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HomeProductsIntegrated Circuits (ICs)Logic - Flip FlopsSN74LVC2G74YZPR
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SN74LVC2G74YZPR - Texas Instruments

Manufacturer Part Number
SN74LVC2G74YZPR
Manufacturer
Texas Instruments
Allelco Part Number
32D-SN74LVC2G74YZPR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
76,500 pcs available, New & Original
Parts Description
IC FF D-TYPE SNGL 1BIT 8DSBGA
Package
8-DSBGA (1.9x0.9)
Data sheet
SN74LVC2G74YZPR.pdf

HTML Datasheet

SN74LVC2G74.pdf
RoHs Status
ROHS3 Compliant
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Specifications

SN74LVC2G74YZPR Tech Specifications
Texas Instruments - SN74LVC2G74YZPR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - SN74LVC2G74YZPR

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply 1.65V ~ 5.5V
Type D-Type
Trigger Type Positive Edge
Supplier Device Package 8-DSBGA (1.9x0.9)
Series 74LVC
Package / Case 8-XFBGA, DSBGA
Package Tape & Reel (TR)
Output Type Complementary
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Number of Elements 1
Number of Bits per Element 1
Mounting Type Surface Mount
Max Propagation Delay @ V, Max CL 5.4ns @ 5V, 50pF
Input Capacitance 5 pF
Function Set(Preset) and Reset
Current - Quiescent (Iq) 10 µA
Current - Output High, Low 32mA, 32mA
Clock Frequency 140 MHz
Base Product Number 74LVC2G74

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

SN74LVC2G74YZPR Image
SN74LVC2G74YZPR (1)

Manufacturer Part Number

SN74LVC2G74YZPR

Manufacturer

Texas Instruments

Introduction

The SN74LVC2G74YZPR from Texas Instruments is a single, D-type flip-flop logic device, designed for high-speed applications and specified for operation from -40°C to 85°C.

Product Features and Performance

D-Type Flip Flop with Set(Preset) and Reset functions.

Complementary output for flexible applications.

High Clock Frequency support up to 140 MHz.

Low propagation delay: 5.4ns at max conditions.

Positive Edge trigger type for precise control.

Supports a wide voltage supply range from 1.65V to 5.5V.

Product Advantages

Low Quiescent Current (Iq) of 10 µA for power efficiency.

High Output Current (32mA) for driving loads directly.

Wide operating temperature range supports versatile applications.

Small Input Capacitance of 5 pF for faster response.

Available in ultra-compact 8-DSBGA package for space-sensitive designs.

Key Technical Parameters

Max Clock Frequency: 140 MHz

Max Propagation Delay: 5.4ns @ 5V, 50pF

Supply Voltage: 1.65V ~ 5.5V

Output Current: 32mA (High and Low)

Quiescent Current: 10 µA

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Manufactured by Texas Instruments, a leader in semiconductor solutions.

Compliant with the stringent quality standards of the semiconductor industry.

Compatibility

Compatible with a wide range of digital systems thanks to its flexible supply voltage.

Suitable for interfacing with both 3.3V and 5V logic levels.

Application Areas

Digital electronics requiring high-speed operation.

Clock division circuits.

Data storage systems.

Signal conditioning applications.

Consumer electronics.

Product Lifecycle

Currently in an Active status, not nearing discontinuation.

Supported by Texas Instruments with potential for future upgrades or replacements.

Several Key Reasons to Choose This Product

High-speed performance suitable for demanding applications.

Broad supply voltage range increases compatibility.

Ultra-low power consumption enhances system efficiency.

Robust temperature range for reliable operation in varied environments.

Compact package ideal for space-constrained applications.

Quality assurance from Texas Instruments.

Frequently Asked Questions(FAQ)

How does the propagation delay of SN74LVC2G74YZPR compare to other single-bit D-type flip-flops in the 74LVC family, and what design implications arise when operating at 140 MHz clock frequency?
The SN74LVC2G74YZPR exhibits a maximum propagation delay of 5.4 ns under worst-case conditions (5V supply, 50 pF load), which is typical for low-voltage CMOS logic in this package configuration. At its specified maximum clock frequency of 140 MHz, the device must complete both setup and hold times within one clock cycle (approximately 7.14 ns). This means that input signals must be stable well before the rising edge of the clock, and internal node delays must not accumulate beyond the available timing budget. Compared to similar single-element flip-flops like the SN74LVC2G374 or dual-stage variants such as SN74LVC2G86, the SN74LVC2G74YZPR trades slightly higher propagation delay for reduced pin count and smaller footprint. Designers targeting high-speed data capture in space-constrained applications often select this part when moderate speed (under 150 MHz) and low power are prioritized over ultra-low latency.
What are the key differences between using the SN74LVC2G74YZPR with 3.3V versus 5V supply rails, particularly regarding output drive strength and noise margin?
When powered at 3.3V, the SN74LVC2G74YZPR maintains full backward compatibility with 5V-tolerant inputs, but its output high/low currents drop proportionally—typically around 24 mA instead of the rated 32 mA at 5V. More importantly, the noise margins shrink compared to 5V operation: at 3.3V, the logic high threshold is approximately 0.7 × VCC = 2.31V, while logic low is about 0.3 × VCC = 0.99V, resulting in narrower tolerance to voltage fluctuations. In contrast, at 5V, the thresholds expand to ~3.5V and ~1.5V respectively, offering greater immunity to noise. While the core functionality remains identical across the 1.65V–5.5V range, driving long traces or capacitive loads may require careful layout to meet timing without exceeding thermal limits, especially near lower supply voltages where current per pin is reduced.
Can the SN74LVC2G74YZPR safely interface directly with 5V microcontroller GPIO pins without level shifting, and what precautions apply?
Yes, the SN74LVC2G74YZPR accepts 5V logic levels on its inputs even when powered down or operating at lower voltages due to its 5.5V absolute maximum rating and CMOS input protection circuitry. However, if the IC itself operates below 5V (e.g., 3.3V), the output high voltage will also be reduced accordingly (~2.9V at 3.3V), which may violate minimum input high requirements of downstream 5V devices. Therefore, bidirectional communication requires either shared power domains or explicit level translation. For unidirectional control from a 5V MCU to a 3.3V subsystem using SN74LVC2G74YZPR, direct connection is acceptable; however, feeding its output back into a 5V system without buffering risks undefined states due to insufficient drive voltage.
Why might a designer choose the DSBGA package over standard SOIC for multiple instances of SN74LVC2G74YZPR in a compact PCB layout?
The 8-DSBGA package used by SN74LVC2G74YZPR occupies significantly less board area than equivalent SOIC packages—typically under 0.5 mm² per device—making it ideal for densely populated digital systems such as sensor interfaces or addressable LED controllers. Its small size reduces parasitic capacitance and inductance, contributing to better signal integrity at higher frequencies. However, DSBGA demands precise reflow soldering with solder paste stencils calibrated to pad dimensions and requires X-ray inspection for quality assurance due to hidden joints beneath the chip. For designs requiring high reliability in harsh environments or automated assembly lines, the trade-off between miniaturization effort and manufacturing yield must be evaluated against functional requirements.
How does the quiescent current of SN74LVC2G74YZPR impact battery-powered applications, and what strategies minimize power consumption during idle periods?
With a quiescent current of just 10 µA maximum, the SN74LVC2G74YZPR contributes negligibly to static power draw in low-power systems. Nevertheless, total energy consumption depends heavily on dynamic switching activity: each transition consumes charge proportional to load capacitance and supply voltage squared. To further reduce power, designers can disable unused outputs via enable pins (if available), reduce clock frequency during inactive modes, or switch to sleep states where possible. Since this device lacks an explicit enable function, clock gating becomes essential—only asserting the clock edge when new data needs to be latched minimizes unnecessary toggling. Additionally, selecting appropriate pull-up/pull-down resistors and ensuring clean reset sequences prevent unintended state changes that could increase average current.
What are the limitations of cascading two SN74LVC2G74YZPR flip-flops to create a two-stage synchronizer, and how do metastability risks scale with clock skew?
Cascading two instances of SN74LVC2G74YZPR to form a double-synchronizer mitigates metastability risk associated with asynchronous input signals crossing clock domains. However, the effectiveness depends critically on consistent clock distribution—any skew between the two stages introduces a window during which the first flip-flop’s output may be unstable when sampled by the second. Assuming a typical metastability resolution time of 100 ps for LVC series parts, a clock period of 7.14 ns allows ample recovery margin, but excessive jitter or long interconnects degrade this window. Moreover, each added stage increases overall latency by roughly twice the propagation delay (≈10.8 ns round-trip), which may violate timing budgets in real-time control loops. Thus, while doubling synchronization improves reliability, it comes at the cost of increased delay and potential throughput reduction.
How does input capacitance affect signal integrity when driving SN74LVC2G74YZPR from long traces or high-impedance sources?
The SN74LVC2G74YZPR presents only 5 pF of input capacitance per pin, which is relatively low compared to older TTL families. Nonetheless, when driven from sources with output impedance above 50 Ω through transmission lines longer than λ/10 (≈5 cm at 100 MHz), reflections and ringing become problematic. A 5 pF load combined with a 1 kΩ source resistance forms an RC time constant of 5 ns, potentially distorting fast edges. To maintain signal integrity, termination networks—such as series resistors at the source end or parallel termination at the receiver—are recommended. Alternatively, reducing trace length or inserting buffer stages helps preserve rise/fall times below 1/3 of the clock period, ensuring reliable triggering without excessive overshoot or undershoot that could trigger false transitions.
Is it acceptable to use SN74LVC2G74YZPR outside its specified temperature range (-40°C to +85°C), and what failure mechanisms emerge at extremes?
Operating SN74LVC2G74YZPR beyond -40°C to +85°C risks violating semiconductor reliability specifications, though brief excursions may not immediately cause failure. At temperatures below -40°C, carrier mobility decreases, increasing propagation delay and potentially violating setup/hold constraints. Above +85°C, electromigration in aluminum interconnects accelerates, leading to open circuits over time, while gate oxide degradation may reduce insulation resistance. Furthermore, moisture ingress during high-temperature storage without proper packaging (despite MSL 1) can cause popcorning during reflow. Industrial-grade alternatives with extended temperature ranges exist, but for most consumer electronics meeting JEDEC standards, staying within the stated bounds ensures predictable performance and longevity.
How should PCB layout considerations differ when routing clock and data lines near SN74LVC2G74YZPR compared to larger BGA packages?
Although SN74LVC2G74YZPR uses a miniature DSBGA footprint, its 8-ball array still requires attention to return path continuity and reference plane stitching beneath signal traces. Clock lines should avoid crossing splits in ground planes, and differential pairs—if applicable—must maintain matched lengths within ±50 mil. Decoupling capacitors (0.1 µF ceramic) must be placed within 2 mm of the VCC/GND balls to suppress high-frequency noise. Due to the tiny pitch of the balls, vias under the package should be avoided to prevent solder wicking and cold joints. Thermal relief patterns on adjacent planes help manage localized heating during reflow, though the device itself dissipates minimal power (<1 mW at 5V idle).
What role does the preset and clear functionality play in system initialization when using SN74LVC2G74YZPR, and how does it interact with asynchronous inputs during active operation?
The SN74LVC2G74YZPR includes dedicated preset (active-low) and clear (active-high) inputs that override normal D-input behavior regardless of clock state. These asynchronous controls allow deterministic initialization during power-up by forcing the output to logic high or low before the first clock edge arrives. Once the system enters normal operation, asserting either PRESET or CLEAR asynchronously forces the Q output to a known state, which then follows D upon the next clock edge after deassertion. Care must be taken to ensure PRESET and CLEAR are never asserted simultaneously, as this condition results in an indeterminate output state. Proper debouncing or glitch filtering on these lines prevents accidental resets caused by switch bounce or noise spikes.
How does package thermal resistance affect performance in continuous high-load scenarios involving repeated clocking of SN74LVC2G74YZPR?
While SN74LVC2G74YZPR consumes minimal power (typically <10 mW under full switching), continuous toggling at high frequency generates heat proportional to dynamic dissipation: P_dyn = α × C_L × VDD² × f_clock. In DSBGA packages, the junction-to-air thermal resistance is relatively high (~150°C/W), limiting self-heating even under sustained loads. At 140 MHz with 50% duty cycle and 5V supply driving moderate loads, temperature rise remains modest (<5°C), preserving reliability. However, in enclosed systems with poor airflow or stacked PCBs, cumulative heating from multiple ICs could push ambient temperatures toward 85°C, reducing effective headroom for transient thermal events. Monitoring case temperature during burn-in testing provides empirical validation of thermal margins.
Can SN74LVC2G74YZPR replace a latch in applications requiring transparent data capture, and what timing constraints apply?
No, SN74LVC2G74YZPR is strictly edge-triggered and cannot replicate latch behavior. Attempting to use it as a transparent buffer results in unpredictable outputs because data appears at Q only after the clock edge, not continuously while EN is high. If transparency is required, alternative devices such as SN74LVC2G374 (which combines DFF with transparent latch) must be used instead. Even then, designers must account for propagation delay asymmetry between clock-to-Q and enable-to-output paths, which can introduce race conditions when switching between modes rapidly. For synchronous systems where immediate response to input changes isn’t critical, edge-triggered FF suffices; otherwise, architectural redesign with compatible latch-based components is necessary.
How do ESD protection ratings influence long-term reliability when handling SN74LVC2G74YZPR in production environments?
Although not explicitly listed in the provided parameters, TI typically implements Class II ESD protection (>2 kV HBM) in LVC series devices like SN74LVC2G74YZPR. Handling according to ANSI/ESDA/JEDEC JS-001 standards minimizes damage from static discharge during manual assembly or automated pick-and-place operations. However, improper grounding, conductive flooring, or lack of wrist straps increase field-induced failures, especially in humid climates where surface resistivity drops. Implementing IEC 61000-4-2 compliant test procedures before shipping verifies robustness against real-world electrostatic events. Despite robust protection, cumulative exposure over thousands of cycles can degrade junction isolation, accelerating aging effects in marginal designs.
What considerations apply when integrating SN74LVC2G74YZPR into automotive-grade systems requiring functional safety certification?
Automotive applications demand stricter reliability criteria than commercial grades, including AEC-Q100 qualification, which SN74LVC2G74YZPR generally does not meet. Without this certification, substitution into safety-critical circuits voids warranty claims and fails OEM audit requirements. Even if functionally adequate, lack of failure mode analysis, accelerated life testing, and production part approval processes (PPAP) disqualifies the component for ASIL-rated systems. For non-safety functions in infotainment or body electronics, commercial grade may suffice, but traceability to lot codes, conformal coating compatibility, and radiation hardness (for space applications) remain secondary concerns beyond basic datasheet compliance.
How does the choice between tape-and-reel vs. tube packaging affect inventory management and assembly line throughput for SN74LVC2G74YZPR?
SN74LVC2G74YZPR is supplied in Tape & Reel (TR), enabling fully automated pick-and-place processing without manual intervention. This format supports continuous feed rates up to 2,500 units/hour on modern SMT machines, minimizing labor costs and human error. Tube packaging would necessitate batch loading/unloading, slowing cycle times and increasing contamination risk. However, TR reels require careful handling to prevent tape deformation or moisture absorption before sealing; maintaining storage below 40% RH and within 3 months of opening preserves MSL 1 status. Journals and anti-static bags further protect delicate DSBGA components during transport between warehouse and production floor.
What happens to clock-to-Q timing when SN74LVC2G74YZPR drives heavy capacitive loads beyond 50 pF?
Exceeding the recommended 50 pF load capacitance increases propagation delay nonlinearly due to RC time constants at the output stage. Beyond 50 pF, the SN74LVC2G74YZPR’s drive transistors enter saturation earlier, slowing edge transitions and extending tPLH/tPHL. For every additional 10 pF, delay may increase by 0.5–1 ns depending on slew rate requirements. Driving more than 100 pF without buffering risks failing timing budgets at 140 MHz, especially if trace inductance adds ringing. In such cases, adding a buffer stage (even another SN74LVC2G74YZPR in parallel) or switching to LVCMOS buffers with higher fanout capability resolves issues, albeit at cost of added area and power.
How does supply rail sequencing impact startup behavior of circuits using SN74LVC2G74YZPR, and what safeguards prevent latch-up?
Simultaneous application of VCC and GND within the 1.65V–5.5V window ensures correct initialization of SN74LVC2G74YZPR. However, abrupt power-on/off transients exceeding 0.7V differential between rails may induce parasitic thyristor action (latch-up), particularly if substrate contacts are poorly decoupled. TI designs LVC series with guard rings and deep N-wells to suppress this, but inadequate bypass capacitance or long leads elevate risk. Implementing soft-start circuits or using power supervisors with reset generation prevents premature assertion of PRESET/CLEAR before stable supplies arrive. Also, avoiding simultaneous switching of multiple high-capacitance loads on shared regulators reduces inrush current spikes that could momentarily collapse local VDD.
Are there any known errata or silicon revisions affecting SN74LVC2G74YZPR that impact production designs?
As of current public documentation, Texas Instruments lists no errata specific to SN74LVC2G74YZPR beyond general LVC family guidelines, such as input hysteresis variations across process corners or minor deviations in absolute maximum ratings under pulsed conditions. However, always consulting the latest SPCE099 revision in the datasheet and cross-referencing with TI’s Errata Sheet for 74LVC series ensures awareness of subtle timing anomalies or undocumented features. For mission-critical deployments, requesting samples from recent production lots enables pre-production validation against observed behavior before committing to full-scale manufacturing.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments SN74LVC2G74YZPR

Product Attribute SN74LVC2G74YEPR SN74LVC2G74YZAR SN74LVC2G79YZPR SN74LVC2G79YEPR
Part Number SN74LVC2G74YEPR SN74LVC2G74YZAR SN74LVC2G79YZPR SN74LVC2G79YEPR
Manufacturer Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Current - Output High, Low - - - -
Trigger Type - - - -
Clock Frequency - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of Bits per Element - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Current - Quiescent (Iq) - - - -
Number of Elements - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Voltage - Supply - - - -
Max Propagation Delay @ V, Max CL - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Output Type - Current - Unbuffered Voltage - Buffered -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Input Capacitance - - - -
Series - - - -
Type - - - -
Function - - - -

SN74LVC2G74YZPR Datasheet PDF

Download SN74LVC2G74YZPR pdf datasheets and Texas Instruments documentation for SN74LVC2G74YZPR - Texas Instruments.

PCN Assembly/Origin
Qualification Revision B 29/May/2014.pdf
HTML Datasheet
SN74LVC2G74.pdf

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SN74LVC2G74YZPR Image

SN74LVC2G74YZPR

Texas Instruments
32D-SN74LVC2G74YZPR

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