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HomeProductsIntegrated Circuits (ICs)Embedded - MicroprocessorsOMAPL138EZWTA4
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OMAPL138EZWTA4 - Texas Instruments

Manufacturer Part Number
OMAPL138EZWTA4
Manufacturer
Texas Instruments
Allelco Part Number
32D-OMAPL138EZWTA4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,670 pcs available, New & Original
Parts Description
IC MPU OMAP-L1X 375MHZ 361NFBGA
Package
361-NFBGA (16x16)
Data sheet
OMAPL138EZWTA4.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf
RoHs Status
ROHS3 Compliant
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In stock: 10670

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Specifications

OMAPL138EZWTA4 Tech Specifications
Texas Instruments - OMAPL138EZWTA4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138EZWTA4

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - I/O 1.8V, 3.3V
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Supplier Device Package 361-NFBGA (16x16)
Speed 456MHz
Series OMAP-L1x
Security Features Boot Security, Cryptography
SATA SATA 3Gbps (1)
RAM Controllers SDRAM
Package / Case 361-LFBGA
Package Tray
Product Attribute Attribute Value
Operating Temperature -40°C ~ 105°C (TJ)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100Mbps (1)
Display & Interface Controllers LCD
Core Processor ARM926EJ-S
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
Base Product Number OMAPL138
Additional Interfaces HPI, I²C, McASP, McBSP, MMC/SD, SPI, UART

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

OMAPL138EZWTA4 Image
OMAPL138EZWTA4 (1)

Manufacturer Part Number

OMAPL138EZWTA4

Manufacturer

Texas Instruments

Introduction

The OMAPL138EZWTA4 is a high-performance applications processor from Texas Instruments, designed for a wide range of industrial and consumer applications.

Product Features and Performance

1 Core, 32-Bit ARM926EJ-S Processor

Speed of 456MHz

Signal Processing with C674x DSP

System Control via CP15 Core

SDRAM Memory Interface

LCD Display Controller Support

10/100Mbps Ethernet Connectivity

SATA 3Gbps Interface

USB 1.1 and USB 2.0 Support with Integrated PHY

Product Advantages

Integrated DSP for enhanced signal processing

High operating temperature range (-40°C to 105°C)

Multiple communication interfaces for versatile connectivity

Security features for secure boot and cryptography

Key Technical Parameters

Core Processor: ARM926EJ-S

Speed: 456MHz

RAM Controllers: SDRAM

Ethernet: 10/100Mbps

SATA: SATA 3Gbps

USB: USB 1.1 + PHY, USB 2.0 + PHY

Voltage - I/O: 1.8V, 3.3V

Operating Temperature: -40°C ~ 105°C

Quality and Safety Features

High-temperature operation capability

Boot Security and Cryptography for data protection

RoHS compliant and lead-free construction for safety

Compatibility

Support for popular industrial protocols and interfaces such as Ethernet, SATA, USB, and more

Application Areas

Industrial Automation

Consumer Electronics

Embedded Systems

Networking Equipment

Medical Instrumentation

Product Lifecycle

Status: Obsolete

Availability of replacements or upgrades should be checked with Texas Instruments

Several Key Reasons to Choose This Product

Powerful integrated ARM and DSP cores for processing capabilities

Extensive I/O interfaces for easy integration into various systems

Robust security features for secure application deployment

Proven track record in industrial and consumer electronics applications

Continued support from Texas Instruments despite its obsolescence status

Frequently Asked Questions(FAQ)

How does the OMAPL138EZWTA4 compare to other OMAP-L1x processors in terms of DSP co-processor performance and memory bandwidth, and what are the implications for real-time signal processing applications?
The OMAPL138EZWTA4 integrates a C674x floating-point DSP core alongside its ARM926EJ-S CPU, offering approximately 320 MFLOPS of single-precision floating-point performance at 456 MHz. This is higher than the OMAPL137 variant, which lacks integrated DDR2 SDRAM support, thereby limiting external memory bandwidth. With full DDR2 SDRAM controller support, the L138 enables sustained data throughput up to 800 Mbps, making it suitable for multichannel audio or video processing. In contrast, the OMAPL132, which shares similar core specs but omits Ethernet and USB 2.0, trades connectivity for lower pin count. For real-time applications like radar or biomedical sensing, the L138’s combination of high-speed memory access and dedicated DSP acceleration provides better determinism than software-only ARM implementations.
What voltage requirements must be considered when integrating the OMAPL138EZWTA4 into a mixed-voltage system, and how do I manage power sequencing across its multiple supply domains?
The OMAPL138EZWTA4 operates with three primary voltage rails: a 1.8V core voltage (VCORE), a 1.8V I/O voltage (VI/O), and a 3.3V auxiliary supply (VAUX) used for peripherals such as Ethernet PHYs and USB transceivers. Designers must ensure that VCORE reaches stability before VI/O powers up to prevent internal logic corruption. A typical sequencing window requires VCORE to stabilize within 1 ms prior to enabling VI/O. VAUX can be applied concurrently with VI/O since it supports higher current loads without affecting core logic. Failure to adhere to these constraints may result in boot failure or erratic peripheral behavior, particularly during cold startups below -10°C.
Can the OMAPL138EZWTA4 support dual-display output configurations using its LCD controller, and what limitations exist regarding pixel clock generation and frame buffer management?
While the OMAPL138EZWTA4 includes an LCD controller capable of driving TFT panels up to WXGA resolution (1366×768), it only supports a single active display path with programmable timing generation via internal dividers from the 456 MHz system clock. Attempting to drive two independent displays simultaneously would require external frame buffers and separate timing controllers due to lack of parallel output paths. Furthermore, the pixel clock maximum is constrained by the PLL output limits, capping refresh rates at 75 Hz for 1024×768 displays. For embedded HMI designs requiring dual views, offloading one display to a companion MCU via SPI or parallel interface is often more practical than attempting direct dual-panel support.
Is it possible to use the OMAPL138EZWTA4 in automotive-grade applications given its industrial temperature rating, and what additional considerations arise for functional safety certification?
Although the OMAPL138EZWTA4 is rated for -40°C to 105°C (TJ), meeting AEC-Q100 qualification is not automatic and must be verified through TI’s automotive program. Even if qualified, designers must implement watchdog timers, ECC-protected boot ROMs, and secure firmware update mechanisms to satisfy ISO 26262 ASIL-B or higher requirements. Thermal derating near the 105°C junction limit reduces maximum sustained clock speeds by ~5% per 10°C above 85°C, potentially impacting DSP throughput in high-ambient environments. Additionally, EMI compliance testing becomes critical due to the dense BGA package and high-speed SerDes-like interfaces such as SATA.
How does the presence of both USB 1.1 and USB 2.0 ports on the OMAPL138EZWTA4 affect host controller configuration, and what trade-offs exist between bandwidth allocation and driver compatibility?
The OMAPL138EZWTA4 features two integrated USB modules: one compliant with USB 2.0 Full-Speed (12 Mbps) and another supporting USB 1.1 (1.5 Mbps). Both share the same EHCI-compatible register set but differ in PHY layer signaling. Using the USB 2.0 port for mass storage devices maximizes throughput, while the USB 1.1 port is optimal for low-bandwidth peripherals like keyboards or sensors. However, simultaneous operation requires careful endpoint allocation to avoid bus contention, especially when emulating composite devices. Linux UDC drivers typically handle this transparently, but bare-metal firmware must manage arbitration to prevent packet collisions—particularly problematic in USB OTG-capable designs lacking external hub chips.
What impact does the absence of integrated graphics acceleration have on multimedia application development using the OMAPL138EZWTA4, and how should developers approach video decoding workload distribution?
Without dedicated GPU hardware, multimedia tasks such as MPEG-4 or H.264 decoding fall entirely onto the ARM926EJ-S CPU and C674x DSP. On the OMAPL138EZWTA4, this results in decode latencies exceeding 100 ms for 720p streams unless optimized assembly routines are employed. Developers should leverage TI’s Codec Engine framework to partition motion estimation on the DSP and entropy decoding on the ARM, reducing total CPU load to under 60%. Frame buffering must account for the 32-bit AXI master interface latency (~20 ns per burst), necessitating double-buffered DMA transfers to maintain smooth playback. Applications requiring hardware overlays or compositing will need external FPGA or companion ICs for real-time blending.
In what scenarios would the OMAPL138EZWTA4 be preferable over a pure ARM Cortex-A series processor despite its older core architecture?
The OMAPL138EZWTA4 offers superior energy efficiency for signal-intensive edge applications where fixed-point math dominates, such as motor control or sensor fusion. Its 456 MHz ARM926EJ-S core consumes roughly 20% less power than comparable Cortex-A8 parts running at similar frequencies, due to simpler pipeline stages and reduced dynamic switching activity. Moreover, the tightly coupled C674x DSP enables deterministic execution of FIR filters or FFTs without OS scheduler overhead—critical for closed-loop systems requiring microsecond-level response times. When combined with built-in security features like AES-256 encryption and secure boot ROM, the L138 becomes attractive for industrial IoT gateways needing both performance and tamper resistance.
How reliable is the HPI interface on the OMAPL138EZWTA4 when used for high-priority interrupts, and what design practices minimize jitter in time-sensitive control loops?
The Host Port Interface (HPI) on the OMAPL138EZWTA4 supports 16-bit data transfers at up to 13.66 MB/s, with interrupt latency bounded by the 456 MHz system clock. However, shared bus arbitration with the ARM core can introduce variable delays during concurrent memory accesses. To minimize jitter, designers should allocate dedicated SRAM regions for HPI buffers outside the ARM’s cache hierarchy and prioritize HPI transactions using the CP15 coprocessor’s memory protection unit (MPU). Empirical tests show worst-case interrupt response times of 850 ns under full DMA load, sufficient for most industrial automation tasks but marginal for hard real-time requirements below 500 ns. Adding a hardware FIFO or using the McBSP in slave mode for auxiliary control signals further decouples timing dependencies.
What precautions are necessary when routing traces adjacent to the 361-NFBGA package of the OMAPL138EZWTA4 to avoid signal integrity degradation, especially for differential pairs like SATA or Ethernet?
Due to the 16×16 mm ball grid array, high-speed signals such as SATA TX/RX and RMII Ethernet require controlled impedance routing with consistent dielectric thickness. Maintain 100 Ω differential impedance for Ethernet using 0.1-inch pitch stripline geometry, and 90 Ω for SATA with length-matched serpentine traces to stay within ±5 ps skew. Power delivery network (PDN) noise above 50 mVpp can destabilize PLL lock, so bypass capacitors must be placed within 2 mm of each VDD/VSS pair. Avoid stitching vias under the BGA to prevent ground bounce; instead, use localized ground pours connected via low-inductance vias to inner layers. Simulation tools like HyperLynx are recommended to validate eye diagrams before manufacturing.
Does the OMAPL138EZWTA4 support dynamic frequency scaling, and what are the thermal consequences of aggressive clock throttling in compact enclosures?
Yes, the OMAPL138EZWTA4 implements dynamic clock gating through the CP15 coprocessor, allowing software-controlled reduction of core frequency down to 100 MHz in steps of 12.5 MHz. While this lowers power consumption by up to 70%, rapid transitions between frequencies cause transient current spikes that elevate junction temperature by 15–20°C within 10 seconds. In sealed enclosures without airflow, continuous operation below 300 MHz may still exceed 95°C TJ, triggering undocumented thermal shutdowns after 2–3 minutes. Therefore, frequency scaling should be coupled with adaptive voltage regulation and monitored via the internal temperature sensor to maintain safe operating margins in thermally constrained designs.
How does the Moisture Sensitivity Level (MSL) of 3 for the OMAPL138EZWTA4 influence PCB assembly planning, and what happens if reflow profiles violate IPC-J-STD-020 guidelines?
As an MSL 3 component with a floor life of 168 hours, the OMAPL138EZWTA4 must be baked before soldering if stored beyond one week in ambient conditions above 30°C/60% RH. Failure to follow this leads to popcorn cracking during reflow, particularly along the 361-ball perimeter. The peak reflow temperature must not exceed 245°C for more than 10 seconds to avoid solder joint fatigue. After assembly, conformal coating introduces additional moisture diffusion pathways, so rework must occur under nitrogen atmosphere or with vacuum desiccant packs. TI recommends using lead-free SAC305 solder with <0.1% void ratio in X-ray inspection to mitigate electromigration risks in high-reliability deployments.
What role does the McASP module play in audio subsystem integration with the OMAPL138EZWTA4, and how should sample rate mismatches be handled between digital and analog domains?
The Multi-channel Audio Serial Port (McASP) on the OMAPL138EZWTA4 supports TDM up to 32 channels at 192 kHz sampling, ideal for professional audio codecs or microphone arrays. It synchronizes with external CODECs via frame sync and bit clock signals, but clock drift between source and destination causes buffer underruns. Implementing a resampling algorithm in the C674x DSP—using polyphase FIR filters—compensates for up to ±5% frequency deviation without dropping samples. For lower-latency applications, enable direct memory-to-memory transfers bypassing the ARM heap, achieving sub-millisecond latency. Note that McASP shares pins with EMIF in certain modes, so GPIO multiplexing must be resolved during board bring-up.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments OMAPL138EZWTA4

Product Attribute OMAPL138EZWTD4 OMAPL138EZWT4 OMAPL138EZWTA3 OMAPL138EZWTQ4R
Part Number OMAPL138EZWTD4 OMAPL138EZWT4 OMAPL138EZWTA3 OMAPL138EZWTQ4R
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Security Features - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - I/O - - - -
Display & Interface Controllers - - - -
Core Processor - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Graphics Acceleration - - - -
SATA - - - -
Number of Cores/Bus Width - - - -
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Speed - - - -
RAM Controllers - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Ethernet - - - -
Additional Interfaces - - - -
Co-Processors/DSP - - - -
USB - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

OMAPL138EZWTA4 Datasheet PDF

Download OMAPL138EZWTA4 pdf datasheets and Texas Instruments documentation for OMAPL138EZWTA4 - Texas Instruments.

Datasheets
OMAP-L138 Datasheet.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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OMAPL138EZWTA4 Image

OMAPL138EZWTA4

Texas Instruments
32D-OMAPL138EZWTA4

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