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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LFX125EB-04FN256C~~

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LFX125EB-04FN256C - Lattice Semiconductor Corporation

Manufacturer Part Number: LFX125EB-04FN256C

Manufacturer: Lattice Semiconductor

Allelco Part Number: 98D-LFX125EB-04FN256C

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 11,383 pcs available, New & Original

Parts Description: IC FPGA 160 I/O 256FBGA

Package: 256-FPBGA (17x17)

Data sheet: LFX125EB-04FN25.pdf

Datasheets
Cylindrical Battery Holders.pdf

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Specifications

LFX125EB-04FN256C Tech Specifications
Lattice Semiconductor Corporation - LFX125EB-04FN256C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX125EB-04FN256C

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.3V ~ 3.6V
Total RAM Bits	94208
Supplier Device Package	256-FPBGA (17x17)
Series	ispXPGA®
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	0°C ~ 85°C (TJ)
Number of Logic Elements/Cells	1936
Number of I/O	160
Number of Gates	139000
Mounting Type	Surface Mount
Base Product Number	LFX125

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

What are the key architectural differences between the LFX125EB-04FN256C and traditional SRAM-based FPGAs that impact power-on behavior and system reliability?: The LFX125EB-04FN256C leverages Lattice’s ispXPGA® non-volatile architecture, which eliminates the need for external configuration memory. Unlike SRAM-based FPGAs that require a boot sequence and are vulnerable to single-event upsets, this device boots instantly and retains its configuration during power loss. This makes it inherently more reliable in environments with frequent power cycling or radiation exposure, such as industrial control systems.

How does the total RAM capacity of 94,208 bits in the LFX125EB-04FN256C influence real-world implementation of data buffers or FIFO structures?: With 94,208 bits of embedded block RAM distributed across multiple blocks, the LFX125EB-04FN256C can support several moderate-depth FIFOs or dual-port buffers without consuming significant logic resources. For example, implementing four 24-bit wide FIFOs with a depth of 960 words each is feasible while leaving ample room for other functions—this level of integration reduces external memory dependencies in mid-complexity signal processing designs.

Can the LFX125EB-04FN256C operate reliably in a 2.5V system environment, and what are the implications for I/O compatibility?: Yes, the LFX125EB-04FN256C supports a supply voltage range of 2.3V to 3.6V, making it fully compatible with 2.5V core and I/O rails. Its I/O banks are independently configurable and support LVCMOS, LVTTL, and other standards at 2.5V, enabling direct interfacing with legacy ASICs or microcontrollers without level shifters—provided timing margins are validated under worst-case process and temperature conditions.

What design considerations are necessary when using the 160 I/O pins on the LFX125EB-04FN256C in a high-noise industrial environment?: The 160 I/O pins on the LFX125EB-04FN256C should be allocated with attention to signal integrity, especially when routing high-speed or analog-sense lines. Ground and power pin distribution across the 256-FPBGA package supports good return paths, but designers should implement proper decoupling, guard traces, and differential signaling where applicable. Additionally, unused I/Os should be tied off to prevent floating inputs, which can increase power leakage and susceptibility to EMI.

How does the logic density of 1,936 logic elements in the LFX125EB-04FN256C compare to competing non-volatile FPGAs like the LFXP2-5E-5FTN256C for control-oriented applications?: The LFX125EB-04FN256C offers a moderate logic count suitable for glue logic, state machines, and interface bridging, whereas the LFXP2-5E-5FTN256C provides higher density (approximately 5K LUTs) at the cost of increased static power and complexity. For applications requiring deterministic timing and low latency—such as motor control or sensor aggregation—the LFX125EB-04FN256C’s simpler architecture often results in more predictable place-and-route outcomes and lower debug overhead.

What thermal management strategies are recommended given the 0°C to 85°C operating temperature range of the LFX125EB-04FN256C?: Although the LFX125EB-04FN256C is rated for junction temperatures up to 85°C, sustained operation near this limit can accelerate aging and affect timing margins. In enclosed or high-ambient environments, thermal vias under the 256-FPBGA package and a small heatsink or airflow should be considered. Power estimation tools should be used early to model dynamic and static dissipation, especially when utilizing a high percentage of I/Os or clock networks.

Is the LFX125EB-04FN256C suitable for safety-critical systems, and what documentation or certifications support this use case?: While the LFX125EB-04FN256C is not certified for functional safety standards like ISO 26262 or IEC 61508, its non-volatile configuration and single-chip integration reduce failure modes associated with external boot devices. Designers can leverage its deterministic startup and lack of configuration bitstream vulnerability to build fault-tolerant systems, provided that additional redundancy and monitoring are implemented at the system level.

How does the moisture sensitivity level (MSL 3) of the LFX125EB-04FN256C affect handling and PCB assembly processes?: With an MSL 3 rating, the LFX125EB-04FN256C can be exposed to ambient conditions for up to 168 hours after dry packaging is opened before requiring bake-out. This allows standard pick-and-place workflows but mandates strict moisture control during storage and assembly. Reflow profiles must comply with J-STD-020 to avoid package delamination, particularly critical given the 17x17 mm FPBGA footprint.

What are the trade-offs in choosing the LFX125EB-04FN256C over a higher-gate-count FPGA for a prototype-to-production transition?: Selecting the LFX125EB-04FN256C simplifies BOM and reduces board real estate compared to larger FPGAs, but limits headroom for feature expansion. Its 139,000-gate equivalent capacity is sufficient for many embedded control tasks, yet complex DSP or high-speed serial interfaces may require migration to a higher-density platform. Early architectural partitioning is essential to avoid mid-development respin costs.

How does the absence of SERDES blocks in the LFX125EB-04FN256C influence system-level connectivity options?: The LFX125EB-04FN256C lacks integrated high-speed transceivers, limiting native support for protocols like PCIe or Ethernet beyond 100 Mbps. Designers must rely on soft IP implementations or external PHYs for higher-speed links, which increases latency and consumes logic resources. This makes the device better suited for parallel bus interfaces, UART/SPI/I2C expansion, or low-speed industrial networking rather than high-bandwidth data acquisition systems.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX125EB-04FN256C

Product Attribute
Part Number	LFX125EB-04F256C	LFX125EB-05FN256C	LFX125EB-04FN256I	LFX125EB-03FN256C
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Number of Logic Elements/Cells	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Number of Gates	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Voltage - Supply	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Total RAM Bits	-	-	-	-
Series	-	-	-	-
Number of I/O	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount

LFX125EB-04FN256C Datasheet PDF

Download LFX125EB-04FN256C pdf datasheets and Lattice Semiconductor Corporation documentation for LFX125EB-04FN256C - Lattice Semiconductor Corporation.

Datasheets: Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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