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HomeProductsIntegrated Circuits (ICs)Logic - Buffers, Drivers, Receivers, TransceiversSN74ALS1035DR
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SN74ALS1035DR - Texas Instruments

Manufacturer Part Number
SN74ALS1035DR
Manufacturer
Texas Instruments
Allelco Part Number
32D-SN74ALS1035DR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
38,694 pcs available, New & Original
Parts Description
IC BUF NON-INVERT 5.5V 14SOIC
Package
14-SOIC
Data sheet
SN74ALS1035DR.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf

HTML Datasheet

SN54/74ALS1035.pdf
RoHs Status
ROHS3 Compliant
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Specifications

SN74ALS1035DR Tech Specifications
Texas Instruments - SN74ALS1035DR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN74ALS1035DR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 4.5V ~ 5.5V
Supplier Device Package 14-SOIC
Series 74ALS
Package / Case 14-SOIC (0.154', 3.90mm Width)
Package Tape & Reel (TR)
Output Type Open Collector
Operating Temperature 0°C ~ 70°C (TA)
Product Attribute Attribute Value
Number of Elements 6
Number of Bits per Element 1
Mounting Type Surface Mount
Logic Type Buffer, Non-Inverting
Input Type -
Current - Output High, Low -, 24mA
Base Product Number 74ALS1035

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SN74ALS1035DR Image
SN74ALS1035DR (1)

Manufacturer Part Number

SN74ALS1035DR

Manufacturer

Texas Instruments

Introduction

The SN74ALS1035DR is part of the 74ALS series and serves as a logic buffer, providing non-inverting signal amplification.

Product Features and Performance

Non-Inverting Buffers

Six Buffer Gates

Open Collector Outputs

High Speed with ALS Technology

Product Advantages

Improved Drive Capability compared to standard TTL logic

Optimal balance between speed and power consumption

Key Technical Parameters

Logic Type: Buffer, Non-Inverting

Number of Elements: 6

Number of Bits per Element: 1

Output Type: Open Collector

Current Output High, Low: 24mA

Voltage Supply: 4.5V to 5.5V

Operating Temperature Range: 0°C to 70°C

Quality and Safety Features

Industry-standard quality and reliability

Complies with JEDEC standards

Compatibility

Compatible with multiple TTL and CMOS logic families

Application Areas

Bus Driver

Signal Buffering

Power Management

Data Transmission

Logic Level Shifting

Product Lifecycle

Product Status: Active

No indication of discontinuation

Ongoing manufacturer support

Several Key Reasons to Choose This Product

Reliable performance from Texas Instruments

Broad operating temperature suitable for commercial applications

Flexible voltage supply compatibility

High output current capacity for driving multiple loads

Surface Mount package ideal for compact PCB design

Availability in Tape & Reel packaging for automated assembly processes

Proven technology with a history of reliable operation in various logic applications

Frequently Asked Questions(FAQ)

What is the maximum output current capability per channel for the SN74ALS1035DR buffer when sinking load current, and how does this influence driver design for LED arrays?
The SN74ALS1035DR provides a maximum sink current of 24mA per open-collector output. This level supports typical LED driving applications with standard forward voltages, but designers must ensure that total package power dissipation remains within safe operating limits—especially in configurations involving multiple active outputs. For high-brightness LEDs requiring higher currents, external transistors or MOSFETs are typically employed rather than relying solely on the IC’s internal drive strength.
How does the supply voltage range of 4.5V to 5.5V impact compatibility between the SN74ALS1035DR and common digital systems such as 3.3V microcontrollers?
While the SN74ALS1035DR operates from 4.5V to 5.5V, it can interface with 3.3V logic devices through resistive pull-up networks if the system uses 5V VCC. However, direct connection without level shifting may violate input high-level thresholds, leading to unreliable logic interpretation. In mixed-voltage environments, bidirectional level translators or dedicated buffers with wider supply ranges are often preferred over direct use of this part.
Can the SN74ALS1035DR be used to drive inductive loads such as relays or solenoids directly, and what precautions should be taken regarding flyback protection?
Yes, the open-collector outputs of the SN74ALS1035DR are well-suited for driving relay coils or solenoid windings. However, each output must include a freewheeling diode (e.g., 1N4148) across the coil terminals to clamp inductive kickback. Without proper snubbing, voltage transients exceeding the 5.5V absolute maximum rating could damage the device, particularly during repeated switching at elevated temperatures near the 70°C upper limit.
How does thermal performance affect reliability when using multiple outputs of the SN74ALS1035DR simultaneously in continuous operation, and what derating guidance applies given its 70°C ambient temperature specification?
The SN74ALS1035DR is rated for commercial-grade operation up to 70°C ambient. When more than one output conducts continuously at significant current (e.g., >10mA), localized heating may occur due to package thermal resistance. Designers should assume approximately 10–15% derating per active channel above 50°C to maintain long-term junction integrity. In compact PCB layouts with poor airflow, spreading heat via ground plane copper or reducing duty cycle improves robustness.
What is the difference in propagation delay characteristics between low-to-high versus high-to-low transitions for the SN74ALS1035DR, and why might this matter in synchronous timing-critical designs?
The SN74ALS1035DR exhibits slightly asymmetric propagation delays due to its internal architecture; typical tPLH is around 6–8 ns while tPHL is marginally faster at 4–6 ns under standard test conditions. This asymmetry introduces minor skew in multi-bit signal paths, which can accumulate in clocked systems. For precise timing applications, designers should verify actual delays across process corners and temperature extremes before committing to tight setup/hold margins.
How does the number of functional elements (six independent buffers) in the SN74ALS1035DR compare to similar packages like dual 3-input NANDs, and what layout advantages does the SOIC footprint offer?
Unlike discrete logic families that bundle multiple gates into larger packages (e.g., 14-pin DIPs containing four 2-input NANDs), the SN74ALS1035DR integrates six identical single-bit buffers—offering greater pin efficiency for fan-out expansion tasks. Its 14-SOIC form factor occupies minimal board area compared to TTL DIP equivalents, enabling higher density in space-constrained designs without sacrificing functionality.
What are the implications of using the SN74ALS1035DR in battery-powered systems where quiescent current minimization is critical?
Although not optimized for ultra-low-power applications, the SN74ALS1035DR consumes only modest standby current (<1 mA total) due to its Advanced Low-Power Schottky (ALS) technology. At 5V, each inactive channel draws negligible leakage, making it acceptable for intermittent-use scenarios. However, for continuous operation with coin-cell batteries, alternatives with sleep modes or CMOS-based buffers would extend runtime significantly beyond what this device allows.
Why might a designer choose the SN74ALS1035DR over a discrete transistor array for buffering address lines in embedded systems?
The SN74ALS1035DR offers integrated buffering with built-in open-drain capability, eliminating the need for external base resistors and simplifying PCB routing. Its standardized pinout and guaranteed noise margins reduce design iteration time versus custom transistor solutions. Additionally, the SOIC packaging enables automated assembly, whereas discrete approaches increase component count and susceptibility to soldering defects in mass production.
How does the Moisture Sensitivity Level (MSL) rating of MSL 1 for the SN74ALS1035DR affect handling procedures during reflow soldering?
With an MSL 1 classification, the SN74ALS1035DR is considered moisture-resistant and can withstand unlimited storage time before assembly, provided it remains in sealed packaging until use. No baking or special drying steps are required prior to reflow, unlike higher MSL parts vulnerable to popcorning during thermal exposure. This simplifies inventory management and reduces post-production failure risks in high-volume manufacturing.
What role does the open-collector output configuration play in bus-sharing applications using the SN74ALS1035DR?
The open-collector design enables wired-AND functionality essential for I²C-like protocols or shared-data-bus architectures. Multiple SN74ALS1035DR outputs can pull the line low without contention, while external pull-up resistors define the high state. This avoids shoot-through currents associated with push-pull outputs and ensures clean signal integrity even with mismatched rise times across devices.
How do environmental compliance certifications (RoHS3, REACH Unaffected, ECCN EAR99) impact global sourcing strategies for the SN74ALS1035DR?
RoHS3 compliance guarantees halogen-free and lead-free construction suitable for European and international markets. REACH Unaffected status indicates no SVHCs (Substances of Very High Concern) present above threshold levels, easing regulatory documentation. ECCN EAR99 classification simplifies export controls, avoiding complex licensing for most end products. Together, these attributes support seamless adoption in regulated industries including medical and automotive peripherals.
In what ways does the 14-SOIC package dimensions (0.154", 3.90mm width) influence PCB real estate planning when integrating the SN74ALS1035DR alongside fine-pitch BGA components?
The standard SOIC footprint aligns with industry-mandated pitch standards (150 mil center-to-center), ensuring compatibility with automated pick-and-place machines. Its 3.90mm width fits comfortably between closely spaced BGAs without requiring micro-vias or stacked traces, preserving signal integrity. However, thermal vias under the exposed pad (if present) should be avoided unless specified, as non-standard pads may affect solder wetting and mechanical stability.
How does the operating temperature range (0°C to 70°C) constrain deployment environments for the SN74ALS1035DR in industrial automation versus consumer electronics?
The SN74ALS1035DR meets industrial baseline requirements but lacks extended-temperature variants. It is unsuitable for automotive under-hood applications or outdoor equipment exposed to direct sunlight without enclosure cooling. In contrast, consumer devices with controlled indoor climates fall within its envelope. For harsh environments, TI’s industrial-grade 74ALVC or AHC series would provide broader thermal tolerance.
What trade-offs arise when selecting the SN74ALS1035DR instead of a higher-speed family like 74FCT for high-frequency signal buffering?
Compared to 74FCT, the ALS version trades speed (typical 20 MHz vs. 30+ MHz) for lower power and better noise immunity. The SN74ALS1035DR’s 24 mA sink current and open-collector flexibility suit moderate-speed control signals but may introduce latency in GHz-range interfaces. Choosing ALS over FCT reduces crosstalk in dense layouts but sacrifices bandwidth for marginal cost savings in non-time-sensitive roles.
How does the base product number (74ALS1035) relate to other members of the 74ALS family, and what backward compatibility concerns exist when substituting parts?
The 74ALS1035 shares architectural lineage with other ALS devices like the 74ALS244, differing primarily in element count and pinout. While logic behavior remains consistent across the family, substituting requires verifying package compatibility and electrical parameters. Direct swaps between dissimilar functions (e.g., buffer vs. latch) fail, but buffer-for-buffer replacements generally succeed if supply voltage, temperature, and load conditions align.
Why might a developer avoid cascading multiple SN74ALS1035DR units to achieve higher fan-out than six outputs without adding external drivers?
Cascading introduces cumulative propagation delay and potential race conditions in synchronous designs. Moreover, loading each subsequent stage increases capacitive burden on prior outputs, risking overshoot or undershoot beyond valid logic thresholds. External buffer chains with matched impedances or integrated multi-channel FET drivers offer cleaner scalability without degrading signal fidelity.
How does the cut tape and Digi-Reel packaging format affect procurement logistics for the SN74ALS1035DR in prototyping versus full-scale production runs?
Cut tape suits small-batch prototyping by minimizing minimum order quantities, while Digi-Reel enables automated feeding in assembly lines. Both formats preserve electrostatic discharge (ESD) protection during transport. For volume production, reel quantities reduce handling errors and improve placement accuracy—critical when aligning with surface-mount nozzles calibrated for SOIC geometries.
What diagnostic features or test points should engineers incorporate when validating the SN74ALS1035DR in field-programmable gate array (FPGA) co-designs?
Monitoring supply rail ripple, output waveform integrity with an oscilloscope, and verifying pull-up resistor values against expected rise times provide early fault detection. Additionally, injecting simulated load steps (e.g., switching three outputs simultaneously) stresses thermal and current limits. Logging transient responses helps confirm adherence to datasheet specifications under worst-case real-world conditions.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN74ALS1035DR

Product Attribute SN74ALS1035DRE4 SN74ALS1035DRG4 SN74ALS1034DRE4 SN74ALS1035DE4
Part Number SN74ALS1035DRE4 SN74ALS1035DRG4 SN74ALS1034DRE4 SN74ALS1035DE4
Manufacturer Luminary Micro / Texas Instruments Luminary Micro / Texas Instruments Luminary Micro / Texas Instruments Luminary Micro / Texas Instruments
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Current - Output High, Low - - - -
Voltage - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Number of Bits per Element - - - -
Number of Elements - - - -
Logic Type - - - -
Input Type - - - Differential
Output Type - Current - Unbuffered Voltage - Buffered -
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount

SN74ALS1035DR Datasheet PDF

Download SN74ALS1035DR pdf datasheets and Texas Instruments documentation for SN74ALS1035DR - Texas Instruments.

PCN Design/Specification
Cylindrical Battery Holders.pdf
HTML Datasheet
SN54/74ALS1035.pdf

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Evaluation: 10 Articles

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    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
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    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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SN74ALS1035DR Image

SN74ALS1035DR

Texas Instruments
32D-SN74ALS1035DR

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