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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersLM3S301-EGZ20-C2
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LM3S301-EGZ20-C2 - Texas Instruments

Manufacturer Part Number
LM3S301-EGZ20-C2
Manufacturer
Texas Instruments
Allelco Part Number
98D-LM3S301-EGZ20-C2
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,258 pcs available, New & Original
Parts Description
IC MCU 32BIT 16KB FLASH 48VQFN
Package
48-VQFN (7x7)
Data sheet
-
RoHs Status
ROHS3 Compliant
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In stock: 15258

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Specifications

LM3S301-EGZ20-C2 Tech Specifications
Texas Instruments - LM3S301-EGZ20-C2 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - LM3S301-EGZ20-C2

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Supplier Device Package 48-VQFN (7x7)
Speed 20MHz
Series Stellaris® ARM® Cortex®-M3S 300
RAM Size 2K x 8
Program Memory Type FLASH
Program Memory Size 16KB (16K x 8)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 48-VFQFN Exposed Pad
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 105°C (TA)
Number of I/O 33
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 3x10b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M3
Connectivity Microwire, SPI, SSI, UART/USART
Base Product Number LM3S301

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when using the LM3S301-EGZ20-C2 in a low-power embedded system requiring 3.3V operation?
The LM3S301-EGZ20-C2 operates within a supply voltage range of 3V to 3.6V, making it suitable for 3.3V systems without regulation. Its ARM Cortex-M3 core runs at up to 20MHz, delivering moderate processing throughput with relatively low power consumption. However, the 16KB flash memory limits code capacity, requiring efficient firmware design. With only 2K x 8 bytes of RAM, dynamic allocation must be carefully managed. These constraints favor applications where code size is predictable and memory footprint is tightly controlled, such as sensor nodes or control loops, rather than complex state machines or large lookup tables.
How does the LM3S301-EGZ20-C2 compare to newer Cortex-M4-based MCUs in terms of signal acquisition and real-time control capabilities?
Unlike Cortex-M4 devices that include a floating-point unit (FPU), the LM3S301-EGZ20-C2’s Cortex-M3 lacks hardware FPU support, which can increase latency and software overhead for floating-point operations. While it features three 10-bit ADCs, offering basic analog input resolution, its 20MHz clock speed limits interrupt response time and data throughput compared to faster M4 cores. For simple sensor reading with minimal computation—such as temperature monitoring or basic motor feedback—the LM3S301 may suffice. However, for higher-resolution signal processing or control algorithms involving math-intensive calculations, a Cortex-M4 variant would provide better real-time performance and lower CPU load.
What design considerations apply when integrating the LM3S301-EGZ20-C2 into a compact PCB layout with limited routing space?
The LM3S301-EGZ20-C2 uses a 48-VQFN package measuring 7x7 mm with an exposed thermal pad, which helps with heat dissipation but demands precise PCB layout. The small footprint allows high component density, yet trace routing near the IC must avoid crosstalk, especially for high-speed signals like SPI or UART. Decoupling capacitors should be placed within 2 mm of the VDD pins due to the tight power integrity requirements of the internal oscillator and digital logic. Additionally, the exposed pad must be properly soldered and connected to a solid ground plane to ensure both electrical and thermal reliability.
Can the LM3S301-EGZ20-C2 reliably drive external loads such as relays or LEDs directly from its GPIO pins?
The LM3S301-EGZ20-C2 provides 33 general-purpose I/O pins, each capable of sourcing or sinking up to 8 mA under typical 3.3V conditions. While sufficient for driving LEDs with appropriate current-limiting resistors, direct connection to inductive loads like relays is not recommended due to back-EMF risks. A flyback diode and transistor driver stage are necessary to protect the MCU. In practice, GPIOs used for output should be configured with open-drain or push-pull modes depending on the load type, and software debouncing should be implemented for mechanical switches.
What are the implications of the LM3S301-EGZ20-C2’s internal oscillator for timing-critical applications?
The device relies on an internal oscillator rather than an external crystal, which simplifies PCB layout but introduces potential timing inaccuracies. Internal RC oscillators typically have ±1% to ±2% frequency tolerance over temperature and voltage variations. This makes the LM3S301-EGZ20-C2 unsuitable for applications requiring precise timing, such as USB communication or high-resolution PWM generation. If tighter timing is needed, an external 32.768 kHz crystal for RTC or a precision oscillator may be required, though this adds cost and board space.
How does the flash memory architecture of the LM3S301-EGZ20-C2 affect firmware development and update strategies?
With 16KB of non-volatile flash memory organized as 16K x 8 bits, the LM3S301-EGZ20-C2 supports in-system programming via JTAG or SWD interfaces. However, flash write cycles are limited to approximately 10,000 erase/write cycles, so frequent firmware updates can degrade reliability. Developers should implement wear leveling or minimize flash writes through configuration storage in EEPROM (though none is available here) or use external serial flash for data logging. Bootloader designs must account for flash sector sizes, typically 1KB blocks, to enable partial updates without full chip reflash.
Is the LM3S301-EGZ20-C2 suitable for automotive-grade environments requiring extended temperature ranges?
The LM3S301-EGZ20-C2 operates over -40°C to +105°C, meeting industrial temperature standards but falling short of automotive AEC-Q100 qualification. While acceptable for non-automotive industrial or commercial embedded systems, it may not pass rigorous automotive reliability testing. If deployment includes vehicles or harsh environments with thermal cycling, shock, or vibration, additional qualification testing or a certified automotive MCU should be considered. Otherwise, for factory automation or outdoor sensors, the specified temperature range is adequate.
What peripheral combination makes the LM3S301-EGZ20-C2 ideal for simple sensor data collection and local actuation?
The LM3S301-EGZ20-C2 integrates three 10-bit ADCs, allowing simultaneous sampling of analog inputs such as thermistors or pressure sensors. Paired with UART, SPI, and SSI interfaces, it can communicate with external sensors or display modules efficiently. The presence of PWM outputs enables motor control or LED dimming, while watchdog timers enhance system robustness. Together, these peripherals make the LM3S301-EGZ20-C2 well-suited for standalone environmental monitors or actuator controllers where centralized processing is unnecessary and cost must be minimized.
How should developers handle interrupt latency when using multiple peripheral drivers on the LM3S301-EGZ20-C2?
As a single-core Cortex-M3 running at 20MHz, the LM3S301-EGZ20-C2 has inherent interrupt latency of about 12–16 cycles (~0.6–0.8 µs). With nested interrupts enabled and proper priority assignment, critical events like ADC conversions or UART timeouts can be serviced promptly. However, heavy ISR routines may block other interrupts, leading to missed deadlines. To manage this, keep ISRs short, defer processing to tasks, and avoid blocking calls inside interrupt context. Prioritize peripherals based on application needs—e.g., assign higher priority to motor encoder inputs over status LEDs.
What are the power-up sequencing requirements for stable operation of the LM3S301-EGZ20-C2?
The LM3S301-EGZ20-C2 requires stable VDD between 3.0V and 3.6V during reset. Power should ramp up gradually to avoid inrush currents, and a power-on-reset (POR) circuit ensures clean initialization. BOD (brown-out detect) is enabled by default, halting execution if voltage drops below ~2.7V. Decoupling capacitors (typically 100nF ceramic) near each power pin suppress noise, particularly important given the internal oscillator’s sensitivity. Without external crystals, no additional timing components are needed, simplifying startup logic.
Can the LM3S301-EGZ20-C2 support USB connectivity natively?
No, the LM3S301-EGZ20-C2 does not include native USB hardware peripherals. While USB protocol could theoretically be implemented in software (bit-banging), it would consume significant CPU cycles and is impractical at 20MHz. Therefore, USB host or device functionality must be handled externally via a companion chip or routed through one of the UART/SPI ports using a USB-to-serial bridge. This limits the LM3S301-EGZ20-C2 to non-USB applications unless augmented with additional ICs.
What are the limitations of the RAM size when implementing finite state machines or buffering streaming data?
With only 2K x 8 bytes (2KB) of SRAM, the LM3S301-EGZ20-C2 imposes strict constraints on runtime data structures. Buffering even modest sensor streams—such as 100 samples of 16-bit values—consumes over 200 bytes alone. Complex state machines with large context arrays or dynamic memory allocation are infeasible. Developers must preallocate static buffers, use stack-based variables sparingly, and optimize data types. Real-time logging or packet buffering should be offloaded to external memory if required.
How does the absence of external memory interface impact system scalability?
The LM3S301-EGZ20-C2 lacks a dedicated external memory controller (EMIF), meaning it cannot interface directly with parallel NOR/NAND flash or SDRAM. All program and data storage must reside internally or via serial interfaces like SPI. While SPI-connected flash chips can extend code storage, they introduce higher latency and lower throughput compared to parallel access. This architecture favors small-footprint, self-contained systems rather than expandable platforms, limiting the LM3S301-EGZ20-C2 to embedded tasks with bounded memory needs.
Is the LM3S301-EGZ20-C2 compatible with modern IDEs and debugging tools?
Yes, the LM3S301-EGZ20-C2 supports standard ARM Cortex-M3 debug interfaces including SWD and JTAG. It is supported by Keil MDK, IAR Embedded Workbench, and open-source toolchains like GCC with OpenOCD. Flash programming is facilitated through TI’s Code Composer Studio or third-party programmers. Breakpoints, watchpoints, and real-time variable monitoring are available, enabling effective development and validation workflows typical of ARM-based microcontrollers.
What role do the built-in peripherals like WDT and POR play in system reliability?
The watchdog timer (WDT) automatically resets the MCU if software fails to periodically reload it, preventing hangs from infinite loops or deadlocks. The power-on-reset (POR) and brown-out detection (BOD) ensure clean startups and prevent erratic behavior during voltage transients. Combined with clock monitoring, these features enhance robustness in unattended deployments such as remote sensors or battery-powered devices. Proper initialization code must enable and configure these peripherals during boot to maximize fault tolerance.
How does the operating temperature range affect long-term drift in analog measurements using the LM3S301-EGZ20-C2?
The ADC reference voltage and internal bias currents exhibit some variation across the -40°C to 105°C range, which can introduce measurement drift in analog readings. While the datasheet specifies nominal linearity and accuracy under typical conditions, extreme temperatures may require calibration or compensation in firmware. For precision applications, periodic recalibration or use of external precision references is advised. The LM3S301-EGZ20-C2 remains viable for many analog sensing tasks, but designers should validate performance across their target temperature extremes.
What are the packaging-related challenges when reflow soldering the LM3S301-EGZ20-C2?
The 48-VQFN (7x7 mm) package has an exposed thermal pad beneath the die, which must be soldered to the PCB to ensure proper heat transfer and mechanical attachment. During reflow, flux activation and solder wicking must be controlled to avoid voids or insufficient wetting. The MSL rating of 3 (168-hour floor life) indicates moderate moisture sensitivity, so storage and handling follow standard JEDEC guidelines. Stencil printing and solder paste volume should be optimized to achieve reliable joints without bridging between fine-pitch pads.
When selecting between the LM3S301-EGZ20-C2 and similar Cortex-M3 parts, what factors favor choosing this specific model?
The LM3S301-EGZ20-C2 offers a balance of core performance, integrated peripherals, and compact form factor ideal for space-constrained designs. Its 20MHz clock, 16KB flash, and 2KB RAM fit applications with moderate computational needs and predictable code size. The inclusion of multiple communication interfaces (UART, SPI, SSI) and analog inputs eliminates the need for external logic in sensor hubs or simple automation systems. For projects prioritizing low bill-of-materials cost and minimal external components, the LM3S301-EGZ20-C2 provides a practical solution within its performance envelope.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments LM3S301-EGZ20-C2

Product Attribute LM3S301-EGZ20-C2T LM3S301-IGZ20-C2T LM3S301-IGZ20-C2 LM3S308-EGZ25-C2T
Part Number LM3S301-EGZ20-C2T LM3S301-IGZ20-C2T LM3S301-IGZ20-C2 LM3S308-EGZ25-C2T
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Oscillator Type - - - -
Program Memory Type - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
RAM Size - - - -
Peripherals - - - -
Connectivity - - - -
Program Memory Size - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
EEPROM Size - - - -
Speed - - - -
Number of I/O - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Size - - - -
Core Processor - - - -
Data Converters - - - -
Series - - - -

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LM3S301-EGZ20-C2 Image

LM3S301-EGZ20-C2

Texas Instruments
98D-LM3S301-EGZ20-C2

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