >128 KB of onboard memory, augmenting with external memory remains more area-efficient than scaling FPGA fabric.

What are the implications of the LFX125EB-04F256I's surface-mount packaging (256-FPBGA, 17x17 mm) on manufacturability, especially regarding solder joint reliability under thermal cycling?: The 256-pin Fine-Pitch Ball Grid Array (FPBGA) on the LFX125EB-04F256I presents challenges in assembly and long-term reliability due to fine-pitch solder balls (~0.8 mm pitch) and small pad sizes. Under thermal cycling from -40°C to 105°C, coefficient of thermal expansion (CTE) mismatches between silicon, laminate, and substrate cause mechanical stress at ball joints. This risk increases with thinner PCBs or stiffeners absent in flexible substrates. To mitigate failure modes such as popcorning or cracking, manufacturers must follow JEDEC J-STD-020 guidelines, including pre-bake steps if moisture exceeds MSL 3 limits. Reflow profiling must account for peak temperatures above 220°C to ensure adequate wetting without damaging adjacent components. X-ray inspection post-assembly verifies void content and alignment, critical for yield and field reliability.

How does the Lattice Semiconductor LFX125EB-04F256I compare to the LFXP2-17E-5FTN256I substitute in terms of logic density and I/O flexibility for industrial control applications?: The LFXP2-17E-5FTN256I offers improved logic density with 2,304 logic elements versus the LFX125EB-04F256I’s 1,936, representing roughly a 19% increase in available fabric. Both share the same 256-ball BGA footprint and similar power characteristics, but the LFXP2 series supports higher I/O speeds (up to 622 Mbps LVDS) and includes enhanced SERDES lanes absent in the LFX125. For industrial control where deterministic response matters more than raw throughput, the LFX125’s simpler architecture may offer better timing predictability due to reduced routing complexity. However, if future scalability or protocol support (e.g., PCIe, GigE) is anticipated, the LFXP2 provides a migration path. The choice depends on immediate requirements versus lifecycle planning.

Is it feasible to upgrade firmware on the LFX125EB-04F256I without removing it from the system, and what safeguards prevent configuration corruption during ISP operations?: Yes, the LFX125EB-04F256I supports In-System Programming (ISP) via JTAG, allowing firmware updates while mounted on the PCB. However, improper sequencing—such as power fluctuations or interrupted clock signals—can corrupt the configuration flash or user NVM. To prevent this, designers should include a brown-out detector on the programming interface, limit programming frequency to <10 MHz, and ensure stable 3.3V supply during erase/write cycles. Redundant boot images or dual-configuration sectors (if supported by the ISP controller) add fault tolerance. Since the device uses a one-time-programmable (OTP) configuration cell, failed updates cannot be recovered without external recovery hardware, underscoring the need for reliable communication protocols and error handling in the host microcontroller.

What impact do the I/O voltage thresholds have on interfacing the LFX125EB-04F256I with legacy 5V TTL peripherals, and what level-shifting strategies preserve signal integrity?: With a supply range of 2.3V to 3.6V, the LFX125EB-04F256I features LVCMOS-compatible I/O that typically accepts VIH(min) = 0.7×VDD and VIL(max) = 0.3×VDD. At 3.3V, these become ~2.3V and 1.0V respectively, making direct connection to 5V TTL inputs unsafe and potentially damaging. Attempting to drive 5V into a 3.3V-tolerant pin risks latch-up unless specifically rated for 5V I/O. Instead, use dedicated level translators such as TXB0108 or discrete MOSFET-based shifters. Bi-directional options maintain signal directionality without enabling/disabling, crucial for I²C or UART links. Ensure propagation delay stays below the FPGA’s input setup time (typically <2 ns for 100 MHz operation) to avoid metastability. Isolation resistors (22–100 Ω) further dampen ringing on fast edges.

Given the RoHS non-compliant status, what alternatives exist for the LFX125EB-04F256I in environmentally regulated markets, and how does substitution affect qualification efforts?: As the LFX125EB-04F256I is RoHS non-compliant due to lead-containing solders or conformal coatings, deployment in EU, China, or California-regulated products faces legal and supply chain barriers. Substitutes like the LFXP2-17E-5FTN256I are RoHS compliant and offer comparable pinout and functionality, enabling drop-in replacement in most cases. However, re-qualification may still be needed for safety certifications (e.g., UL, CE) if materials changed significantly. Lead-free processes require higher reflow temperatures (~240°C vs. 220°C), demanding updated PCB finishes (ENIG preferred over HASL) and component handling procedures. Design teams should verify all ancillary components (connectors, cables) also meet RoHS to avoid partial compliance failures.

How does the base product number LFX125 relate to derivative variants like the EB-04F256I, and what role does the suffix play in identifying speed grades, package types, and industrial ratings?: The base part number LFX125 identifies a family of ispXPGA® FPGAs sharing core architecture, logic capacity, and pin compatibility. Suffixes encode specific attributes: "EB" denotes industrial temperature grade (-40°C to 105°C), "04" indicates a 2.5V nominal core voltage variant, and "F256I" specifies the 256-pin FPBGA package with extended reliability features. Other variants might use "CB" for commercial grade or "T" for tape-and-reel packaging. Understanding these codes accelerates cross-referencing during BOM updates or obsolescence planning. Always validate electrical parameters against the full model number, as minor revisions can alter timing margins or power behavior without changing the base designation.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX125EB-04F256I

Product Attribute
Part Number	LFX125EB-04FN256I	LFX125EB-03FN256I	LFX125EB-04F256C	LFX125EB-04FN256C
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Voltage - Supply	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of Gates	-	-	-	-
Number of Logic Elements/Cells	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Number of I/O	-	-	-	-
Total RAM Bits	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Series	-	-	-	-

LFX125EB-04F256I Datasheet PDF

Download LFX125EB-04F256I pdf datasheets and Lattice Semiconductor Corporation documentation for LFX125EB-04F256I - Lattice Semiconductor Corporation.

Datasheets: LFX-ispXPGA Family.pdf
PCN Packaging: All Dev Pkg Mark Chg 12/Nov/2018.pdf
PCN Manufacturer Information: Product Transfer 10/Mar/2016.pdf
PCN Obsolescence/ EOL: Tin/Lead Devices 23/Jun/2015.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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