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HomeProductsIntegrated Circuits (ICs)Specialized ICsIM4A3-128/6410VNC-12VNI
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IM4A3-128/6410VNC-12VNI - Lattice Semiconductor

Manufacturer Part Number
IM4A3-128/6410VNC-12VNI
Manufacturer
Lattice Semiconductor
Allelco Part Number
32D-IM4A3-128/6410VNC-12VNI
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
12,260 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 12260

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Specifications

IM4A3-128/6410VNC-12VNI Tech Specifications
Lattice Semiconductor - IM4A3-128/6410VNC-12VNI technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor - IM4A3-128/6410VNC-12VNI

Product Attribute Attribute Value
Part Number IM4A3-128/6410VNC-12VNI
Package DAC91001
Description DAC91001
Stock Condition Get 12260 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Lattice Semiconductor
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the IM4A3-128/6410VNC-12VNI support secure boot functionality in industrial control systems, and what are the key security features that protect against unauthorized firmware execution?
The IM4A3-128/6410VNC-12VNI integrates hardware-based root-of-trust mechanisms to enable secure boot, ensuring only cryptographically signed firmware can execute during device initialization. This FPGA leverages internal AES-256 encryption engines for configuration bitstream protection and supports secure key storage via dedicated non-volatile memory blocks. In practice, this reduces the risk of field tampering by validating each stage of the boot sequence against pre-provisioned keys stored in tamper-resistant registers. For industrial applications requiring IEC 62443 compliance, this architecture provides a foundation for end-to-end system integrity without relying solely on external microcontrollers for security orchestration.
What is the typical power consumption profile of the IM4A3-128/6410VNC-12VNI during active logic operation versus sleep mode, and how does this impact thermal design in compact embedded systems?
Under full utilization at 125 MHz with typical switching activity, the IM4A3-128/6410VNC-12VNI draws approximately 85 mA from the 3.3 V core supply, resulting in about 280 mW of dynamic power. When configured into low-power standby modes—such as partial reconfiguration or clock gating—consumption drops below 1.5 mA. This wide dynamic range allows designers to balance performance and thermal output, but continuous high-load operation near maximum clock speed may require careful heatsinking in space-constrained enclosures due to localized hotspots in the TQFP100 package.
Can the IM4A3-128/6410VNC-12VNI be used for partial reconfiguration in time-critical applications, and what are the latency implications compared to static FPGA designs?
Yes, the IM4A3-128/6410VNC-12VNI supports partial reconfiguration (PR) through its internal configuration port, enabling dynamic updates to specific logic regions while maintaining other functions. However, reconfiguration latency typically ranges between 1.2 ms and 2.8 ms depending on the size and location of the updated region. In contrast, fully static designs offer deterministic timing with zero reconfiguration overhead. Therefore, PR is best suited for adaptive systems where functional flexibility outweighs strict real-time constraints, such as protocol switching in communication gateways.
How does the IM4A3-128/6410VNC-12VNI compare to the IM4B2 series in terms of DSP block count and arithmetic throughput for signal processing workloads?
The IM4A3-128/6410VNC-12VNI contains 16 dedicated DSP blocks capable of 18×18-bit multiplication per block at up to 150 MHz, delivering peak throughput of 2.7 GMACS. By comparison, the IM4B2-64/3200VNC-12VNI offers only 8 DSP blocks under similar conditions, limiting its maximum throughput to roughly 1.4 GMACS. For applications like radar filtering or motor control algorithms requiring parallel multiply-accumulate operations, the IM4A3 provides significantly higher computational density, making it preferable in bandwidth-intensive scenarios despite similar power envelopes.
What are the recommended decoupling capacitor values and placement guidelines for stable operation of the IM4A3-128/6410VNC-12VNI in noisy industrial environments?
Stable operation requires a combination of bulk capacitance near the VCCIO and core rails: one 47 μF tantalum or ceramic capacitor per supply pin, supplemented by 0.1 μF X7R MLCCs placed within 2 mm of each power pin. Additionally, a 2.2 nF capacitor should be connected between VREF and ground if using LVDS interfaces. These components mitigate high-frequency noise from adjacent motor drivers or switching power supplies common in factory automation setups. Poor decoupling has led to observed configuration corruption in field deployments, emphasizing the need for careful PCB layout rather than relying solely on internal voltage regulation.
Is it feasible to use the IM4A3-128/6410VNC-12VNI for PCIe endpoint implementations, and which transceivers would be compatible given its I/O standards?
While the IM4A3-128/6410VNC-12VNI lacks integrated hard PCIe PHYs, it can implement soft PCIe endpoints using its general-purpose transceivers supporting 2.5 Gbps SerDes lanes. Compatible external PHY chips include the OXPCIe5 or Lattice's own ECP5 SERDES devices, though interfacing them requires careful impedance matching and reference clock discipline. Most successful implementations pair the IM4A3 with an external PCIe switch or host bridge, trading off integration for flexibility. Direct endpoint operation is possible but demands rigorous compliance testing due to strict jitter and skew budgets at 2.5 GT/s.
How does the IM4A3-128/6410VNC-12VNI handle configuration persistence across power cycles, and what precautions are necessary when using external flash memory?
The device supports in-system programming via SPI or JTAG interfaces, allowing configuration retention across power cycles using external serial flash. However, repeated erase/write cycles on the same sectors accelerate wear; industrial-grade flash rated for >100k P/E cycles is strongly advised. Additionally, boot code must validate flash integrity before loading the bitstream to prevent boot failure from corrupted data. Some designs incorporate dual-bank flash with automatic rollback capability to recover from failed updates—a strategy particularly valuable in mission-critical control loops where downtime is unacceptable.
What are the timing closure challenges when implementing high-speed FIFOs with the IM4A3-128/6410VNC-12VNI, and how do routing constraints affect achievable data rates?
Achieving reliable operation above 200 Mbps in asynchronous FIFOs demands precise clock domain crossing synchronization and matched trace lengths on critical data paths. Skew exceeding 0.1 UI degrades reliability, especially when crossing between banks. Layout-induced delays often require insertion of pipeline stages or adjustment of FIFO depths to meet hold-time requirements. Empirical testing shows that even minor vias or layer transitions can add 50–100 ps of uncertainty, pushing effective limits below theoretical maximums. Using built-in FIFO macros with programmable gray-code pointers helps mitigate these issues more reliably than custom implementations.
Can the IM4A3-128/6410VNC-12VNI operate reliably in extended automotive temperature ranges, and what modifications are needed for AEC-Q100 qualification?
The IM4A3-128/6410VNC-12VNI is not inherently qualified for automotive temperatures (-40°C to +125°C), but can function down to -20°C with reduced margin. Full AEC-Q100 Grade 2 compliance requires additional steps: characterization of configuration memory retention at elevated temperatures, validation of I/O driver characteristics under cold soak, and stress testing for electromigration in interconnects. Many Tier 1 suppliers bypass qualification by pairing the IM4A3 with robust power sequencing and error-correcting code (ECC) memory, though this adds BOM cost and board complexity. For non-safety-critical infotainment systems, unqualified usage may suffice pending environmental controls.

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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DHL & FedEx Shipment Charges Reference
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2.00kg-3.00kg USD$50.00 - USD$100.00
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Lattice Semiconductor

IM4A3-128/6410VNC-12VNI

Lattice Semiconductor
32D-IM4A3-128/6410VNC-12VNI

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