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HomeProductsIntegrated Circuits (ICs)Logic - Signal Switches, Multiplexers, DecodersSN74HC138DBR
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SN74HC138DBR - Texas Instruments

Manufacturer Part Number
SN74HC138DBR
Manufacturer
Texas Instruments
Allelco Part Number
32D-SN74HC138DBR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
207,230 pcs available, New & Original
Parts Description
IC DECODER/DEMUX 1X3:8 16SSOP
Package
16-SSOP
Data sheet
SN74HC138DBR.pdf
RoHs Status
ROHS3 Compliant
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In stock: 207230
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Specifications

SN74HC138DBR Tech Specifications
Texas Instruments - SN74HC138DBR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN74HC138DBR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage Supply Source Single Supply
Voltage - Supply 2V ~ 6V
Type Decoder/Demultiplexer
Supplier Device Package 16-SSOP
Series 74HC
Package / Case 16-SSOP (0.209', 5.30mm Width)
Product Attribute Attribute Value
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Independent Circuits 1
Current - Output High, Low 5.2mA, 5.2mA
Circuit 1 x 3:8
Base Product Number 74HC138

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SN74HC138DBR Image
SN74HC138DBR (1)

Manufacturer Part Number

SN74HC138DBR

Manufacturer

Texas Instruments

Introduction

The SN74HC138DBR is a high-speed Si-gate CMOS device and is pin compatible with low-power Schottky TTL (LSTTL).

Product Features and Performance

Designed to be used in high-performance memory-decoding or data-routing applications

High noise immunity characteristic of CMOS devices

Capable of driving 10 LSTTL loads

1-to-8 line decoder/demultiplexer with address latches

Product Advantages

Low power consumption

Wide operating voltage range (2V to 6V)

Balanced propagation delays and transition times

Significant power reduction compared to LSTTL logic ICs

SN74HC138DBR Image
SN74HC138DBR (2)

Key Technical Parameters

Type: Decoder/Demultiplexer

Circuit: 1 x 3:8

Independent Circuits: 1

Current Output High, Low: 5.2mA each

Voltage Supply Source: Single Supply

Voltage Supply: 2V to 6V

Operating Temperature: -40°C to 85°C

Mounting Type: Surface Mount

Package / Case: 16-SSOP

Supplier Device Package: 16-SSOP

Quality and Safety Features

Meets or exceeds all industry standards and requirements

Compatibility

Compatible with various microcontrollers and digital systems

Application Areas

Memory decoding

Data routing

Multiplexing

Product Lifecycle

Active status

Long standing product with Texas Instruments' support

Key Reasons to Choose This Product

High reliability and durability for extended use

Good thermal performance for a wide range of applications

Versatile functionality in digital circuitry

Availability of technical support and documentation from Texas Instruments

Suitable for complex logic systems due to low power dissipation and high speed

Frequently Asked Questions(FAQ)

How does the SN74HC138DBR handle fan-out requirements when driving multiple loads in a 74HC logic family system, and what are the implications for output current capability at typical supply voltages?
The SN74HC138DBR supports a maximum output current of ±5.2mA per channel under standard operating conditions at 4.5V supply voltage. This level of drive strength is sufficient for most CMOS logic interfacing within the same voltage domain, such as connecting to other 74HC-series ICs or enabling direct LED indicators with appropriate current-limiting resistors. However, when cascading multiple stages or driving capacitive loads beyond the recommended fan-out, additional buffering may be required to maintain signal integrity and avoid propagation delay degradation. At lower supply voltages like 2.5V, the effective output current margin reduces slightly due to reduced overdrive capability, which must be factored into design margins for robust operation across the full voltage range.
What is the minimum supply voltage at which the SN74HC138DBR can reliably decode address lines without risk of undefined logic levels, and how does this affect interface compatibility with mixed-voltage systems?
The SN74HC138DBR operates reliably down to 2V, but valid logic high inputs are guaranteed only when VCC ≥ 2.5V. Below this threshold, input thresholds become unreliable, potentially causing unintended decoder activation. For compatibility with 3.3V or 5V systems, the device maintains full functionality, but interfacing to 1.8V logic requires level-shifting circuitry unless the higher-voltage system provides compatible input thresholds. In mixed-voltage applications, ensuring that all control signals (G1, G2A, G2B) originate from a voltage domain compatible with the target supply ensures correct enable/disable behavior and prevents leakage through parasitic paths.
Can the SN74HC138DBR be used to implement a memory address decoder for a 64KB SRAM with byte-wide access, and if so, how should the chip select signals be generated?
Yes, the SN74HC138DBR can decode one of eight chip select lines from three address lines. To support 64KB addressing with byte-wide data, 16 unique chip selects are needed. Since the SN74HC138DBR only provides eight outputs, it must be cascaded with another decoder—such as an additional SN74HC138DBR using its enable pins as address inputs—to expand decoding capability. Alternatively, higher-pin-count decoders or logic combining outputs from two SN74HC138DBRs can generate the required sixteen CS lines. Care must be taken to ensure that only one CS is active at a time to prevent bus contention.
How does temperature variation between -40°C and 85°C impact propagation delay in the SN74HC138DBR, and what design considerations arise for high-speed switching applications?
Propagation delay in the SN74HC138DBR typically ranges from 10ns to 25ns depending on load and supply voltage, but increases by approximately 30–50% at 85°C compared to room temperature due to degraded carrier mobility in CMOS transistors. While this remains acceptable for many digital control tasks, synchronous designs requiring tight timing margins may need to insert pipeline stages or use faster families like 74HCT or 74LVC. Thermal derating should also consider power dissipation in the 16-SSOP package, especially when multiple outputs are active simultaneously, to avoid localized heating affecting reliability.
What happens to the output states of the SN74HC138DBR when all enable inputs (G1, G2A, G2B) are inactive, and how does this compare to other common decoder architectures?
When any of the enable conditions are not met—specifically, when G1 = L, G2A = H, or G2B = H—all outputs of the SN74HC138DBR go high impedance (tri-state). Unlike some open-collector decoders, the HC family uses active CMOS outputs, so during disable mode, each output presents a high-impedance state rather than actively pulling high. This differs from older TTL decoders that might float low; here, proper PCB layout and pull-down resistors may be needed if unused outputs connect to sensitive inputs. This tri-state behavior enables safe bus sharing in multi-device systems provided enable signals are mutually exclusive.
Is it possible to cascade two SN74HC138DBR devices to increase the number of decoded outputs, and what are the critical timing and control considerations?
Cascading two SN74HC138DBRs is feasible and commonly done to extend decoding depth. One unit serves as the primary decoder using A0–A2, while the second uses its enable pins (G1, G2A, G2B) as extended address bits. For example, connecting G1 to A3 and tying G2A/G2B to ground allows selection among 16 outputs using four address lines. However, the total propagation delay doubles, increasing worst-case transition times. Additionally, ensure that only one chip’s enable path is active at any time to prevent output contention. Synchronization with clock edges becomes more critical in synchronous designs, necessitating careful analysis of setup/hold margins under worst-case delays.
How should decoupling capacitors be placed for the SN74HC138DBR in a high-noise industrial environment, and what capacitance values provide optimal performance?
Each VCC pin of the SN74HC138DBR should have a 0.1µF ceramic capacitor mounted as close as possible—within 5mm—of the package leads to suppress high-frequency noise. A larger bulk capacitor (e.g., 10µF tantalum or electrolytic) near the power entry point helps stabilize supply rails under transient loads. In noisy environments like motor drives or switch-mode power supplies, adding ferrite beads between the main supply and the IC’s VCC pin further isolates the logic from conducted interference. These measures reduce ground bounce and improve immunity to voltage dips that could cause glitching on sensitive enable inputs.
What is the recommended method for verifying correct operation of the SN74HC138DBR before integrating it into a final PCB design?
Functional verification begins with a bench test using a microcontroller or FPGA to cycle through all combinations of address (A0–A2) and enable (G1, G2A, G2B) inputs while monitoring outputs with an oscilloscope or logic analyzer. Expected behavior includes exactly one output low per enabled address and all others high when enabled, with no cross-talk between channels. Power sequencing should respect VCC rise time (<100ms typical), and output loads should simulate expected fan-out (e.g., 10pF + 500Ω equivalent). Automated test scripts can validate timing constraints like tPLH/tPHL against datasheet curves across the full temperature and voltage range to catch marginal cases early.
How does the SN74HC138DBR compare to the CD74HC138M from Texas Instruments in terms of package and thermal performance for space-constrained designs?
The SN74HC138DBR uses a 16-lead SSOP package (5.30mm width), whereas the CD74HC138M comes in a DIP-16, offering identical electrical characteristics but larger footprint. The SSOP form factor enables higher component density in compact PCBs, making the SN74HC138DBR preferable for modern surface-mount layouts. Thermal resistance (θJA) is marginally better in SSOP due to closer copper attachment, but both packages share similar power dissipation limits (~200mW). When selecting between them, consider assembly process compatibility and whether through-hole mounting is required; otherwise, the SN74HC138DBR offers superior integration potential.
Can the SN74HC138DBR drive inductive loads such as relays directly, and what protection components are essential for reliable long-term operation?
Direct driving of inductive loads like relays is not recommended due to back-EMF generation when switching off, which can exceed the IC’s absolute maximum ratings. Instead, use a transistor or MOSFET buffer stage with a flyback diode across the relay coil. If direct drive is attempted, include series resistors (100–470Ω) to limit peak current and clamp diodes rated for >6V reverse breakdown to protect outputs. Even then, cumulative stress from repeated switching degrades junction reliability over time. Always verify that average power dissipation remains below 200mW to avoid thermal failure in the 16-SSOP package.
What role do the enable inputs (G1, G2A, G2B) play in preventing ghosting or incorrect device selection, and how should they be managed during system reset sequences?
The enable logic ensures that only one decoder output is active at a time, preventing unintended activation during power-up transients when address lines might float. During system reset, all control signals should be held in the disabled state until the microcontroller or host controller initializes and takes ownership of address decoding. Pull-up resistors on G2A and G2B (typically 10kΩ to VCC) and a grounded G1 ensure the decoder remains inactive until explicitly enabled. This avoids accidental peripheral activation before firmware is ready, reducing EMI risks and protecting downstream circuitry from premature enable events.
How does the moisture sensitivity level (MSL) classification of MSL 1 for the SN74HC138DBR affect storage and handling in automated manufacturing environments?
With an MSL rating of 1, the SN74HC138DBR is considered non-hygroscopic and can withstand unlimited exposure to ambient humidity before baking is required. This simplifies handling in tape-and-reel packaging during SMT assembly, allowing immediate processing after unpacking without special dry storage. However, operators should still minimize exposure to extreme humidity (>60% RH) to prevent condensation during thermal cycling, which could lead to popcorning in adjacent components. Standard ESD protocols (IEC 61340) remain mandatory regardless of MSL status.
What are the key differences between the SN74HC138DBR and the SN74HCT138DBR when interfacing with TTL-level control signals, and why would one choose HCT over HC?
The SN74HC138DBR has CMOS-compatible input thresholds suitable for 5V systems, while the SN74HCT138DBR accepts TTL-level inputs (VIL ≤ 0.8V, VIH ≥ 2.0V) even at 5V VCC, making it ideal for direct connection to 74LS or 74ALS logic without level shifters. Both share identical output characteristics and package, but HCT draws slightly higher quiescent current. Choose HCT when driving legacy TTL control buses; otherwise, HC suffices for pure CMOS environments and offers lower power consumption. Neither supports 3.3V-to-5V bidirectional translation natively, so external buffers may still be needed in mixed-domains.
How should unused decoder outputs of the SN74HC138DBR be handled to prevent floating inputs on connected peripherals and ensure predictable system behavior?
Unused outputs should either be left unconnected (since they are high-impedance when inactive) or tied to VCC via 10kΩ resistors if there's concern about noise coupling. However, note that active outputs already drive high, so tying unused ones high doesn’t change state. More importantly, ensure that any peripheral connected to these lines has defined input thresholds and doesn’t rely on weak pull-ups that could interact with the decoder’s output impedance. In systems where multiple devices share a bus, coordination of enable signals prevents contention, making individual output termination less critical than global enable management.
What is the typical power consumption of the SN74HC138DBR during active switching versus standby, and how does this influence battery-powered application design?
Quiescent current is typically <1µA at 5V and room temperature, rising modestly to ~10µA at 6V. Active power depends on output transitions: each output switching at frequency f with load capacitance CL consumes approximately P ≈ C × V² × f per transition. For example, toggling all eight outputs at 100kHz with 10pF each yields ~4mW at 5V. In battery-operated devices, minimizing switching activity and using lower VCC (e.g., 3.3V) reduces dynamic power significantly. Sleep modes that disable unused decoders further extend runtime, making the SN74HC138DBR suitable for intermittent address decoding in low-power embedded controllers.
How does the SSOP-16 package of the SN74HC138DBR compare thermally to SOIC variants in continuous high-load scenarios, and what PCB layout practices optimize heat dissipation?
The SSOP package has slightly better thermal conductivity than SOIC due to smaller lead pitch and closer copper attachment, but both exhibit similar θJA (~120°C/W). Under continuous operation with multiple outputs sinking 5mA each, junction temperature rise can reach 30–40°C above ambient, which is acceptable given the 85°C max rating. To enhance cooling, place thermal vias beneath the exposed pad (if available) and connect to internal ground planes. Avoid routing high-speed traces over the package to prevent coupling-induced noise. Keep copper pours around the device to act as a heatsink, especially in enclosed or poorly ventilated enclosures.
Can the SN74HC138DBR be used in redundant or voting logic architectures for fault-tolerant systems, and what limitations apply?
While technically possible, using multiple SN74HC138DBRs in parallel for redundancy introduces complexity without inherent fault tolerance due to lack of built-in arbitration. If one decoder fails low permanently, it could force multiple peripherals active simultaneously. Voting logic requires comparators or logic gates to detect inconsistencies, adding overhead. For safety-critical applications, dedicated fail-operational ICs with diagnostic features are preferred. The SN74HC138DBR remains useful as a building block, but system-level redundancy must be implemented externally through watchdog timers, dual-bank firmware, or hardware monitors rather than relying solely on the decoder itself.
What precautions should be taken when prototyping the SN74HC138DBR on a breadboard, and why might results differ from PCB performance?
Breadboard parasitics—including 2–5nH inductance per contact and 1–2pF stray capacitance—can distort fast edge rates and introduce ringing, especially noticeable when driving capacitive loads. Use short jumpers and minimize loop areas to reduce EMI susceptibility. Avoid connecting unused inputs to power rails without pull-downs, as floating enables can cause erratic behavior. Always verify enable logic sequencing first before loading outputs. For accurate characterization, transition to a breakout board or custom PCB early, as breadboard effects become pronounced at frequencies above 1–2MHz, masking real-world timing margins.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN74HC138DBR

Product Attribute SN74HC138ADBR SN74HC138DR SN74HC138DB SN74HC138DRE4
Part Number SN74HC138ADBR SN74HC138DR SN74HC138DB SN74HC138DRE4
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Circuit - - - -
Voltage Supply Source - - - -
Independent Circuits - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Type - - - -
Voltage - Supply - - - -
Current - Output High, Low - - - -

SN74HC138DBR Datasheet PDF

Download SN74HC138DBR pdf datasheets and Texas Instruments documentation for SN74HC138DBR - Texas Instruments.

Datasheets
SN54HC138, SN74HC138.pdf

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SN74HC138DBR Image

SN74HC138DBR

Texas Instruments
32D-SN74HC138DBR

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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