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Home Products Integrated Circuits (ICs)Logic - Buffers, Drivers, Receivers, Transceivers~~CY74FCT162501ETPAC~~

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CY74FCT162501ETPAC - Texas Instruments

Name: Texas Instruments CY74FCT162501ETPAC
Brand: Texas Instruments
SKU: CY74FCT162501ETPAC
Price: 0.515 USD
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: CY74FCT162501ETPAC

Manufacturer: Texas Instruments

Allelco Part Number: 98D-CY74FCT162501ETPAC

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 6,002 pcs available, New & Original

Parts Description: BUS TRANSCEIVER, FCT SERIES

Package: Bulk

Data sheet: -

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Unit Price: $1.402
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Quantity	Unit Price	Ext. Price
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200+	$0.543	$108.60
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1000+	$0.515	$515.00

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Specifications

CY74FCT162501ETPAC Tech Specifications
Texas Instruments - CY74FCT162501ETPAC technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - CY74FCT162501ETPAC

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Series	*

Product Attribute	Attribute Value
Package	Bulk
Base Product Number	74FCT162501

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	RoHS non-compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Affected
ECCN	EAR99
HTSUS	8542.39.0001

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the CY74FCT162501ETPAC that influence high-speed bus interface design, and how do they compare to standard logic families?: The CY74FCT162501ETPAC features a 3.3V supply voltage and operates with a propagation delay of approximately 4.5 ns at typical conditions, making it suitable for medium-speed bus applications. Compared to traditional 74LS or 74HC series logic, the FCT family offers significantly lower power consumption—around 20 mW per gate versus 10–15 mW for HC and 100+ mW for LS—while maintaining compatibility with TTL input levels. This balance enables reliable interfacing between mixed-voltage systems without level-shifting circuitry, reducing board complexity in 3.3V-dominated designs.

How does the CY74FCT162501ETPAC handle output drive strength, and what considerations arise when driving capacitive loads or multiple receivers?: The device provides a maximum output current of ±24 mA, which allows it to drive up to 20 CMOS loads or manage moderate capacitive switching without external buffering. When driving long traces or multiple inputs, the effective load increases due to distributed capacitance. A rule of thumb is to limit fanout to 10–15 devices unless a series termination resistor (e.g., 22–33 Ω) is used near the driver. For loads exceeding this threshold, adding a buffer stage or selecting a device with higher drive capability may be necessary to maintain signal integrity and timing margins.

In what scenarios should designers avoid using the CY74FCT162501ETPAC, and what alternative components might better serve those applications?: The CY74FCT162501ETPAC is not ideal for ultra-high-speed interfaces requiring sub-2 ns propagation delays or very low quiescent power, as newer technologies like 74ALVC or 74LVX offer faster switching with lower Vcc requirements. Additionally, its non-RoHS status restricts use in consumer or medical products manufactured after 2021. In such cases, TI’s 74LVC162501A or similar parts from ON Semiconductor or NXP provide comparable functionality while meeting RoHS and REACH standards.

What impact does temperature have on the timing performance of the CY74FCT162501ETPAC, and how should PCB layout mitigate thermal variations in industrial environments?: Operating temperature ranges from 0°C to 70°C (commercial grade), within which propagation delay can vary by ±15% depending on process corners. At elevated ambient temperatures, junction-to-ambient thermal resistance causes slight increases in delay, though this effect is secondary compared to process variation. To minimize skew and jitter, maintain consistent trace lengths between drivers and receivers, use ground planes under signal paths, and avoid placing heat-generating components near the IC. Thermal vias beneath the package also help stabilize local operating conditions.

Can the CY74FCT162501ETPAC safely operate with unpowered inputs during system reset sequences, and what protection mechanisms exist?: Yes, the device includes input clamping diodes that prevent latch-up when powered inputs exceed Vcc + 0.5V or fall below ground by more than 0.5V, provided the absolute maximum ratings are not violated. However, during system resets where only the receiver side is powered, input signals must remain within the specified voltage range to avoid excessive leakage currents or undefined states. Designers should ensure all unused inputs are tied to valid logic levels via pull-up or pull-down resistors rather than left floating.

How does the Moisture Sensitivity Level (MSL = 3) of the CY74FCT162501ETPAC affect storage and assembly handling, particularly in humid climates?: With an MSL rating of 3, the CY74FCT162501ETPAC must be stored in moisture barrier bags with desiccant and humidity indicator cards, and must undergo dry baking if exposed to ambient conditions beyond 60% relative humidity for over 168 hours. In tropical manufacturing environments, extended exposure prior to reflow soldering can lead to popcorning during thermal cycling. Standard JEDEC J-STD-033 guidelines recommend baking at 125°C for 24 hours before assembly if shelf life exceeds 168 hours post-opening.

What role does the base product number (74FCT162501) play in selecting compatible replacement parts, and why is it critical when sourcing the CY74FCT162501ETPAC?: The base number 74FCT162501 defines the core function—a 16-bit unidirectional bus transceiver with tri-state outputs—ensuring functional equivalence across manufacturers. When replacing the CY74FCT162501ETPAC, matching this base number guarantees pin-compatible alternatives from TI, ON Semi, or NXP. Deviating from this specification risks mismatched logic levels, timing characteristics, or packaging, leading to system-level failures. Always verify both base number and suffix (e.g., ETPAC indicating TSSOP-48 bulk pack) to preserve mechanical and electrical compliance.

What are the implications of the CY74FCT162501ETPAC’s ECCN classification (EAR99) for international procurement and export control?: Classified under EAR99, the CY74FCT162501ETPAC is generally exempt from strict U.S. export restrictions but still subject to general licensing requirements if shipped to certain countries or end-users. While most commercial applications face minimal barriers, defense, aerospace, or telecommunications projects involving foreign partners may require additional documentation. Designers should consult ITAR and EAR regulations before procuring or distributing the part in cross-border supply chains, especially given its integration into embedded control systems.

How does the tri-state output architecture of the CY74FCT162501ETPAC support bus sharing, and what precautions prevent contention during concurrent enable conditions?: The device uses independent enable pins (OE#) for each output bank, allowing multiple transceivers to share a common data bus without conflict as long as no more than one device drives the line at a time. However, simultaneous assertion of OE# on two devices creates a short-circuit condition between complementary outputs (e.g., A and B lines), potentially drawing 50–100 mA through the internal ESD structures. To prevent damage, ensure strict mutual exclusion via control logic or use open-drain configurations if bidirectional communication is required.

Why might a designer choose the CY74FCT162501ETPAC over a buffer-only alternative despite its transceiver functionality, and what cost-performance trade-offs emerge?: The CY74FCT162501ETPAC integrates both direction control and buffering in a single package, eliminating the need for separate direction registers or additional logic gates. This reduces BOM count and board space compared to cascading a buffer and decoder. While a dedicated buffer like the 74FCT16244 may offer slightly lower propagation delay (≈3.8 ns), the transceiver’s built-in direction management simplifies firmware overhead in microcontrollers handling bidirectional buses such as I²C, SPI, or custom parallel interfaces.

What is the significance of the HTSUS code (8542.39.0001) for customs clearance, and how does it affect import duties for the CY74FCT162501ETPAC?: The Harmonized Tariff Schedule of the United States (HTSUS) classification 8542.39.0001 designates the CY74FCT162501ETPAC as an "Electronic integrated circuit: other," typically resulting in duty rates between 0–4.9% depending on bilateral trade agreements. Accurate classification avoids customs delays, especially when importing into countries with strict semiconductor regulations. Misdeclaration could trigger audits or penalties, so always reference official HTS codes during procurement to ensure compliance and predictable logistics costs.

How does the lack of RoHS compliance affect lifecycle planning when integrating the CY74FCT162501ETPAC into new designs?: As a RoHS non-compliant component, the CY74FCT162501ETPAC contains restricted substances like lead in solder or cadmium in plating, making it unsuitable for EU and RoHS-regulated markets after December 2021. Designers must either transition to compliant equivalents (e.g., 74LVC162501A) or obtain exemptions under Article 7(3) of RoHS, which requires formal justification for critical functionality not available otherwise. This decision impacts obsolescence risk, regulatory audits, and potential redesign costs in long-lifecycle products.

What are the recommended decoupling practices for stable operation of the CY74FCT162501ETPAC in noisy digital environments?: Place a 0.1 µF ceramic capacitor as close as possible to each Vcc and GND pin pair, ideally within 5 mm, to suppress high-frequency noise on the 3.3V rail. For systems with dynamic current spikes during simultaneous switching (e.g., 16 outputs toggling together), add a bulk 10 µF tantalum or polymer capacitor near the IC group. Avoid sharing decoupling networks across multiple ICs; individual placement ensures localized stabilization and minimizes crosstalk-induced glitches.

How does the CY74FCT162501ETPAC compare to modern LVCMOS alternatives in terms of power-delay product, and what does this imply for battery-powered designs?: The CY74FCT162501ETPAC exhibits a power-delay product of approximately 135 pJ/gate (assuming 50% toggle rate), which is higher than contemporary LVCMOS devices like the 74LVC162501A (~45 pJ/gate). In portable or energy-constrained applications, this increased dissipation accelerates battery drain. While the FCT family remains useful for legacy compatibility, newer low-power variants offer superior efficiency without sacrificing speed, making them preferable for wearable electronics, IoT nodes, or mobile peripherals.

What testing procedures validate correct behavior of the CY74FCT162501ETPAC in production environments, especially for tri-state functionality?: Functional verification includes applying known data patterns to the A-bus, toggling OE# while monitoring B-bus outputs, and confirming high-impedance state with oscilloscope probes during deassertion. Automated test equipment can sweep input frequencies up to the rated maximum (typically 100 MHz) to check for setup/hold violations or glitching. Boundary scan (JTAG) tests may also validate interconnect integrity, but manual probing remains essential to confirm tri-state isolation under real-world loading conditions.

Can the CY74FCT162501ETPAC be used in hot-swap applications without additional protection circuitry?: Not without precautions. Hot insertion into a powered backplane can cause inrush currents due to parasitic capacitance charging through ESD diodes, potentially exceeding 100 mA transient peaks. Although the device tolerates brief overcurrent events, sustained surges risk degrading bond wires or triggering latch-up. Adding series resistors (22–100 Ω) at each output and using soft-start circuits in the host system mitigates these risks, aligning with IEC 61000-4-12 surge immunity standards.

What environmental certifications or restrictions apply to the CY74FCT162501ETPAC beyond RoHS and REACH, and how do they influence disposal or recycling?: Beyond RoHS and REACH, the part falls under standard electronic waste directives (WEEE) due to its lead-containing solder and plastic mold compound. Its absence of halogen-free materials may complicate recycling streams in facilities targeting green certifications. End-of-life disposal must comply with local e-waste laws, particularly in jurisdictions like California or the EU where hazardous material tracking is mandatory. Designers should document compliance status and consider transitioning to eco-friendly alternatives for sustainability reporting.

How should PCB stackup and layer assignment optimize signal integrity for the CY74FCT162501ETPAC in multi-drop bus topologies?: Route high-speed signals associated with the CY74FCT162501ETPAC on inner layers adjacent to solid ground planes to minimize loop inductance and radiation. Maintain controlled impedance (typically 50 Ω differential or 100 Ω single-ended) via trace width and dielectric thickness. Avoid routing near clock oscillators or RF sources to reduce coupling; instead, place the IC in a quiet zone with guard traces connected to ground. Terminate stubs shorter than λ/10 at source or load to prevent reflections, ensuring reliable data transfer up to the rated bandwidth.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments CY74FCT162501ETPAC

Product Attribute
Part Number	CY74FCT162501ATPAC	CY74FCT162543CTPAC	CY74FCT162543CTPAC	CY74FCT162543ETPVC
Manufacturer	Texas Instruments	Texas Instruments	Cypress Semiconductor Corp	Texas Instruments
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Series	-	-	-	-

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America	United States	5
America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
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Middle East	Israel	6

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1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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