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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138EZCEA3
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OMAPL138EZCEA3 - Texas Instruments

Manufacturer Part Number
OMAPL138EZCEA3
Manufacturer
Texas Instruments
Allelco Part Number
32D-OMAPL138EZCEA3
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
9,499 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 300MHZ 361NFBGA
Package
361-NFBGA (13x13)
Data sheet
OMAPL138EZCEA3.pdf

HTML Datasheet

OMAP-L138 Datasheet.pdf

PCN Assembly/Origin

2.73KHz.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 9499
  • Unit Price: $21.51
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $21.51 $21.51
30+ $20.53 $615.90
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

OMAPL138EZCEA3 Tech Specifications
Texas Instruments - OMAPL138EZCEA3 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138EZCEA3

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (13x13)
Speed 375MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers SDRAM
Package / Case 361-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 105°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL138
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

OMAPL138EZCEA3 Image
OMAPL138EZCEA3 (1)

Manufacturer Part Number

OMAPL138EZCEA3

Manufacturer

Texas Instruments

Introduction

The OMAPL138EZCEA3 is an embedded microprocessor from Texas Instruments, designed for applications requiring a high-performance ARM and DSP core with low power consumption.

Product Features and Performance

ARM926EJ-S Core Processor

32-Bit Single Core

375MHz Operating Speed

DSP C674x for Signal Processing

System Control CP15

SDRAM Memory Support

Integrated LCD Controller

10/100Mbps Ethernet

SATA 3Gbps Interface

USB Support Including USB 1.1 and USB 2.0

Multiple I/O Voltages (1.8V, 3.3V)

Surface Mount 361-LFBGA Package

Product Advantages

Optimized for high-speed signal processing

Efficient power consumption suitable for embedded applications

Scalable with OMAP-L1x series

Support for a wide range of interfaces and peripherals

OMAPL138EZCEA3 Image
OMAPL138EZCEA3 (2)

Key Technical Parameters

Core: ARM926EJ-S

Number of Cores/Bus Width: 1 Core, 32-Bit

Speed: 375MHz

RAM Controller: SDRAM

Ethernet: 10/100Mbps

SATA: 3Gbps

USB: 1.1 & 2.0

Operating Temperature: -40°C to 105°C

Quality and Safety Features

Reliable operating temperature range from -40°C to 105°C

Boot Security and Cryptography for enhanced security

Compatibility

Compatible with various industrial and communication interface standards

Application Areas

Industrial automation

Medical devices

Communication infrastructure

Digital audio and multimedia applications

Product Lifecycle

Currently Active

Regular updates and support from Texas Instruments

Key Reasons to Choose This Product

High integration helps reduce system cost and complexity

Texas Instruments' reputation for reliability and longevity in the embedded space

Active product lifecycle status ensures long-term availability and support

Frequently Asked Questions(FAQ)

How does the OMAPL138EZCEA3 compare to other processors in the OMAP-L1x series in terms of clock speed and core architecture?
The OMAPL138EZCEA3 features a 375MHz ARM926EJ-S core, which is consistent across most devices in the OMAP-L1x family. While other members like the OMAPL137 operate at lower frequencies, this variant maintains peak performance for embedded control applications requiring deterministic timing and moderate computational throughput without floating-point acceleration.
What are the key differences between using the OMAPL138EZCEA3 versus a general-purpose microcontroller when designing a system with both Ethernet and USB connectivity?
The OMAPL138EZCEA3 integrates dual USB interfaces—one supporting USB 1.1 and another full-speed USB 2.0—alongside a dedicated 10/100Mbps Ethernet MAC, all managed by a single ARM9-based SoC. In contrast, many microcontrollers require external PHYs or hubs to achieve similar connectivity, increasing bill-of-materials complexity and power consumption.
Can the OMAPL138EZCEA3 support real-time signal processing tasks effectively given its lack of on-chip FPU?
Yes, but with design trade-offs. The OMAPL138EZCEA3 includes a C674x DSP core that handles floating-point operations independently from the ARM9 CPU. This allows offloading computationally intensive signal processing while the main core manages control logic. However, software must explicitly coordinate data transfers via shared memory or message passing.
Is it possible to run Linux on the OMAPL138EZCEA3, and what are the implications for boot security and memory configuration?
Linux can be ported to the OMAPL138EZCEA3 since it supports ARM926EJ-S architecture and has sufficient RAM controller capabilities. However, enabling full-featured distributions may require careful management of available SDRAM bandwidth due to concurrent access by both the ARM and DSP subsystems. Additionally, the Boot Security feature can help protect against unauthorized firmware modifications during startup.
How should thermal considerations affect PCB layout and enclosure design when deploying multiple units containing the OMAPL138EZCEA3?
With an operating junction temperature range of -40°C to +105°C, the OMAPL138EZCEA3 is suitable for industrial environments. Nevertheless, continuous operation near 375MHz generates measurable heat; adequate copper area under the 361-NFBGA package and airflow management are recommended to prevent thermal throttling or reliability issues over time.
What role does the CP15 unit play in the OMAPL138EZCEA3, and how might it influence system performance in safety-critical applications?
The CP15 co-processor provides system control functions such as cache configuration, memory protection, and exception handling. In safety-certified designs, leveraging CP15 enables fine-grained memory isolation and secure interrupt routing, contributing to compliance with functional safety standards where predictable behavior under fault conditions is essential.
When interfacing peripherals to the OMAPL138EZCEA3, how do I manage voltage level compatibility across its mixed 1.8V and 3.3V I/O domains?
Peripheral signals connected to the OMAPL138EZCEA3 must adhere to specified voltage thresholds: core logic uses 1.8V, while GPIO, UART, and some control lines interface at 3.3V. Level shifters or open-drain configurations are often necessary when connecting 3.3V devices to inputs expecting 1.8V signals to avoid damage or undefined states.
Are there any known limitations in using the McBSP or McASP modules simultaneously on the OMAPL138EZCEA3 for audio streaming?
Both McBSP and McASP offer serial port functionality but serve different use cases—McBSP is optimized for TDM and legacy codec interfaces, while McASP supports more flexible audio protocols. Concurrent operation is feasible, but resource conflicts may arise if both modules attempt exclusive access to shared DMA channels or PLL clocks, requiring careful driver-level coordination.
How does the SATA 3Gbps interface on the OMAPL138EZCEA3 impact storage subsystem latency compared to SD/MMC card solutions?
The integrated SATA controller enables direct connection to SSDs or HDDs, offering significantly higher sequential throughput than SD/MMC cards typically allow. However, actual performance depends on host-side drivers and filesystem overhead. For applications requiring sustained high-speed data logging, SATA reduces transfer latency variability compared to flash-based alternatives.
What steps are required to enable cryptographic functions on the OMAPL138EZCEA3 for secure boot and data encryption?
Enabling cryptography involves initializing the hardware accelerator with valid keys (stored in secure NVM or loaded securely), configuring cipher modes through registers, and ensuring proper entropy sources for non-deterministic operations. The Boot Security feature also mandates signed firmware images validated before execution to maintain chain-of-trust integrity.
Can the LCD controller on the OMAPL138EZCEA3 drive modern touch-enabled displays without additional processing load?
Yes, the LCD peripheral supports various panel types and resolutions up to QVGA, making it suitable for simple graphical user interfaces. However, rendering complex visuals or handling touch input requires offloading graphics operations to software running on the ARM9 core, potentially limiting frame rates unless optimized with DMA-assisted transfers.
How does the MSL rating of 3 for the OMAPL138EZCEA3 influence procurement lead times and assembly scheduling?
An MSL of 3 means the OMAPL138EZCEA3 can be stored for up to 168 hours after baking before risking moisture-induced defects during reflow. This standard classification allows flexibility in supply chain planning but necessitates adherence to JEDEC guidelines during SMT assembly to avoid popcorning failures.
What are the advantages of using the HPI interface on the OMAPL138EZCEA3 when integrating third-party digital signal processors?
The Host Port Interface (HPI) enables high-bandwidth communication between the ARM9 CPU and external DSPs, bypassing internal bus arbitration delays. This is particularly beneficial when the OMAPL138EZCEA3 acts as a control node managing multiple co-processors, allowing rapid context switching and shared memory access with minimal overhead.
Does the absence of hardware graphics acceleration limit UI development on systems using the OMAPL138EZCEA3?
While lacking GPU support, the OMAPL138EZCEA3’s ARM926EJ-S core can still render basic UIs using framebuffer-based techniques. Performance is adequate for menus, status screens, and simple animations, especially when leveraging DMA for pixel data movement. Complex GUIs may require external display controllers or reduced refresh rates.
How does the choice of SDRAM affect overall system stability when working with the OMAPL138EZCEA3’s memory controller?
The OMAPL138EZCEA3 supports synchronous DRAM, and selecting a device with matching timing parameters (CAS latency, burst length, refresh rate) is critical for reliable operation. Mismatched configurations can cause intermittent errors, degraded performance, or complete failure, particularly at elevated temperatures within the -40°C to +105°C range.
What precautions should be taken when debugging software running on the OMAPL138EZCEA3 using JTAG, given its dense BGA packaging?
Due to the 361-NFBGA (13x13) form factor, physical access for probing is limited. Reliable JTAG debugging requires proper bed-of-nails test fixtures and adherence to signal integrity practices—including controlled impedance traces and decoupling—to ensure stable programming and trace capture throughout development cycles.
In what scenarios would choosing the OMAPL138EZCEA3 over a more power-efficient Cortex-M processor make sense despite its higher active current draw?
The OMAPL138EZCEA3 offers superior integration for mixed-signal workloads involving simultaneous networking (Ethernet), storage (SATA), and real-time audio (McASP). If your application requires unified control of these peripherals without adding multiple ICs—and operates in a thermally constrained environment with adequate cooling—the OMAPL138EZCEA3 provides a compact, monolithic solution outweighing pure power efficiency concerns.
How does the REACH and RoHS status of the OMAPL138EZCEA3 impact global market deployment and regulatory documentation?
Being RoHS3 compliant and REACH unaffected ensures the OMAPL138EZCEA3 meets environmental regulations in major markets including EU, China, and North America. This simplifies export procedures and reduces risk of customs delays, while also supporting sustainability goals in product lifecycle assessments and EOL disposal planning.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138EZCEA3

Product Attribute OMAPL138EZCEA3E OMAPL138EZCE3 OMAPL138EZCE4 OMAPL138EZCED4
Part Number OMAPL138EZCEA3E OMAPL138EZCE3 OMAPL138EZCE4 OMAPL138EZCED4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
USB - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Security Features - - - -
Number of Cores/Bus Width - - - -
Graphics Acceleration - - - -
Display & Interface Controllers - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Speed - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
RAM Controllers - - - -
Additional Interfaces - - - -
Ethernet - - - -
Voltage - I/O - - - -
Core Processor - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Co-Processors/DSP - - - -
SATA - - - -

OMAPL138EZCEA3 Datasheet PDF

Download OMAPL138EZCEA3 pdf datasheets and Texas Instruments documentation for OMAPL138EZCEA3 - Texas Instruments.

HTML Datasheet
OMAP-L138 Datasheet.pdf
PCN Packaging
Mult Dev 13/Apr/2020.pdf Mult Dev Rev 27/Apr/2020.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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This is achieved through our commitment to the continual improvement of our processes, services, and products.


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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

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OMAPL138EZCEA3 Image

OMAPL138EZCEA3

Texas Instruments
32D-OMAPL138EZCEA3

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