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Home Products Integrated Circuits (ICs)Logic - Buffers, Drivers, Receivers, Transceivers~~CY74FCT16245CTPACT~~

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CY74FCT16245CTPACT - Texas Instruments

Name: Texas Instruments CY74FCT16245CTPACT
Brand: Texas Instruments
SKU: CY74FCT16245CTPACT
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: CY74FCT16245CTPACT

Manufacturer: Texas Instruments

Allelco Part Number: 32D-CY74FCT16245CTPACT

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 31,797 pcs available, New & Original

Parts Description: IC TXRX NON-INVERT 5.5V 48TSSOP

Package: 48-TSSOP

Data sheet: CY74FCT16245CTP.pdf

HTML Datasheet
Cylindrical Battery Holders.pdf

PCN Obsolescence/ EOL
Cylindrical Battery Holders.pdf

PCN Packaging
TSSOP Carrier Tape Chg 1/Sep/2016.pdf

RoHs Status: ROHS3 Compliant

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Specifications

CY74FCT16245CTPACT Tech Specifications
Texas Instruments - CY74FCT16245CTPACT technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - CY74FCT16245CTPACT

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply	4.5V ~ 5.5V
Supplier Device Package	48-TSSOP
Series	74FCT
Package / Case	48-TFSOP (0.240', 6.10mm Width)
Package	Tape & Reel (TR)
Output Type	3-State
Operating Temperature	-40°C ~ 85°C (TA)

Product Attribute	Attribute Value
Number of Elements	2
Number of Bits per Element	8
Mounting Type	Surface Mount
Logic Type	Transceiver, Non-Inverting
Input Type	-
Current - Output High, Low	32mA, 64mA
Base Product Number	74FCT16245

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.39.0001

Parts Introduction

CY74FCT16245CTPACT (1)

Manufacturer Part Number

CY74FCT16245CTPACT

Manufacturer

Texas Instruments

Introduction

The CY74FCT16245CTPACT is a high-performance, low-power, 8-bit, non-inverting, 3-state transceiver. This device is part of the 74FCT series and is designed for high-speed, high-drive applications.

Product Features and Performance

8-bit transceiver

Non-inverting operation

3-state output

High-speed performance

Low power consumption

Operating voltage range: 4.5V to 5.5V

Operating temperature range: -40°C to 85°C

Product Advantages

Optimized for high-speed, high-drive applications

Excellent noise immunity

Reduced power consumption

Key Reasons to Choose This Product

High-performance transceiver solution

Reliable and robust design

Suitable for a wide range of applications

Cost-effective option for your project

Quality and Safety Features

Compliant with industry standards

Rigorous quality control measures

Designed for reliable and safe operation

Compatibility

Compatible with a wide range of digital systems and devices

Application Areas

Suitable for use in high-speed digital systems, such as computer interfaces, industrial control equipment, and communication systems

Product Lifecycle

["The CY74FCT16245CTPACT is an obsolete product, meaning it is no longer in active production.","There may be alternative or equivalent models available from Texas Instruments or other manufacturers. Please contact our website's sales team for more information on suitable replacement options."]

Frequently Asked Questions(FAQ)

How does the CY74FCT16245CTPACT handle signal integrity in high-speed bidirectional bus applications compared to unidirectional buffers, and what design considerations are critical for minimizing crosstalk?: The CY74FCT16245CTPACT is a dual 8-bit non-inverting transceiver with 3-state outputs, enabling bidirectional data flow between two bus segments—a key advantage over unidirectional buffers that require additional control logic for direction management. Its low propagation delay and balanced output drive (32mA high, 64mA low) support stable signal levels even in distributed systems with moderate capacitive loading. However, due to its shared bus architecture, careful layout is essential: trace lengths on both sides of the device should be matched within ±100 mils to prevent skew-induced metastability, and termination resistors may be required at endpoints if line reflections become problematic at frequencies above 10 MHz. Unlike point-to-point buffers, the 16-bit parallel interface demands attention to return path continuity and ground plane integrity to mitigate crosstalk, particularly when switching multiple outputs simultaneously.

What are the thermal and electrical limitations when cascading multiple CY74FCT16245CTPACT devices in a multi-stage bus expansion, and how do output current capabilities affect fan-out calculations?: Cascading CY74FCT16245CTPACT units introduces cumulative propagation delays and increases power dissipation, especially when driving long traces or capacitive loads. Each device draws supply current based on switching activity, and with 32mA sourcing and 64mA sinking capability per output, maximum fan-out depends heavily on load characteristics. For example, driving eight standard CMOS inputs (assumed 10pF each) at full swing may exceed safe operating margins if multiple outputs transition concurrently; a rule of thumb is to limit fan-out to five CMOS gates under worst-case conditions. Thermal derating becomes relevant only in tightly packed systems without airflow, where junction temperatures could approach limits near 85°C ambient—unlikely in typical PCB layouts given the small 48-TSSOP footprint.

Can the CY74FCT16245CTPACT reliably interface between 5V and 3.3V logic families without level shifting, and what voltage thresholds ensure valid logic interpretation across these domains?: Yes, the CY74FCT16245CTPACT supports mixed-voltage operation within its 4.5V–5.5V supply range, allowing direct connection to 3.3V TTL or LVTTL signals without external translation circuitry. The input high-voltage threshold (VIH) is typically 2.0V at 5V VCC, meaning 3.3V inputs are safely interpreted as logic high. Similarly, the low-level threshold (VIL) is about 0.8V, ensuring compatibility with 3.3V logic lows. However, care must be taken not to exceed absolute maximum ratings—especially on inputs—and the driver side must remain within specified VOH/VOL levels under load. This makes it suitable for bridging legacy 5V systems with modern 3.3V microcontrollers, provided timing budgets accommodate added delay from the transceiver’s propagation characteristics (~3–5 ns typical).

How does the enable pin behavior differ between active-high and active-low configurations in the CY74FCT16245CTPACT, and why might designers choose one over the other in system integration?: The CY74FCT16245CTPACT features separate enable pins for each 8-bit bank (OEAB and OEBA), which can be driven high or low depending on the specific package variant—though most implementations use active-low enables. In active-low mode (OE asserted low), the corresponding outputs enter high-impedance state, isolating the bus segment during writes or reset cycles. Active-high enable would invert this logic but is less common in FCT series parts. Designers often prefer active-low enables because they align naturally with open-drain reset signals and simplify OR-ing of multiple enable sources. Choosing the wrong polarity during PCB layout can lead to unintended bus contention or floating inputs, so verification against the actual part’s truth table is critical regardless of convention.

What role does the 3-state output play in preventing bus contention when using the CY74FCT16245CTPACT in shared-bus topologies, and how does it compare to open-collector alternatives?: The 3-state outputs of the CY74FCT16245CTPACT allow individual port isolation by placing outputs in high-Z mode via the OE pins, effectively disconnecting the device from the bus without introducing leakage currents or signal degradation. This contrasts with open-collector configurations, which require pull-up resistors and exhibit slower rise times due to RC time constants. While open-collector buses offer inherent collision detection, they lack the fast, symmetric switching of the FCT’s push-pull outputs. The CY74FCT16245CTPACT thus provides better noise margin and speed in point-to-point or star-topology designs where arbitration is managed through software or dedicated control lines, avoiding the overhead of wired-AND protocols.

Are there any known reliability concerns or failure modes associated with repeated hot-plugging scenarios involving the CY74FCT16245CTPACT, and how should ESD protection be implemented around this component?: Hot-plugging risks arise primarily from voltage transients on unpowered lines connected to powered subsystems, potentially causing reverse current flow into CMOS inputs. The CY74FCT16245CTPACT has robust ESD protection (±2kV HBM per JESD22-A114), but this does not eliminate the need for system-level safeguards. To mitigate hot-plug damage, series resistors (e.g., 22Ω) on each I/O line help limit current spikes, while clamping diodes or TVS arrays at connectors provide additional protection. It's also advisable to ensure power sequencing respects the device’s VCC ramp rates (<10 ms recommended); abrupt voltage changes during insertion can trigger latch-up if substrate parasitics couple enough charge. These precautions apply equally to all 48-pin TSSOP variants of the 74FCT16245 family.

How does the propagation delay variation across temperature affect timing closure when using multiple CY74FCT16245CTPACT devices in synchronous designs, and what margins should be allocated?: Propagation delay in the CY74FCT16245CTPACT increases slightly with rising temperature due to reduced carrier mobility in silicon, though specifications show minimal shift across –40°C to 85°C. At worst case, tPHL/tPLH may vary by ±1.5 ns relative to room temperature performance. In multi-device chains, this compounds: a four-stage chain could accumulate up to 6 ns of skew under extreme thermal conditions. For reliable operation, engineers should allocate timing budgets conservatively—typically reserving 2× the datasheet’s max tpd value for critical paths—and verify setup/hold times under both cold and hot soak tests. Additionally, matching enable-to-output delays across banks minimizes inter-channel misalignment in parallel transfers.

What distinguishes the CY74FCT16245CTPACT from similar transceivers like the SN74LVCR16245ADGGR in terms of voltage tolerance and application suitability for automotive vs industrial environments?: While both the CY74FCT16245CTPACT and SN74LVCR16245ADGGR serve as 16-bit bidirectional transceivers, key differences emerge in voltage handling and environmental robustness. The CY74FCT16245CTPACT operates strictly within 4.5V–5.5V, making it ideal for legacy 5V industrial or telecom systems requiring deterministic performance. In contrast, the LVCR variant supports wider input voltages (up to 5.5V on inputs even when VCC = 3.3V), offering greater flexibility in mixed-voltage environments. Neither is AEC-Q100 qualified, so neither is inherently automotive-grade—but the LVCR’s lower quiescent current benefits battery-powered applications. Thus, selection hinges on whether your system prioritizes legacy compatibility (CY74FCT16245CTPACT) or broader interfacing capability (SN74LVCR16245ADGGR).

How should decoupling capacitors be sized and placed when routing power to the CY74FCT16245CTPACT in high-switching-density PCBs, and what inductance considerations dominate effective placement?: Effective decoupling for the CY74FCT16245CTPACT requires a combination of bulk capacitance (10µF tantalum or ceramic) near the board’s power entry and high-frequency bypass caps (0.1µF X7R MLCCs) within 1 cm of the VCC/GND pins. Given the device’s 32/64mA output swings and 16 parallel channels, simultaneous switching can induce transient currents exceeding 200 mA/ns during edge transitions. Loop inductance from remote mounting reduces effectiveness, so vias should flank capacitor pads directly beneath the IC. Ferrite beads are generally unnecessary unless isolating noisy sub-circuits, since the FCT series includes built-in slew-rate control. Always simulate PDN impedance below 1 ohm from 100 kHz to 100 MHz to avoid resonant dips that compromise stability under dynamic loads.

What are the implications of using substitutes such as the 74FCT16245ETPAG or 74FCT162245CTPAG instead of the CY74FCT16245CTPACT in existing designs, particularly regarding package footprint and electrical compatibility?: Substitutes like the 74FCT16245ETPAG (exposed pad TSSOP) or 74FCT162245CTPAG (same pinout, different enable labeling) share functional equivalence but diverge in mechanical and sometimes electrical details. The ETPAG variant includes thermal enhancement via an exposed pad, improving heat dissipation in dense layouts—beneficial if driving heavy loads continuously. Electrical parameters remain within TI’s family specs, so logic levels, thresholds, and timing match closely. However, note that the “245” vs “2245” suffix affects enable pin naming (OEBA vs OEA/B inversion), so firmware or schematic symbols must reflect correct polarity. Footprint compatibility is usually preserved, but always validate solder joint profiles and reflow profiles for exposed-pad packages to avoid voids affecting reliability.

Why might a designer select the CY74FCT16245CTPACT over discrete MOSFET-based bus switches for bidirectional level translation, despite higher unit cost?: Discrete MOSFET solutions introduce variable on-resistance, asymmetric rise/fall times, and limited drive strength, making them unsuitable for high-speed parallel interfaces. The CY74FCT16245CTPACT offers standardized, repeatable performance with defined propagation delays, symmetrical output impedance, and integrated 3-state control—critical for maintaining signal integrity in multi-drop busses. Moreover, its low quiescent current (typically <5 µA) and absence of body diode conduction reduce power loss in always-on segments. Though more expensive per unit, the total system cost diminishes due to simplified layout, fewer components, and reduced debugging overhead—making it preferable when reliability, speed, and ease of timing analysis outweigh bill-of-materials minimization.

How does moisture sensitivity level (MSL) classification impact storage and handling of CY74FCT16245CTPACT parts before assembly, and what precautions apply during wave soldering versus reflow processes?: The CY74FCT16245CTPACT carries an MSL 1 rating, indicating unlimited shelf life and no pre-drying requirement prior to reflow. This simplifies inventory management but mandates handling in clean, dry environments (<60% RH) to prevent condensation during thermal transitions. During reflow, peak temperature must stay below 260°C for ≤10 seconds to avoid package delamination; exceeding this accelerates bond wire fatigue. Wave soldering is generally avoided for TSSOP parts due to tombstoning risk, but if necessary, nitrogen-flushed ovens or controlled ramp rates (>1°C/s) help. Always follow IPC-J-STD-033 for bake-out procedures only if humidity exposure exceeds 30 days—rare given MSL 1 status.

What are the legal and regulatory considerations when sourcing CY74FCT16245CTPACT globally, including RoHS compliance, export classifications (ECCN), and substitution availability?: The CY74FCT16245CTPACT is RoHS3 compliant and exempt from REACH restrictions, facilitating global distribution without hazardous substance reporting burdens. Its ECCN is EAR99, classifying it as a commodity item with minimal export controls, easing international procurement. However, substitution risks exist: while alternatives like SN74LVCR16245ADGGR offer similar function, they may carry different ECCNs or regional availability constraints. Maintain traceability to authorized distributors to avoid counterfeit risks, especially given the part’s popularity in legacy systems. HTSUS 8542.39.0001 applies for customs purposes, confirming its status as an active electronic circuit.

How should enable timing be coordinated when integrating the CY74FCT16245CTPACT into a microcontroller-driven peripheral bus, and what pitfalls occur if OE assertion precedes valid data stabilization?: Enable signals (OEAB/OEBA) should assert no earlier than data inputs stabilize and de-assert after outputs complete valid transitions to prevent glitches or bus contention. If OE goes high mid-transition, outputs may briefly drive conflicting states until settled, violating setup/hold windows of downstream devices. Conversely, delaying OE too long extends bus occupation, increasing susceptibility to EMI-induced errors. Best practice involves aligning OE edges with clock boundaries in synchronous systems, using the same clock domain or adding small delays calibrated to tpd. Microcontroller code must enforce this sequence—never assume OE alone controls bus ownership without considering input timing.

Can the CY74FCT16245CTPACT be used in redundant or fail-operational architectures, and what diagnostics or redundancy mechanisms enhance fault tolerance?: The CY74FCT16245CTPACT itself lacks built-in diagnostic features like loopback or error flags, limiting native fault detection. However, it can support fail-operational systems when combined with external monitoring: for instance, parity checks on data lines paired with watchdog timers can detect silent corruption during transfers. Redundancy requires duplicate transceivers with voting logic, increasing pin count and complexity. Given its deterministic behavior and low jitter, it serves well as a reliable bridge in dual-path designs, though real-time health assessment depends entirely on host-system supervision. No internal registers expose status, so external GPIOs must track OE states and acknowledge signals to infer link integrity.

What factors determine whether the CY74FCT16245CTPACT meets timing requirements in PCIe Gen1-equivalent parallel backplane applications, and how does channel skew impact data validity?: PCIe Gen1 uses serial links, but parallel equivalents (e.g., 32-bit backplanes at 133 MHz) demand tight channel alignment. The CY74FCT16245CTPACT’s tpd variation across channels is typically ±0.5 ns, sufficient for backplanes under 15 cm if trace lengths are matched within ±25 mils. Skew beyond this causes bits to arrive outside receiver setup/hold windows, leading to bit errors. Unlike serial SerDes, parallel systems lack equalization, so physical layer discipline dominates. Use serpentine routing with controlled impedance (typically 50Ω single-ended) and minimize vias per channel. Even minor discontinuities increase ISI, degrading eye height—critical when pushing beyond 100 MHz clock frequencies.

How does the base product number 74FCT16245 influence derivative selection, and what subtle differences exist between CY74FCT16245CTPACT and CY74FCT16245ATPACT variants?: The base number 74FCT16245 defines core functionality across TI’s portfolio, but suffix letters denote packaging, temperature grade, and enable polarity. The CTPACT uses standard TSSOP with active-low enables and commercial temperature range (-40°C to 85°C). The ATPACT may imply automotive-grade qualification (though not explicitly stated here), potentially offering tighter electrical tolerances or extended testing—verify with latest datasheet. Both share identical logic equations and pinouts, so replacement is straightforward if environmental demands align. Always confirm revision codes (e.g., PBF vs PACT) to catch undocumented changes in newer revisions affecting reliability or performance.

What practical steps ensure successful first-pass layout completion when integrating the CY74FCT16245CTPACT into complex SoC peripherals, and how do signal integrity simulations inform final routing decisions?: Begin with a reference layout using TI’s recommended land patterns and stack-up guidelines, prioritizing short, matched-length nets for each 8-bit group. Simulate S-parameters or IBIS models to identify resonance peaks above 500 MHz that could couple noise into sensitive analog blocks. Route power rails wide enough to support 200 mA transient peaks, and place decoupling caps so loop area stays <5 mm². Avoid crossing split planes under the IC. Post-layout extraction reveals parasitic coupling missed in simulation; iterate until crosstalk (crosstalk > -30 dB acceptable) and impedance deviations (<10%) meet targets. Finally, perform corner-case thermal analysis to confirm junction temps stay below 125°C under worst-load conditions—critical for longevity in sealed enclosures.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments CY74FCT16245CTPACT

Product Attribute
Part Number	CY74FCT16245CTPVCT	CY74FCT16245CTPAC	CY74FCT16245CTPAC	CY74FCT16245ATPAC
Manufacturer	Texas Instruments	Cypress Semiconductor Corp	Texas Instruments	Texas Instruments
Output Type	-	Current - Unbuffered	Voltage - Buffered	-
Series	-	-	-	-
Logic Type	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Number of Bits per Element	-	-	-	-
Voltage - Supply	-	-	-	-
Input Type	-	-	-	Differential
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Number of Elements	-	-	-	-
Current - Output High, Low	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)

CY74FCT16245CTPACT Datasheet PDF

Download CY74FCT16245CTPACT pdf datasheets and Texas Instruments documentation for CY74FCT16245CTPACT - Texas Instruments.

HTML Datasheet: Cylindrical Battery Holders.pdf
PCN Obsolescence/ EOL: Cylindrical Battery Holders.pdf
PCN Packaging: TSSOP Carrier Tape Chg 1/Sep/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

Arch***ct

Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
FPGA***lorer88

Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
Nath***oleman

Jun 29, 2026

Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.

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