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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~LM3S300-IGZ25-C2T~~

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LM3S300-IGZ25-C2T - Texas Instruments

Name: Texas Instruments LM3S300-IGZ25-C2T
Brand: Texas Instruments
SKU: LM3S300-IGZ25-C2T
Availability: InStock
Rating: 5 (5 reviews)

Manufacturer Part Number: LM3S300-IGZ25-C2T

Manufacturer: Texas Instruments

Allelco Part Number: 98D-LM3S300-IGZ25-C2T

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 3,703 pcs available, New & Original

Parts Description: IC MCU 32BIT 16KB FLASH 48VQFN

Package: 48-VQFN (7x7)

Data sheet: -

RoHs Status: ROHS3 Compliant

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In stock: 3703

Specifications

LM3S300-IGZ25-C2T Tech Specifications
Texas Instruments - LM3S300-IGZ25-C2T technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - LM3S300-IGZ25-C2T

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - Supply (Vcc/Vdd)	3V ~ 3.6V
Supplier Device Package	48-VQFN (7x7)
Speed	25MHz
Series	Stellaris® ARM® Cortex®-M3S 300
RAM Size	4K x 8
Program Memory Type	FLASH
Program Memory Size	16KB (16K x 8)
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT
Package / Case	48-VFQFN Exposed Pad
Package	Tape & Reel (TR)

Product Attribute	Attribute Value
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Number of I/O	36
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	-
Core Size	32-Bit Single-Core
Core Processor	ARM® Cortex®-M3
Connectivity	I²C, Microwire, SPI, SSI, UART/USART
Base Product Number	LM3S300

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Frequently Asked Questions(FAQ)

What are the key architectural advantages of the LM3S300-IGZ25-C2T for low-complexity embedded control applications?: The LM3S300-IGZ25-C2T integrates an ARM Cortex-M3 core with deterministic interrupt handling and a single-cycle 32-bit multiplier, enabling efficient execution of control algorithms at 25MHz without requiring external memory. Its Harvard architecture with separate instruction and data buses reduces contention, allowing sustained throughput in real-time tasks such as sensor polling or motor control loops, while the 4KB RAM supports stack-intensive operations common in RTOS-based designs.

How does the internal oscillator in the LM3S300-IGZ25-C2T impact system design and timing accuracy?: The LM3S300-IGZ25-C2T features a factory-trimmed internal RC oscillator that eliminates the need for an external crystal, reducing BOM cost and board space. However, its ±1% accuracy over temperature and voltage makes it suitable only for asynchronous communication protocols like UART where baud rate tolerance is manageable. For time-critical applications such as PWM generation or precise event timing, an external crystal may still be required despite the internal oscillator’s convenience.

Can the LM3S300-IGZ25-C2T support multiple communication interfaces simultaneously without resource conflicts?: Yes, the LM3S300-IGZ25-C2T provides independent peripheral modules including two SSI/SPI controllers, one I2C, one Microwire, and two UART/USART channels, all accessible via distinct register sets and DMA-capable channels. This allows concurrent operation—for example, SPI for display communication, I2C for sensor interfacing, and UART for debug logging—without CPU-intensive bit-banging, though pin multiplexing must be carefully managed due to the 36 I/O limit.

What are the implications of the 16KB Flash and 4KB RAM sizing in the LM3S300-IGZ25-C2T for firmware development?: The 16KB Flash in the LM3S300-IGZ25-C2T constrains code size, making it ideal for lean firmware such as bootloaders, simple HMI controllers, or protocol translators, but insufficient for complex stacks like TCP/IP or large RTOS kernels. The 4KB RAM limits dynamic allocation and deep call stacks; developers should optimize data structures and avoid recursive algorithms. Linker scripts must prioritize placement of frequently accessed variables in tightly coupled memory regions to mitigate latency.

How does the LM3S300-IGZ25-C2T handle power-on and brown-out conditions compared to discrete supervisor circuits?: The LM3S300-IGZ25-C2T integrates Power-On Reset (POR) and Brown-Out Detect (BOD) circuitry that monitors Vdd within the 3V to 3.6V operating range. The BOD typically triggers at around 2.7V, holding the device in reset until voltage stabilizes, which reduces reliance on external voltage supervisors. However, for systems with slow power ramp rates or noisy supplies, additional external monitoring may be warranted to ensure reliable startup, especially in industrial environments.

Is the LM3S300-IGZ25-C2T suitable for battery-powered applications, and what low-power modes are available?: While the LM3S300-IGZ25-C2T lacks dedicated deep sleep modes found in newer MCUs, it supports sleep and deep-sleep states that disable the CPU and peripherals while retaining RAM content. In deep-sleep, current consumption drops to microampere levels, but wake-up latency and peripheral availability are limited. For battery-operated designs, careful clock gating and peripheral shutdown sequencing are essential, though more advanced power management MCUs may offer better efficiency for long-life applications.

How does the 48-VQFN package of the LM3S300-IGZ25-C2T influence PCB layout and thermal performance?: The 48-VQFN (7x7mm) package with an exposed pad on the LM3S300-IGZ25-C2T requires a grounded thermal pad on the PCB to ensure both electrical connectivity and heat dissipation. Proper stencil design and reflow profiling are critical to avoid voids under the pad, which can lead to hotspots during sustained operation. The small footprint benefits space-constrained designs, but signal integrity must be maintained with controlled impedance traces for high-speed digital lines and adequate decoupling near power pins.

What real-world performance can be expected from the PWM module in the LM3S300-IGZ25-C2T when driving inductive loads?: The LM3S300-IGZ25-C2T includes a 16-bit PWM generator capable of producing frequencies up to 12.5MHz (at 25MHz system clock) with adjustable dead-band insertion, useful for H-bridge motor control. However, the lack of integrated gate drivers means external FETs and flyback protection are necessary for inductive loads. Duty cycle resolution is sufficient for smooth speed control, but switching losses and EMI must be managed externally due to the MCU’s limited output drive strength.

How does the LM3S300-IGZ25-C2T compare to the STM32F103 series in terms of peripheral integration and development ecosystem?: The LM3S300-IGZ25-C2T offers comparable core performance and similar peripheral sets (SPI, I2C, UART, PWM) to the STM32F103, but lacks advanced features like a built-in ADC or USB interface. While TI provides StellarisWare libraries and Keil/IAR support, the STM32 ecosystem benefits from broader open-source tooling and community resources. For cost-sensitive designs without analog requirements, the LM3S300-IGZ25-C2T remains viable, but migration paths are limited due to TI’s discontinuation of the Stellaris line.

What are the risks of using the internal flash for frequent firmware updates in the LM3S300-IGZ25-C2T?: The 16KB Flash in the LM3S300-IGZ25-C2T has a typical endurance of 10,000 write/erase cycles, which can be exceeded in applications requiring frequent field updates or data logging to flash. Without wear-leveling algorithms or external non-volatile storage, repeated writes to the same sectors may lead to premature failure. For update-heavy use cases, consider reserving a bootloader section and minimizing in-application programming, or supplement with external EEPROM or FRAM.

Can the LM3S300-IGZ25-C2T operate reliably in automotive under-hood environments given its -40°C to 85°C rating?: The LM3S300-IGZ25-C2T is rated for industrial temperature ranges (-40°C to 85°C), making it suitable for many automotive auxiliary systems such as cabin controls or lighting modules. However, it lacks AEC-Q100 qualification, so it is not recommended for safety-critical or engine-compartment applications where extended temperature cycling, vibration, and EMI resilience are required. Designers should validate long-term reliability under actual operating conditions if used in non-certified automotive roles.

How does the absence of an integrated ADC in the LM3S300-IGZ25-C2T affect sensor interfacing strategies?: The LM3S300-IGZ25-C2T does not include an on-chip ADC, requiring external analog-to-digital converters for sensor signal acquisition. This increases component count and board complexity but allows selection of higher-resolution or faster ADCs tailored to the application. SPI or I2C-based ADCs can leverage the MCU’s peripheral interfaces, though sampling synchronization and latency must be managed in software, potentially impacting real-time response in closed-loop control systems.

What debug and development tools are compatible with the LM3S300-IGZ25-C2T, and are they still supported?: The LM3S300-IGZ25-C2T supports JTAG and SWD debugging through standard ARM Cortex-M3 interfaces, compatible with tools like TI’s ICDI, Segger J-Link, and open-source OpenOCD setups. However, as the Stellaris family has been superseded by TI’s Tiva C and SimpleLink MCUs, long-term toolchain support and software updates are limited. Legacy projects may require archived SDKs, and new designs should evaluate migration feasibility to supported platforms.

How does the LM3S300-IGZ25-C2T handle interrupt latency in multitasking environments?: The ARM Cortex-M3 core in the LM3S300-IGZ25-C2T features a Nested Vectored Interrupt Controller (NVIC) with configurable priority levels and tail-chaining, reducing interrupt latency to as low as 12 cycles. This enables responsive handling of time-sensitive events such as encoder pulses or communication timeouts. In RTOS contexts, preemption thresholds can be tuned to balance task responsiveness and system stability, though the single-core architecture limits true parallelism.

What are the best practices for decoupling and power integrity on the LM3S300-IGZ25-C2T?: The LM3S300-IGZ25-C2T requires a 100nF ceramic capacitor placed within 2mm of each Vdd pin and a 1–10µF bulk capacitor near the power entry point to suppress high-frequency noise and voltage droop during switching events. The exposed pad must be soldered to a grounded copper pour with multiple vias to enhance thermal and electrical performance. Poor decoupling can lead to erratic resets or communication glitches, especially when driving capacitive loads or operating near the 3.6V upper limit.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments LM3S300-IGZ25-C2T

Product Attribute
Part Number	LM3S300-EGZ25-C2T	LM3S300-IGZ25-C2	LM3S300-EGZ25-C2	LM3S300-IQN25-C2T
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Oscillator Type	-	-	-	-
Number of I/O	-	-	-	-
Core Size	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Data Converters	-	-	-	-
RAM Size	-	-	-	-
EEPROM Size	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Series	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Program Memory Size	-	-	-	-
Speed	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Core Processor	-	-	-	-
Peripherals	-	-	-	-
Connectivity	-	-	-	-
Program Memory Type	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad

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America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
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