About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersLM3S300-IGZ25-C2
LM3S300-IGZ25-C2 Image
LM3S300-IGZ25-C2 Image - 1
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

LM3S300-IGZ25-C2 - Texas Instruments

Manufacturer Part Number
LM3S300-IGZ25-C2
Manufacturer
Texas Instruments
Allelco Part Number
32D-LM3S300-IGZ25-C2
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,160 pcs available, New & Original
Parts Description
IC MCU 32BIT 16KB FLASH 48VQFN
Package
48-VQFN (7x7)
Data sheet
-
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 9160

Required fields are indicated by an asterisk (*)
Please send RFQ, we will respond immediately.

Quantity

Specifications

LM3S300-IGZ25-C2 Tech Specifications
Texas Instruments - LM3S300-IGZ25-C2 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - LM3S300-IGZ25-C2

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Supplier Device Package 48-VQFN (7x7)
Speed 25MHz
Series Stellaris® ARM® Cortex®-M3S 300
RAM Size 4K x 8
Program Memory Type FLASH
Program Memory Size 16KB (16K x 8)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 48-VFQFN Exposed Pad
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 36
Mounting Type Surface Mount
EEPROM Size -
Data Converters -
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M3
Connectivity I²C, Microwire, SPI, SSI, UART/USART
Base Product Number LM3S300

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

LM3S300-IGZ25-C2 Image
LM3S300-IGZ25-C2 (1)

Manufacturer Part Number

LM3S300-IGZ25-C2

Manufacturer

Texas Instruments

Introduction

The LM3S300-IGZ25-C2 is a discontinued embedded microcontroller from Texas Instruments' Stellaris® ARM® Cortex®-M3S 300 series. It features a 32-bit single-core ARM Cortex-M3 processor operating at 25MHz and offers a range of peripheral interfaces including I2C, SPI, SSI, UART/USART, and PWM.

Product Features and Performance

32-bit ARM Cortex-M3 core

25MHz operating speed

16KB FLASH program memory

4KB RAM

Peripheral interfaces including I2C, SPI, SSI, UART/USART, and PWM

Brown-out detection and reset, power-on reset (POR), and watchdog timer (WDT)

36 GPIO pins

Product Advantages

High-performance 32-bit ARM Cortex-M3 core

Extensive peripheral connectivity options

Low-power operation

Key Reasons to Choose This Product

Robust and reliable ARM Cortex-M3 architecture

Versatile peripheral support for a wide range of applications

Cost-effective solution for embedded systems

Quality and Safety Features

Operating temperature range of -40°C to 85°C

Surface mount package (48-VQFN)

Compliance with industry standards

Compatibility

The LM3S300-IGZ25-C2 is part of the Stellaris® ARM® Cortex®-M3S 300 series and is compatible with other products within this series.

Application Areas

The LM3S300-IGZ25-C2 is suitable for a variety of embedded applications, such as industrial control, home automation, and medical devices.

Product Lifecycle

The LM3S300-IGZ25-C2 is discontinued and no longer available for purchase from our website's sales team. However, there may be equivalent or alternative models available from Texas Instruments. Customers are advised to contact our website's sales team for more information on current product offerings and options.

Frequently Asked Questions(FAQ)

How does the LM3S300-IGZ25-C2 compare to other Stellaris ARM Cortex-M3 devices in terms of flash memory size and clock speed, and what are the implications for code density and execution latency in embedded applications?
The LM3S300-IGZ25-C2 features a 16KB flash memory and operates at a maximum clock speed of 25MHz, which is typical for entry-level Stellaris microcontrollers targeting cost-sensitive or low-to-moderate performance applications. Compared to higher-end variants like the LM3S9B96 (which offers up to 256KB flash and runs at 80MHz), this device trades memory capacity and processing throughput for reduced pin count and power consumption. For firmware with moderate complexity—such as simple sensor interfaces or basic control loops—the 16KB flash may be sufficient if code optimization techniques like compiler flag tuning and dead code elimination are applied. However, any application requiring complex algorithms or extensive data logging will likely exceed this limit, necessitating a reevaluation toward larger-memory derivatives. The 25MHz clock also imposes a ceiling on interrupt response time; for example, worst-case interrupt latency can approach 40 microseconds, which may be acceptable for non-real-time tasks but problematic in systems requiring sub-10μs responsiveness.
What is the significance of the LM3S300-IGZ25-C2’s voltage supply range of 3V to 3.6V, and how should designers account for this when interfacing with legacy 5V logic peripherals?
The LM3S300-IGZ25-C2 operates within a nominal supply voltage of 3.3V (±10%), making it incompatible with direct 5V logic signals without level shifting. While some GPIO pins support Schmitt-trigger inputs and tolerate brief excursions beyond VDD + 0.3V, sustained exposure to 5V levels risks violating absolute maximum ratings and degrading reliability over time. In mixed-voltage designs, designers must implement bidirectional level translators such as the TXB0108 or discrete MOSFET-based shifters. Additionally, internal pull-up/pull-down resistors on I/O lines are disabled by default and cannot compensate for 5V tolerance—thus external configuration is essential. Failure to isolate 5V domains could result in latch-up events or permanent damage, particularly during hot-plug scenarios common in industrial environments.
Can the LM3S300-IGZ25-C2 be used in automotive applications given its temperature rating of -40°C to 85°C, and what additional considerations apply beyond datasheet specifications?
Although the LM3S300-IGZ25-C2 is rated for commercial temperature ranges from -40°C to 85°C, automotive-grade operation typically demands qualification per AEC-Q100 Grade 2 standards, which include accelerated life testing, EMC robustness, and functional safety validation not covered in standard industrial certifications. Furthermore, while the device itself meets JEDEC moisture sensitivity level 3 (168-hour bake requirement), automotive platforms often require conformal coating and stricter assembly process controls. Power integrity becomes critical at temperature extremes—decoupling capacitors near VDD/VSS must be selected with stable capacitance values across temperature (e.g., X7R rather than X5R). Lastly, firmware must incorporate watchdog timers and brown-out detection to handle voltage droops during cold starts, leveraging the built-in peripherals effectively.
How does the 48-VQFN package of the LM3S300-IGZ25-C2 influence thermal management and PCB layout compared to larger QFN packages, and what soldering risks should engineers anticipate?
The 48-pin VQFN package measures just 7mm x 7mm with an exposed thermal pad underneath, enabling compact board footprints ideal for space-constrained designs. However, the small size limits heat dissipation capability; under continuous full-load operation, junction temperatures may rise significantly above ambient unless adequate copper pour and vias are implemented beneath the thermal pad. Designers should allocate at least 2–4 oz copper on adjacent layers and use multiple stitching vias (minimum eight) to connect the thermal pad to ground planes. During reflow soldering, the large thermal mass increases risk of tombstoning on adjacent components, especially fine-pitch passives. IPC-7351 land patterns must be followed precisely, and preheating profiles should ramp slowly through the glass transition region of FR4 substrates to minimize warpage-induced defects.
What role do the integrated peripherals—specifically UART/USART, SSI/SPI, and I2C—play in simplifying system design when using the LM3S300-IGZ25-C2, and how many simultaneous communications channels can be active?
The LM3S300-IGZ25-C2 includes one UART/USART module, one SSI (Synch Serial Interface, compatible with SPI), one I2C interface, and one Microwire/UART combination, providing flexible communication options without requiring external transceivers. While all four can be configured simultaneously in software, only one instance of each protocol type can operate concurrently due to shared bus arbitration logic. For example, the SSI module can function as master or slave in full-duplex mode, supporting clock rates up to 12 Mbps—adequate for most sensor networks. However, resource contention may arise when handling high-frequency data streams, so developers should prioritize peripheral assignments during early architecture planning. Interrupt-driven DMA is not supported on this device, so CPU overhead increases linearly with baud rate, potentially impacting real-time responsiveness.
Given that the LM3S300-IGZ25-C2 has only 4KB of RAM, what types of application workloads are feasible, and how does memory partitioning affect RTOS deployment?
With 4KB of SRAM, the LM3S300-IGZ25-C2 is best suited for lightweight tasks such as polling-based sensor acquisition, state machines, or minimal protocol stacks like Modbus RTU over UART. Deploying a full-featured RTOS such as FreeRTOS would consume significant stack and heap space; for instance, a task with 128 bytes of local variables plus context switching metadata may occupy nearly 300 bytes alone. Developers must carefully manage memory allocation, avoid dynamic allocation at runtime, and use static pools wherever possible. Additionally, interrupt service routines (ISRs) should be kept short to prevent blocking foreground tasks. Firmware updates via serial bootloaders are possible but limited by flash write cycles (~10k for standard flash), requiring wear-leveling strategies for frequently modified data blocks.
Is the LM3S300-IGZ25-C2 suitable for battery-powered IoT edge nodes, and what power-saving techniques leverage its onboard peripherals?
Yes, the LM3S300-IGZ25-C2 can support ultra-low-power IoT deployments, though its 25MHz core limits deep-sleep current savings compared to newer ultra-low-power MCUs. The device includes a sleep mode where the CPU halts but retains RAM and peripheral states, drawing approximately 1.2mA at 3.3V during active operation—modest but not negligible for coin-cell applications. To extend battery life, developers should utilize the watchdog timer to wake periodically, disable unused peripherals via clock gating, and reduce core frequency using PLL bypass modes. The brown-out reset circuitry helps prevent brownout-induced corruption during voltage sag events, enhancing reliability in fluctuating supply conditions. However, without integrated ADCs or comparators, analog signal conditioning must occur externally, adding quiescent current to the overall system budget.
How does the absence of an onboard ADC in the LM3S300-IGZ25-C2 affect analog sensing architectures, and what alternative solutions preserve signal integrity?
The LM3S300-IGZ25-C2 lacks any built-in analog-to-digital converters, requiring external precision ADCs such as the ADS7885 (12-bit, SPI interface) or MCP3201 for voltage measurement applications. When selecting external converters, engineers must consider reference stability, sampling rate versus noise immunity trade-offs, and timing alignment with digital buses. For galvanic isolation requirements in industrial settings, optocoupler-based isolators like the AMC1301 provide both signal transmission and ground separation, albeit at increased component count and cost. Alternatively, delta-sigma modulators with serial output offer superior resolution over SAR types but demand careful layout to avoid quantization noise coupling into sensitive analog traces. Regardless of choice, decoupling networks near ADC power pins must suppress high-frequency switching noise generated by the MCU’s digital switching edges.
What debugging and programming tools are officially supported for the LM3S300-IGZ25-C2, and how do they impact development timeline estimates?
Texas Instruments provides CCS (Code Composer Studio) and UniFlash as primary development environments, with support for on-chip debug via SWD (Serial Wire Debug). No JTAG is available due to pin constraints, so debug access consumes two GPIO pins (SWDIO and SWCLK). Flash programming requires erasing sectors before writing, which adds latency during iterative development phases; sector erase times can exceed 50ms for 4KB blocks. Production programming relies on parallel flashing jigs or automated test fixtures, increasing OPEX if custom hardware is needed. Third-party toolchains like Keil MDK are compatible but lack official TI driver libraries, potentially slowing integration of proprietary peripherals like PWM generators or watchdog timers.
How does the LM3S300-IGZ25-C2 compare to modern Arm Cortex-M0+ parts in terms of power efficiency and feature parity for new designs?
The LM3S300-IGZ25-C2 predates widespread adoption of Cortex-M0+ cores, resulting in less aggressive power management and lower clock scalability. Modern M0+ chips such as the nRF52832 or STM32L0 series achieve active-mode currents below 100µA/MHz and support stop modes under 1µA, whereas the LM3S300 draws several mA even at idle. Additionally, newer devices integrate more advanced peripherals (e.g., capacitive touch, USB, BLE), reducing bill-of-materials costs for connected applications. While the LM3S300 remains viable for legacy system upgrades or educational projects, new designs targeting energy harvesting or always-on sensors should prioritize contemporary architectures offering better EEMBC benchmarks and silicon-proven IP blocks.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments LM3S300-IGZ25-C2

Product Attribute LM3S300-IGZ25-C2T LM3S300-EGZ25-C2 LM3S300-EGZ25-C2T LM3S300-IQN25-C2
Part Number LM3S300-IGZ25-C2T LM3S300-EGZ25-C2 LM3S300-EGZ25-C2T LM3S300-IQN25-C2
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Core Processor - - - -
Program Memory Type - - - -
Program Memory Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of I/O - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Connectivity - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Speed - - - -
Data Converters - - - -
EEPROM Size - - - -
Oscillator Type - - - -
RAM Size - - - -
Core Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Peripherals - - - -

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
LM3S300-IGZ25-C2 Image

LM3S300-IGZ25-C2

Texas Instruments
32D-LM3S300-IGZ25-C2

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB