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OMAPL138EZCED4E - Texas Instruments

Name: Texas Instruments OMAPL138EZCED4E
Brand: Texas Instruments
SKU: OMAPL138EZCED4E
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: OMAPL138EZCED4E

Manufacturer: Texas Instruments

Allelco Part Number: 32D-OMAPL138EZCED4E

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,698 pcs available, New & Original

Parts Description: IC MPU OMAP-L1X 456MHZ 361NFBGA

Package: 361-NFBGA (13x13)

Data sheet: OMAPL138EZCED4E.pdf

HTML Datasheet
OMAP-L138 Datasheet.pdf

PCN Packaging
Mult Dev 13/Apr/2020.pdf Mult Dev Rev 27/Apr/2020.pdf

PCN Design/Specification
Cylindrical Battery Holders.pdf

RoHs Status: ROHS3 Compliant

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In stock: 4698

Specifications

OMAPL138EZCED4E Tech Specifications
Texas Instruments - OMAPL138EZCED4E technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138EZCED4E

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
Voltage - I/O	1.8V, 3.3V
USB	USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package	361-NFBGA (13x13)
Speed	456MHz
Series	OMAP-L1x
Security Features	Boot Security, Cryptography
SATA	SATA 3Gbps (1)
RAM Controllers	SDRAM
Package / Case	361-LFBGA
Package	Tray

Product Attribute	Attribute Value
Operating Temperature	-40°C ~ 90°C (TJ)
Number of Cores/Bus Width	1 Core, 32-Bit
Mounting Type	Surface Mount
Graphics Acceleration	No
Ethernet	10/100Mbps (1)
Display & Interface Controllers	LCD
Core Processor	ARM926EJ-S
Co-Processors/DSP	Signal Processing; C674x, System Control; CP15
Base Product Number	OMAPL138
Additional Interfaces	HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

OMAPL138EZCED4E (1)

Manufacturer Part Number

OMAPL138EZCED4E

Manufacturer

Texas Instruments

Introduction

The OMAPL138EZCED4E is part of Texas Instruments' OMAP-L1x series and is designed for advanced embedded applications requiring signal processing and efficient data management.

Product Features and Performance

Core Processor: ARM926EJ-S

Speed: 456MHz

Co-Processors/DSP: Signal Processing; C674x, System Control; CP15

RAM Controllers: SDRAM

Display & Interface Controllers: LCD

Ethernet: 10/100Mbps (1)

SATA: SATA 3Gbps (1)

USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)

Voltage I/O: 1.8V, 3.3V

Operating Temperature: -40°C to 90°C (TJ)

Product Advantages

Integrated digital signal processor (DSP) enhances multimedia and signal processing capabilities.

Broad range of interfaces including Ethernet, SATA, and USB for greater connectivity.

Low voltage operation and extended operating temperature suited for industrial applications.

Key Technical Parameters

Number of Cores/Bus Width: 1 Core, 32-Bit

Ethernet: 10/100Mbps

SATA: 3Gbps

USB: USB 1.1 and USB 2.0

Operating Temperature Range: -40°C to 90°C (TJ)

Quality and Safety Features

Security Features: Boot Security, Cryptography

Reliable in harsh environmental conditions

Compatibility

Compatible with various standard interfaces including HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART.

Application Areas

Industrial automation

Multimedia processing

Networked communication devices

Product Lifecycle

Status: Active

No current plans for discontinuation and replacements or upgrades available.

Several Key Reasons to Choose This Product

High signal processing capability with integrated C674x DSP.

Wide array of connectivity options supporting modern and legacy interfaces.

Robust operating temperature range suitable for harsh industrial environments.

Enhanced security features ensure safe and secure operation.

Active product lifecycle status with support and updates from Texas Instruments.

Frequently Asked Questions(FAQ)

How does the OMAPL138EZCED4E balance real-time control and signal processing in a single-core architecture?: The OMAPL138EZCED4E integrates an ARM926EJ-S core running at 456MHz alongside a C674x DSP co-processor, enabling concurrent execution of general-purpose control tasks and high-throughput signal processing. This heterogeneous architecture allows time-critical operations like motor control or audio filtering to be offloaded to the DSP while the ARM manages system-level functions, reducing latency and improving determinism without requiring a multi-core ARM setup.

What are the implications of the 361-NFBGA package on PCB design and thermal management for the OMAPL138EZCED4E?: The 361-NFBGA (13x13 mm) package with a 0.8 mm ball pitch demands careful attention to via-in-pad design, impedance-controlled routing, and thermal via placement beneath the die. Given the junction temperature range of -40°C to 90°C, designers should allocate sufficient copper pour and consider airflow in enclosed systems, especially when operating near the upper thermal limit under sustained DSP workloads.

Can the OMAPL138EZCED4E support both industrial communication protocols and multimedia interfaces simultaneously?: Yes, the OMAPL138EZCED4E integrates a 10/100 Mbps Ethernet MAC, multiple UARTs, SPI, I2C, and McASP interfaces, enabling concurrent use of industrial fieldbus protocols (e.g., Modbus over UART or Ethernet) while driving an LCD display via its integrated controller. The McBSP and McASP also allow interfacing with audio codecs or time-sensitive sensors without burdening the ARM core.

How does the memory subsystem of the OMAPL138EZCED4E influence real-time performance in embedded applications?: The OMAPL138EZCED4E relies on external SDRAM for main memory, which introduces latency compared to on-chip SRAM. Designers must optimize memory access patterns and leverage the ARM926EJ-S cache hierarchy (16KB I/D) to minimize stalls. For deterministic DSP operations, placing critical code and data in tightly coupled memory (TCM) or using DMA for bulk transfers is essential to maintain timing guarantees.

What security features does the OMAPL138EZCED4E offer, and how do they impact secure boot implementation?: The OMAPL138EZCED4E includes boot security and cryptographic acceleration, enabling secure boot via signed firmware images and hardware-based key storage. This allows verification of software integrity before execution, mitigating unauthorized code injection. However, full implementation requires proper key provisioning during manufacturing and secure handling of cryptographic assets in the bootloader.

Is the OMAPL138EZCED4E suitable for low-power industrial applications, and what power management strategies should be considered?: While not a ultra-low-power device, the OMAPL138EZCED4E supports dynamic voltage and frequency scaling (DVFS) and multiple low-power modes. Designers can reduce active power by throttling the 456MHz core during idle periods and leveraging the DSP for efficient signal processing. Careful partitioning of I/O voltage domains (1.8V and 3.3V) and clock gating unused peripherals further optimizes energy use in battery-backed or energy-constrained systems.

How does the OMAPL138EZCED4E compare to similar ARM9-based processors with integrated DSPs in terms of peripheral integration?: Compared to other ARM9+DSP combos, the OMAPL138EZCED4E stands out with its dual USB controllers (1.1 and 2.0 with PHY), SATA 3Gbps interface, and high-pin-count serial peripherals like McASP and McBSP. This level of integration reduces external component count in applications requiring storage (via SATA), connectivity (USB), and real-time audio or sensor interfacing—advantages not always present in competing single-core solutions.

What are the trade-offs when using the C674x DSP versus the ARM926EJ-S for algorithm implementation on the OMAPL138EZCED4E?: The C674x DSP excels in fixed-point and floating-point signal processing with deterministic cycle counts, making it ideal for FFTs, filters, or motor control loops. In contrast, the ARM926EJ-S offers broader OS support and easier software development for complex control logic. Offloading compute-intensive tasks to the DSP frees the ARM for system management, but requires careful inter-processor communication via shared memory or IPC mechanisms.

Can the OMAPL138EZCED4E drive a high-resolution display without a dedicated GPU?: The OMAPL138EZCED4E includes an LCD controller but lacks graphics acceleration, limiting it to basic framebuffer-driven displays. It can support resolutions up to WVGA (800x480) with 16-bit color depth, suitable for HMI panels or instrumentation interfaces. However, complex UI rendering or video playback will demand significant CPU/DSP resources, making it less ideal for rich graphical applications without software optimization.

How does the moisture sensitivity level (MSL 3) of the OMAPL138EZCED4E affect manufacturing and handling procedures?: With an MSL 3 rating (168-hour floor life), the OMAPL138EZCED4E must be baked if exposed to ambient conditions beyond the specified time before reflow. Manufacturers should follow IPC/JEDEC J-STD-033 guidelines for dry packing, storage in moisture-barrier bags with desiccant, and controlled rework processes to prevent popcorning during solder reflow, especially in high-volume production environments.

What role does the HPI (Host Port Interface) play in system design with the OMAPL138EZCED4E?: The HPI allows an external host processor to access the OMAPL138EZCED4E’s internal memory and peripherals directly, enabling master-slave configurations where the OMAP-L1x acts as a co-processor. This is useful in systems requiring centralized control, such as industrial gateways, where a main CPU delegates signal processing or communication tasks to the OMAPL138EZCED4E via a high-bandwidth parallel interface.

How does the OMAPL138EZCED4E handle real-time constraints when running a Linux-based OS?: While Linux on the ARM926EJ-S provides rich software ecosystems, its non-real-time scheduler can conflict with deterministic requirements. Designers often run a real-time OS on the C674x DSP for time-critical tasks while using Linux on the ARM for networking or user interfaces. Alternatively, PREEMPT-RT patches or dual-boot configurations can improve responsiveness, though worst-case latency must still be validated under load.

What are the key considerations when interfacing the OMAPL138EZCED4E’s 1.8V and 3.3V I/O domains with external components?: The OMAPL138EZCED4E supports mixed-voltage I/O (1.8V and 3.3V), but level shifting is required when connecting to devices operating outside these ranges. Care must be taken to avoid back-driving 1.8V pins with 3.3V signals. Additionally, simultaneous switching noise (SSN) increases with mixed-voltage buses, so proper decoupling, ground plane design, and signal integrity analysis are critical for reliable operation.

How does the SATA 3Gbps interface on the OMAPL138EZCED4E benefit embedded storage applications?: The integrated SATA 3Gbps controller enables high-speed connection to SSDs or HDDs, offering faster data transfer than traditional SD or NAND interfaces. This is advantageous in data logging, edge analytics, or media-rich systems where large datasets must be stored or retrieved quickly. However, designers must ensure proper signal integrity on the SATA differential pairs due to the high-speed serial nature of the interface.

What debugging and development tools are recommended for the OMAPL138EZCED4E during hardware bring-up?: TI provides Code Composer Studio (CCS) with JTAG support for both ARM and DSP cores, enabling synchronized debugging across the heterogeneous architecture. During bring-up, engineers should use a high-quality JTAG emulator, monitor boot pin configurations, and validate clock and reset sequencing. Early validation of DDR timing and power-on reset behavior is critical, especially given the complexity of the 361-ball BGA package.

How does the OMAPL138EZCED4E compare to newer ARM Cortex-A based processors in terms of software ecosystem and long-term support?: While newer Cortex-A devices offer higher performance and modern OS support, the OMAPL138EZCED4E benefits from mature toolchains, extensive DSP libraries, and long-term availability—key for industrial and medical applications with 10+ year lifecycles. Its ARM9 architecture has stable Linux BSPs and proven DSP/BIOS support, reducing migration risk compared to cutting-edge platforms with evolving software stacks.

Can the OMAPL138EZCED4E support secure over-the-air (OTA) firmware updates?: Yes, leveraging its boot security and cryptographic features, the OMAPL138EZCED4E can validate OTA update packages using digital signatures before installation. The dual-bank boot capability (if supported by external flash layout) allows fail-safe updates, where a corrupted image can be rolled back. However, secure key management and encrypted communication channels (e.g., TLS over Ethernet) are essential to prevent man-in-the-middle attacks during transmission.

What thermal design power (TDP) should be assumed for the OMAPL138EZCED4E under typical operating conditions?: While exact TDP varies with workload, the OMAPL138EZCED4E typically dissipates 1.2W to 1.8W when both ARM and DSP are active at 456MHz with full peripheral utilization. In lighter loads, power can drop below 500mW. Thermal simulations should assume worst-case power density in the center of the 13x13 mm package, with junction-to-ambient thermal resistance (θJA) heavily dependent on PCB layout and airflow.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138EZCED4E

Product Attribute
Part Number	OMAPL138EZCED4	OMAPL138EZCEA3E	OMAPL138EZCE4	OMAPL138EZCEA3
Manufacturer	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Core Processor	-	-	-	-
Series	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
USB	-	-	-	-
RAM Controllers	-	-	-	-
SATA	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Graphics Acceleration	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Voltage - I/O	-	-	-	-
Display & Interface Controllers	-	-	-	-
Speed	-	-	-	-
Additional Interfaces	-	-	-	-
Co-Processors/DSP	-	-	-	-
Security Features	-	-	-	-
Number of Cores/Bus Width	-	-	-	-
Ethernet	-	-	-	-

OMAPL138EZCED4E Datasheet PDF

Download OMAPL138EZCED4E pdf datasheets and Texas Instruments documentation for OMAPL138EZCED4E - Texas Instruments.

HTML Datasheet: OMAP-L138 Datasheet.pdf
PCN Packaging: Mult Dev 13/Apr/2020.pdf Mult Dev Rev 27/Apr/2020.pdf
PCN Design/Specification: Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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