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HomeProductsIntegrated Circuits (ICs)Linear - Amplifiers - Instrumentation, OP Amps, Buffer AmpsLM324DG4
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LM324DG4 - Texas Instruments

Manufacturer Part Number
LM324DG4
Manufacturer
Texas Instruments
Allelco Part Number
32D-LM324DG4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
84,840 pcs available, New & Original
Parts Description
IC OPAMP GP 4 CIRCUIT 14SOIC
Package
14-SOIC
Data sheet
LM324DG4.pdf

PCN Obsolescence/ EOL

EOL 22/May/2023.pdf
RoHs Status
ROHS3 Compliant
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In stock: 84840

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Specifications

LM324DG4 Tech Specifications
Texas Instruments - LM324DG4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - LM324DG4

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply Span (Min) 3 V
Voltage - Supply Span (Max) 30 V
Voltage - Input Offset 3 mV
Supplier Device Package 14-SOIC
Slew Rate 0.5V/µs
Series -
Package / Case 14-SOIC (0.154", 3.90mm Width)
Package Tube
Output Type -
Product Attribute Attribute Value
Operating Temperature 0°C ~ 70°C (TA)
Number of Circuits 4
Mounting Type Surface Mount
Gain Bandwidth Product 1.2 MHz
Current - Supply 1.4mA (x4 Channels)
Current - Output / Channel 40 mA
Current - Input Bias 20 nA
Base Product Number LM324
Amplifier Type General Purpose

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99

Frequently Asked Questions(FAQ)

What are the key thermal and electrical limitations of the LM324DG4 when used in single-supply configurations above 15 V?
The LM324DG4 is rated for supply voltages up to 30 V, making it suitable for single-supply operation from 15 V or higher. However, at elevated supply voltages, power dissipation becomes a critical factor due to its quiescent current of 1.4 mA per channel (total 5.6 mA for all four amplifiers). In continuous operation near maximum supply voltage without adequate heat sinking, junction temperature may exceed safe limits within a small PCB footprint. Designers should calculate worst-case power using Iq × (Vsupply - Vout_avg) and ensure derating based on ambient operating conditions, especially in enclosed systems where airflow is limited.
How does the input offset voltage drift of the LM324DG4 compare to precision op-amps like the OPA333, and what implications does this have for DC accuracy in sensor conditioning circuits?
The LM324DG4 exhibits an input offset voltage of 3 mV with a typical temperature drift of 7 µV/°C, which is significantly higher than precision amplifiers such as the OPA333 (offset voltage < 50 µV, drift < 0.2 µV/°C). For applications requiring microvolt-level resolution—such as direct thermocouple or strain-gage signal amplification—this offset variation over temperature can introduce unacceptable error margins. In contrast, for moderate gain stages amplifying mV-level signals with relaxed accuracy requirements, the LM324DG4 remains cost-effective and functionally adequate.
Can the LM324DG4 be safely used in high-impedance feedback networks involving capacitive loads greater than 100 nF?
Yes, but stability must be carefully evaluated. The LM324DG4 has an open-loop output impedance of approximately 70 Ω and a phase margin that degrades significantly under capacitive loading. While it can drive capacitive loads up to several hundred nanofarads in many cases, oscillation may occur if the feedback network includes large capacitors combined with long traces or parasitic inductance. Adding a small series resistor (e.g., 10–50 Ω) at the output improves phase margin and prevents ringing. This precaution is particularly important in unity-gain buffer configurations where loop gain peaks interact with the capacitive load.
What is the effective bandwidth limitation when the LM324DG4 is configured with a closed-loop gain of 100 in a non-inverting amplifier?
With a gain-bandwidth product of 1.2 MHz, the LM324DG4 achieves an approximate bandwidth of 12 kHz at a closed-loop gain of 100. This follows the standard GBW relationship: BW = GBW / |Gain|. While sufficient for audio or general-purpose signal conditioning, this bandwidth may limit performance in applications requiring faster settling or higher-frequency response. It's also worth noting that real-world performance can be further reduced by layout parasitics, input capacitance, and output swing constraints near rail limits.
How does the LM324DG4 perform in terms of output current sourcing versus sinking capabilities, and are there any internal protection features?
The LM324DG4 can source up to 40 mA per channel and sink up to 30 mA, with symmetric drive capability across most load types. However, unlike some modern op-amps, it lacks built-in short-circuit protection or thermal shutdown circuitry. Prolonged output short circuits can lead to excessive current draw and localized heating, potentially damaging the device. External current limiting or fusing may be necessary in industrial or automotive environments where fault conditions are anticipated.
Is the LM324DG4 suitable for driving low-impedance loads such as relay coils or LED arrays directly from multiple channels?
The LM324DG4 can drive moderately loaded loads like LEDs or small relays, provided total output current remains below 40 mA per channel and cumulative power stays within package limits. Driving multiple inductive loads simultaneously increases supply current transients and risks ground bounce due to shared return paths. For relay coils drawing tens of milliamps, consider using external transistors rather than relying solely on op-amp outputs. Additionally, flyback diodes must be implemented for inductive kickback protection unless isolated separately.
What precautions should be taken when cascading multiple LM324DG4 stages in a high-gain audio preamplifier?
Cascading multiple LM324DG4 stages introduces cumulative offset voltage, noise, and distortion. Given the 3 mV offset and slew rate of 0.5 V/µs, second-stage amplification of first-stage errors becomes significant at gains exceeding 50 dB. To mitigate this, use AC coupling between stages to block DC offsets, implement guarding techniques for high-impedance nodes, and avoid exceeding the slew rate during fast transients. Also, ensure sufficient PSRR across the 3 V to 30 V range, as power supply ripple couples into the output more noticeably in multi-stage designs.
How does the LM324DG4 compare to the LM358 in terms of speed, power, and pin compatibility when replacing one with the other in legacy designs?
The LM324DG4 offers a slightly improved gain-bandwidth product (1.2 MHz vs. 1 MHz) and lower input bias current (20 nA vs. 500 nA), making it marginally faster and better suited for higher-impedance sources. Both share the same 14-pin SOIC package and general pinout, enabling drop-in replacement in most cases. However, the LM358 has dual amplifiers while the LM324DG4 provides four, allowing consolidation of functionality. Power consumption is comparable (~1.4 mA per amp), though the LM324’s higher circuit count results in slightly higher absolute current. Always verify supply range and temperature specs match design constraints.
What impact does the 1.2 MHz gain-bandwidth product have on pulse response when used in peak detection or sample-and-hold circuits?
The 1.2 MHz bandwidth limits the LM324DG4’s ability to accurately reproduce sharp edges in transient signals. For a 10 ns rise time input, the minimum achievable rise time is roughly 0.35 / BW ≈ 290 ns, resulting in significant edge blurring. In peak detection circuits, this delays the op-amp’s response to sudden amplitude changes, reducing effective capture accuracy. Applications involving sub-microsecond pulses or high-speed envelope detection should consider faster alternatives like the TL07x family or dedicated comparator/op-amp hybrids.
Are there known issues with using the LM324DG4 in low-voltage battery-powered applications below 5 V?
The LM324DG4 operates down to 3 V, making it viable for low-voltage systems, but performance degrades near the rails. Output swing typically reaches only 1–1.5 V from each supply rail, reducing headroom in single-supply mode. Input common-mode range also excludes ground by about 1 V, so signals near 0 V cannot be processed accurately. These limitations restrict usability in ultra-low-power designs requiring rail-to-rail operation. For such cases, newer RRIO op-amps like the MCP600x series offer superior dynamic range and efficiency.
How does the moisture sensitivity level (MSL 1) influence storage and handling requirements for the LM324DG4 in production environments?
MSL 1 indicates unlimited shelf life under normal storage conditions (ambient temperature and humidity), meaning the LM324DG4 is not prone to moisture-induced defects during assembly. No baking is required before reflow soldering, simplifying inventory management. However, proper ESD precautions remain essential due to CMOS-like input structures. Handling should follow ANSI/ESD S20.20 standards regardless of MSL rating, especially in high-volume manufacturing settings where static discharge can cause latent failures.
What are the implications of the 0.5 V/µs slew rate when amplifying triangular waves above 20 kHz?
At frequencies beyond ~15 kHz, slew rate distortion becomes dominant in the LM324DG4. For a sinusoidal signal, maximum undistorted amplitude A is limited by SR = 2πfVp, yielding Vp_max ≈ 0.5 / (2π × 20,000) ≈ 4 mV peak-to-peak. Even smaller amplitudes suffer from waveform flattening at the peaks. This makes the LM324DG4 unsuitable for precision sine wave generation or filtering above 10–15 kHz without careful gain control. In audio or sensor contexts, this is often acceptable due to inherent signal smoothness.
Can the LM324DG4 be safely powered from an unregulated wall adapter without additional filtering if used in noisy environments?
The LM324DG4 has moderate power supply rejection ratio (PSRR), typically around 80 dB at low frequencies, which attenuates ripple but does not eliminate it entirely. Without local bypass capacitors close to the IC pins, switching noise from unregulated supplies can couple into the output through PSRR limitations. Implementing 0.1 µF ceramic decoupling capacitors placed within 5 mm of each supply pin reduces high-frequency noise coupling and stabilizes operation. Bulk capacitance (e.g., 10 µF tantalum) helps with low-frequency regulation but should complement, not replace, local bypassing.
What are realistic expectations for noise performance when using the LM324DG4 in precision voltage reference buffers?
The LM324DG4 exhibits input-referred noise densities around 40–60 nV/√Hz, depending on bandwidth. When buffered, this translates to output noise of approximately 40 nV/√Hz integrated over 10 Hz–10 kHz, which is generally too high for precision references requiring µV-level stability. For example, a 2.5 V reference amplified by the LM324DG4 would accumulate noise equivalent to tens of µV RMS, degrading measurement resolution. Higher-performance buffers like the REF5025 or LTZ1000-based solutions are preferable where absolute accuracy matters.
How does the 14-SOIC package affect thermal resistance and maximum allowable power dissipation at 70°C ambient?
The 14-SOIC package has a junction-to-air thermal resistance (θJA) of approximately 100–120 °C/W. Assuming maximum junction temperature of 150°C and TA = 70°C, allowable power dissipation is Pmax = (150 – 70)/100 ≈ 0.8 W. With four active channels drawing 1.4 mA each at 30 V, total quiescent power is 1.4 × 30 = 420 mW, well within this limit. However, any additional output loading or higher supply voltage increases risk. In practice, minimal self-heating occurs unless driving heavy resistive loads continuously.
What substitution options exist if the LM324DG4 is unavailable, and how do they compare functionally?
Substitutes include LM324MX/NOPB (lead-free tube), LM324AMX/NOPB (extended temp), LM324ADR2G (tape & reel), LM224DR2G (dual-channel variant), and LM324DR (standard reel). All maintain similar electrical characteristics but differ in packaging, temperature range, and RoHS compliance. For most consumer applications, LM324DR or LM324ADR2G serve as direct replacements. The AM version extends operation to –40°C to +85°C, useful in industrial settings. Ensure package type matches PCB footprint before substituting.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments LM324DG4

Product Attribute LM324DRG3 LM324APWRG4 LM324DE4 LM324DG
Part Number LM324DRG3 LM324APWRG4 LM324DE4 LM324DG
Manufacturer Texas Instruments Texas Instruments Texas Instruments onsemi
Voltage - Supply Span (Min) - - - -
Slew Rate - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Current - Input Bias - - - -
Voltage - Supply Span (Max) - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Output Type - Current - Unbuffered Voltage - Buffered -
Number of Circuits - - - -
Amplifier Type - - - -
Voltage - Input Offset - - - -
Current - Output / Channel - - - -
Current - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Gain Bandwidth Product - - - -

LM324DG4 Datasheet PDF

Download LM324DG4 pdf datasheets and Texas Instruments documentation for LM324DG4 - Texas Instruments.

PCN Obsolescence/ EOL
EOL 22/May/2023.pdf
PCN Design/Specification
Design 25/Feb/2022.pdf LMx24, LM2902, LM324 16/Jun/2022.pdf

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LM324DG4 Image

LM324DG4

Texas Instruments
32D-LM324DG4

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