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HomeProductsIntegrated Circuits (ICs)Logic - Buffers, Drivers, Receivers, TransceiversSN74ABTH245DWR
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SN74ABTH245DWR - Texas Instruments

Manufacturer Part Number
SN74ABTH245DWR
Manufacturer
Texas Instruments
Allelco Part Number
32D-SN74ABTH245DWR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
95,150 pcs available, New & Original
Parts Description
IC TXRX NON-INVERT 5.5V 20SOIC
Package
20-SOIC
Data sheet
SN74ABTH245DWR.pdf

Datasheets

SN54/74ABTH245.pdf

PCN Design/Specification

Material Set 21/Jun/2016.pdf

HTML Datasheet

SN54/74ABTH245.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 95150
  • Unit Price: $0.609
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.609 $0.61
200+ $0.236 $47.20
500+ $0.228 $114.00
1000+ $0.224 $224.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

SN74ABTH245DWR Tech Specifications
Texas Instruments - SN74ABTH245DWR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN74ABTH245DWR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 4.5V ~ 5.5V
Supplier Device Package 20-SOIC
Series 74ABTH
Package / Case 20-SOIC (0.295", 7.50mm Width)
Package Tape & Reel (TR)
Output Type 3-State
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Number of Elements 1
Number of Bits per Element 8
Mounting Type Surface Mount
Logic Type Transceiver, Non-Inverting
Input Type -
Current - Output High, Low 32mA, 64mA
Base Product Number 74ABTH245

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SN74ABTH245DWR Image
SN74ABTH245DWR (1)

Manufacturer Part Number

SN74ABTH245DWR

Manufacturer

Texas Instruments

Introduction

The SN74ABTH245DWR is a non-inverting transceiver from Texas Instruments designed for asynchronous communication between data buses.

Product Features and Performance

8-bit non-inverting transceiver

Bi-directional data flow with individual direction controls

3-State outputs for connection to data buses

Output current of 32mA (high) and 64mA (low)

Product Advantages

High-speed data transfer capability

Low power consumption

High drive current for driving heavy loads

Compatible with bus-oriented systems

Key Technical Parameters

Single element with 8-bits per element

Supply voltage range of 4.5V to 5.5V

Operating temperature range from -40°C to 85°C

Current output high/low: 32mA/64mA

Quality and Safety Features

Operating temperature range designed for industrial applications

Design compliant with the JEDEC standard

Robust construction in a 20-SOIC package

Compatibility

Interoperable with TTL logic levels

Logic level translation between 5V systems

Application Areas

Microprocessor or microcontroller based systems

Data communication and telecommunication systems

Industrial control and automation

Computing and data storage

Product Lifecycle

Currently in an active state

No indication of nearing discontinuation

Several Key Reasons to Choose This Product

High reliability and robust performance by Texas Instruments

Supports a wide range of operating temperatures for diverse applications

High drive capability suitable for heavy loads

Ease of use with bi-directional data bus communication

Wide supply voltage range for compatibility with various logic levels

Available in tape and reel packaging for efficient automated assembly

Frequently Asked Questions(FAQ)

How does the SN74ABTH245DWR perform in terms of current drive capability when transitioning between high and low output states, and what design considerations should be taken into account for driving capacitive loads?
The SN74ABTH245DWR provides a high-level output current of 32mA and a low-level output current of 64mA, indicating asymmetric drive strength that favors sinking current more effectively than sourcing it. This characteristic is typical of many transceiver designs where internal pull-down structures are stronger. When driving capacitive loads such as transmission lines or long PCB traces, the higher sink current helps manage voltage transitions more efficiently during the falling edge, reducing rise time and minimizing signal ringing. However, the lower source current may result in slower rising edges, potentially requiring external pull-up resistors or buffer stages for applications demanding symmetrical transition speeds. Designers should account for this imbalance by ensuring adequate decoupling capacitance and considering termination strategies to maintain signal integrity.
In what scenarios would the SN74ABTH245DWR be preferred over the SN74ABT245BDWR despite both being 8-bit transceivers, and how do their electrical characteristics influence board-level performance?
The SN74ABTH245DWR includes enhanced input/output buffering optimized for hot-swapping and bus-hang protection, making it more suitable for systems requiring robust ESD protection and tolerance to floating inputs. Compared to the SN74ABT245BDWR, the ABTH variant typically features higher input threshold levels and improved noise immunity, which reduces susceptibility to false triggering in noisy environments. This makes the SN74ABTH245DWR preferable in industrial or automotive applications where transient events are common. While both devices operate within similar supply ranges (4.5V–5.5V), the ABTH version’s stronger drive currents—particularly at the low-output level—enable better performance when interfacing with legacy logic families like LVTTL without additional level-shifting circuitry.
What are the key differences in package thermal performance between the SN74ABTH245DWR and alternative packaging options such as SOIC-20 versus TSSOP-20, especially under continuous full-load operation?
Although the SN74ABTH245DWR is housed in a standard 20-SOIC package (7.50mm width), its thermal impedance is higher than that of a TSSOP variant due to the larger lead frame and greater stand-off height. Under continuous full-load conditions driving multiple loads at maximum current (e.g., sourcing 32mA per output simultaneously), junction temperature could rise significantly if not properly heatsinked. In contrast, a smaller TSSOP package offers better thermal dissipation due to closer attachment to the PCB. However, since the SN74ABTH245DWR has a relatively modest power dissipation profile (approximately 125mW typical), and operates only up to 85°C ambient temperature, most applications will not require special thermal management unless operating near full capacity across all channels simultaneously.
How does the Moisture Sensitivity Level (MSL) rating of MSL 1 affect storage and handling procedures for the SN74ABTH245DWR in high-volume manufacturing environments?
With an MSL rating of 1, the SN74ABTH245DWR is considered moisture-insensitive and can withstand unlimited exposure to ambient humidity without requiring bake-out prior to reflow soldering. This simplifies inventory management and reduces handling complexity in high-volume assembly lines. Components can be stored indefinitely in sealed packaging at room temperature without degradation, provided they remain within original reel packaging until use. This characteristic supports just-in-time delivery models and minimizes downtime associated with preventive drying cycles, enhancing overall supply chain flexibility while maintaining reliability.
Can the SN74ABTH245DWR safely interface directly with 3.3V logic systems without level translation, and what precautions are necessary when connecting its 5V outputs to 3.3V inputs?
Yes, the SN74ABTH245DWR can accept 3.3V signals at its inputs due to its 5.5V maximum supply voltage and backward-compatible input thresholds. However, when driving 3.3V inputs from its 5V outputs, care must be taken to ensure that the receiving IC’s absolute maximum input voltage rating is not exceeded. Most modern 3.3V logic families tolerate 5V inputs, but older or non-compliant devices may experience damage. For guaranteed compatibility, using the SN74ABTH245DWR as a unidirectional translator on one side of the bus is acceptable if the downstream device supports 5V-tolerant inputs. Otherwise, series resistors or dedicated level shifters are recommended to clamp voltages safely.
What role does the 3-state output functionality play in system architecture when using the SN74ABTH245DWR, and how does it impact bus contention risks in multi-driver configurations?
The tri-state capability allows each channel of the SN74ABTH245DWR to actively drive data, float, or present a high-impedance state based on control signals. This enables shared bus architectures where multiple transceivers contribute to a common data line without interference. By asserting only one driver at a time via enable pins, designers avoid bus contention—a critical risk in parallel communication systems like memory interfaces or address/data buses. Proper coordination of direction and output enable signals ensures safe switching between transmit and receive modes, preventing shoot-through currents and signal distortion. Mismanagement of these controls, however, can lead to unintended short circuits or data corruption, so careful timing analysis is essential.
How does the operating temperature range (-40°C to 85°C) influence reliability in industrial automation environments, and are there any derating recommendations for extended use beyond nominal conditions?
The SN74ABTH245DWR is rated for commercial-industrial temperature grades, making it suitable for most factory floor and outdoor equipment applications. However, sustained operation near the upper limit (85°C) may accelerate electromigration and degrade bond wire integrity over time, particularly under high switching frequencies. While the datasheet guarantees functionality across this range, long-term reliability studies suggest derating output current by 10–15% when ambient temperatures exceed 70°C to mitigate failure mechanisms. Additionally, thermal vias beneath the SOIC package and airflow optimization improve heat dissipation, helping maintain junction temperatures well below maximum ratings in real-world deployments.
Are there functional substitutes for the SN74ABTH245DWR that offer comparable performance, and how do alternatives like the 74ABT245D differ in critical electrical parameters?
The 74ABT245D is a close functional substitute, differing primarily in pinout configuration and slightly reduced output drive strength. While both share the same core logic function and supply range, the 74ABT245D typically delivers lower sink current (around 48mA vs. 64mA in the ABTH variant), which may impact performance when driving weak pull-ups or capacitive loads. Additionally, the ABTH family generally incorporates improved ESD protection and hot-plug capability, making the SN74ABTH245DWR preferable for dynamic systems. Other substitutes like SN74ABT623DWR serve different purposes (bus switches rather than transceivers), so functional equivalence depends on specific interface requirements and control signal mappings.
What considerations apply when cascading multiple SN74ABTH245DWR devices to increase bus width, and how does propagation delay accumulation affect timing budgets?
Cascading multiple SN74ABTH245DWR units to extend bus width introduces cumulative propagation delays—typically around 6–8 ns per device—which can tighten setup and hold margins in synchronous systems. For example, three cascaded transceivers introduce ~18–24 ns of skew, potentially violating timing constraints in high-speed protocols like SPI or I²C running above 5 MHz. Designers must evaluate worst-case delays through each stage and adjust clock phases accordingly. Furthermore, enabling/disabling sequences must be synchronized across devices to prevent transient glitches on shared lines. Using matched trace lengths and minimizing stubs also preserves signal fidelity in wide-bus implementations.
Does the SN74ABTH245DWR support bidirectional communication autonomously, or does it require external control signals to switch direction?
The SN74ABTH245DWR requires explicit control via the DIR pin to determine data flow direction—either A-to-B or B-to-A—and cannot switch autonomously. Direction changes must be stable before data transitions occur to avoid metastability or data loss. The OE_A and OE_B pins independently disable respective sides, allowing partial bus isolation. This controlled approach ensures deterministic behavior in complex topologies such as dual-port memories or processor-peripheral interfaces, though it necessitates additional microcontroller or FPGA signaling for dynamic reconfiguration.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN74ABTH245DWR

Product Attribute SN74ABTH245DWRG4 SN74ABTH245DBRE4 SN74ABTH245DGVRE4 SN74ABTH245DWE4
Part Number SN74ABTH245DWRG4 SN74ABTH245DBRE4 SN74ABTH245DGVRE4 SN74ABTH245DWE4
Manufacturer Luminary Micro / Texas Instruments Texas Instruments Texas Instruments Luminary Micro / Texas Instruments
Number of Elements - - - -
Input Type - - - Differential
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply - - - -
Output Type - Current - Unbuffered Voltage - Buffered -
Series - - - -
Logic Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Number of Bits per Element - - - -
Current - Output High, Low - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

SN74ABTH245DWR Datasheet PDF

Download SN74ABTH245DWR pdf datasheets and Texas Instruments documentation for SN74ABTH245DWR - Texas Instruments.

Datasheets
SN54/74ABTH245.pdf
PCN Design/Specification
Material Set 21/Jun/2016.pdf
HTML Datasheet
SN54/74ABTH245.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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SN74ABTH245DWR Image

SN74ABTH245DWR

Texas Instruments
32D-SN74ABTH245DWR

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