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Home Products Integrated Circuits (ICs)Embedded - FPGAs (Field Programmable Gate Array)~~LFX125EB-04FN256I~~

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LFX125EB-04FN256I - Lattice Semiconductor Corporation

Name: Lattice Semiconductor Corporation LFX125EB-04FN256I
Brand: Lattice Semiconductor Corporation
SKU: LFX125EB-04FN256I
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: LFX125EB-04FN256I

Manufacturer: Lattice Semiconductor

Allelco Part Number: 98D-LFX125EB-04FN256I

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,798 pcs available, New & Original

Parts Description: IC FPGA 160 I/O 256FBGA

Package: 256-FPBGA (17x17)

Data sheet: LFX125EB-04FN25.pdf

Datasheets
Cylindrical Battery Holders.pdf

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Specifications

LFX125EB-04FN256I Tech Specifications
Lattice Semiconductor Corporation - LFX125EB-04FN256I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation - LFX125EB-04FN256I

Product Attribute	Attribute Value
Manufacturer	Lattice Semiconductor
Voltage - Supply	2.3V ~ 3.6V
Total RAM Bits	94208
Supplier Device Package	256-FPBGA (17x17)
Series	ispXPGA®
Package / Case	256-BGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 105°C (TJ)
Number of Logic Elements/Cells	1936
Number of I/O	160
Number of Gates	139000
Mounting Type	Surface Mount
Base Product Number	LFX125

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

What are the key architectural trade-offs when using the LFX125EB-04FN256I FPGA in a low-power embedded system design?: The LFX125EB-04FN256I, based on Lattice’s ispXPGA® architecture, offers 1936 logic elements and 94,208 bits of embedded RAM, which provides moderate logic density suitable for control logic and interface bridging. However, its static power consumption is relatively higher compared to newer non-volatile or ultra-low-power FPGA families, making it less ideal for battery-operated applications. Designers must evaluate the 2.3V to 3.6V supply range against system-level power budgets, especially when leveraging all 160 I/Os simultaneously. The absence of built-in power gating or sleep modes in this architecture requires external power management strategies to meet aggressive energy targets.

How does the I/O count and package type of the LFX125EB-04FN256I influence PCB layout complexity in high-speed designs?: With 160 user I/Os in a 256-FPBGA (17x17 mm) package, the LFX125EB-04FN256I demands careful attention to signal integrity and escape routing. The fine-pitch BGA necessitates at least a 6-layer PCB with controlled impedance for high-speed signals, and via-in-pad or microvia technology may be required for dense routing. The high pin count increases the risk of crosstalk and ground bounce, particularly when multiple I/Os switch simultaneously. Designers should use I/O bank voltage planning and spread high-current switching across banks to minimize simultaneous switching noise (SSN).

Can the LFX125EB-04FN256I support real-time processing tasks requiring deterministic timing, and what architectural features enable this?: Yes, the LFX125EB-04FN256I supports deterministic behavior through its synchronous architecture and predictable routing delays within the ispXPGA® fabric. With 1936 logic cells and dedicated carry chains, it can implement pipelined state machines or simple DSP functions with consistent timing closure. However, it lacks hardened DSP blocks or embedded processors, so complex real-time algorithms must be implemented in soft logic, which increases resource usage and reduces maximum clock frequency. Timing analysis should account for worst-case delays at -40°C to ensure reliability across the full operating range.

What are the thermal considerations when operating the LFX125EB-04FN256I at its maximum junction temperature of 105°C?: Operating the LFX125EB-04FN256I at 105°C TJ requires effective thermal management due to increased leakage current and potential timing degradation. The 256-FPBGA package has limited thermal conductivity, so a thermal pad connection to the PCB ground plane with multiple vias is essential. In enclosed or high-ambient environments, airflow or heatsinking may be necessary. Power estimation tools should model dynamic and static power at elevated temperatures, as leakage can increase significantly near the upper limit, potentially exceeding 30% of total power consumption.

How does the LFX125EB-04FN256I compare to the LFXP2-5E-5FTN256I in terms of logic density and system integration capabilities?: The LFX125EB-04FN256I provides 1936 logic elements and 94,208 RAM bits, while the LFXP2-5E-5FTN256I offers only 5,000 system gates (approximately 125 logic elements) and no embedded block RAM. This makes the LFX125EB-04FN256I significantly more capable for applications requiring moderate data buffering or state retention. The LFXP2 series targets glue logic and simple control functions, whereas the LFX125EB-04FN256I can handle more complex protocol bridging or sensor fusion tasks. However, the LFXP2 consumes less static power, making it preferable in always-on, low-duty-cycle systems.

What design verification steps are recommended before finalizing a layout with the LFX125EB-04FN256I to avoid post-assembly failures?: Before layout finalization, designers should perform signal integrity simulations on high-speed I/Os, especially if using LVDS or source-synchronous interfaces. Power integrity analysis is critical due to the device’s 2.3V to 3.6V supply range and potential for simultaneous switching noise across 160 I/Os. Thermal modeling under worst-case power scenarios helps prevent overheating in compact enclosures. Additionally, boundary scan testing (JTAG) should be incorporated into the design to enable in-system debug, leveraging the FPGA’s built-in testability features for manufacturing validation.

Is the LFX125EB-04FN256I suitable for industrial applications requiring extended temperature operation and long-term reliability?: Yes, the LFX125EB-04FN256I is rated for -40°C to 105°C junction temperature, meeting industrial temperature requirements. Its MSL 3 classification (168-hour floor life) indicates moderate sensitivity to moisture, so proper storage and baking procedures are necessary before reflow in high-volume production. The use of standard CMOS processes and absence of advanced packaging materials enhances long-term reliability in harsh environments. However, designers should validate long-term performance under thermal cycling, as BGA solder joints may experience fatigue over time in vibrating or thermally cycled systems.

How does the lack of embedded non-volatile memory in the LFX125EB-04FN256I affect system boot time and configuration reliability?: The LFX125EB-04FN256I requires an external configuration memory device (e.g., SPI flash), which introduces boot latency and a potential single point of failure. Unlike flash-based FPGAs, it must load its configuration on power-up, typically adding 10–100 ms to system initialization depending on the flash size and interface speed. This delay may be unacceptable in safety-critical or fast-start applications. Additionally, the configuration interface must be protected against noise and corruption, especially in electrically noisy industrial environments, to prevent boot failures.

What are the implications of the 139,000-gate count specification for actual usable logic in a typical design?: The 139,000-gate equivalent for the LFX125EB-04FN256I is a marketing metric based on a 4-input NAND gate standard and does not reflect real-world utilization. In practice, the 1936 logic elements (each roughly equivalent to a 4-LUT and flip-flop) provide significantly less usable logic due to routing overhead, fanout limitations, and I/O resource contention. Complex designs may achieve only 60–70% logic utilization before timing closure becomes challenging. Engineers should base capacity planning on logic element count and block RAM availability rather than gate equivalents.

Can the LFX125EB-04FN256I be used in safety-critical systems, and what design practices mitigate risk?: While the LFX125EB-04FN256I is not certified for functional safety standards like ISO 26262 or IEC 61508, it can be used in safety-related systems with appropriate design mitigations. Techniques such as triple modular redundancy (TMR), periodic self-test routines, and watchdog monitoring can enhance fault tolerance. The device’s deterministic timing and lack of dynamic reconfiguration reduce unexpected behavior risks. However, external supervision and fail-safe mechanisms are essential, as the FPGA itself provides no built-in error detection or correction beyond standard JTAG diagnostics.

Parts with Similar Specifications

The three parts on the right have similar specifications to Lattice Semiconductor Corporation LFX125EB-04FN256I

Product Attribute
Part Number	LFX125EB-04FN256C	LFX125EB-04F256I	LFX125EB-03FN256I	LFX125EB-04F256C
Manufacturer	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation	Lattice Semiconductor Corporation
Number of Logic Elements/Cells	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of I/O	-	-	-	-
Total RAM Bits	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Voltage - Supply	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of Gates	-	-	-	-
Series	-	-	-	-

LFX125EB-04FN256I Datasheet PDF

Download LFX125EB-04FN256I pdf datasheets and Lattice Semiconductor Corporation documentation for LFX125EB-04FN256I - Lattice Semiconductor Corporation.

Datasheets: Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

Arch***ct

Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
FPGA***lorer88

Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
Nath***oleman

Jun 29, 2026

Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.

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