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HomeProductsIntegrated Circuits (ICs)Linear - Amplifiers - Instrumentation, OP Amps, Buffer AmpsTLV2322ID
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TLV2322ID - Texas Instruments

Manufacturer Part Number
TLV2322ID
Manufacturer
Texas Instruments
Allelco Part Number
32D-TLV2322ID
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
18,395 pcs available, New & Original
Parts Description
IC CMOS 2 CIRCUIT 8SOIC
Package
8-SOIC
Data sheet
TLV2322ID.pdf

PCN Obsolescence/ EOL

EOL 22/May/2023.pdf
RoHs Status
ROHS3 Compliant
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Specifications

TLV2322ID Tech Specifications
Texas Instruments - TLV2322ID technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - TLV2322ID

Product Attribute Attribute Value
Manufacturer Texas Instruments
Voltage - Supply Span (Min) 2 V
Voltage - Supply Span (Max) 8 V
Voltage - Input Offset 1.1 mV
Supplier Device Package 8-SOIC
Slew Rate 0.03V/µs
Series LinCMOS™
Package / Case 8-SOIC (0.154", 3.90mm Width)
Package Tube
Output Type -
Product Attribute Attribute Value
Operating Temperature -40°C ~ 85°C (TA)
Number of Circuits 2
Mounting Type Surface Mount
Gain Bandwidth Product 85 kHz
Current - Supply 20µA (x2 Channels)
Current - Output / Channel 30 mA
Current - Input Bias 0.6 pA
Base Product Number TLV2322
Amplifier Type CMOS

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99

Parts Introduction

TLV2322ID Image
TLV2322ID (1)

Manufacturer Part Number

TLV2322ID

Manufacturer

Texas Instruments

Introduction

The TLV2322ID is a dual operational amplifier IC designed for general-purpose applications.

Product Features and Performance

Dual operational amplifier in a single package

Wide supply voltage range of 2V to 8V

Low input offset voltage of 1.1mV

High gain bandwidth of 85kHz

Low input bias current of 0.6pA

Rail-to-rail output swing

Low quiescent current of 20μA per amplifier

Slew rate of 0.03V/μs

Product Advantages

Versatile dual op-amp in a compact SOIC-8 package

Suitable for a wide range of analog circuit designs

Excellent DC and AC performance characteristics

Low power consumption for battery-powered applications

Key Technical Parameters

Number of Circuits: 2

Gain Bandwidth Product: 85kHz

Supply Voltage Range: 2V to 8V

Output Current per Channel: 30mA

Input Offset Voltage: 1.1mV

Input Bias Current: 0.6pA

Slew Rate: 0.03V/μs

Quality and Safety Features

RoHS3 compliant

Operating temperature range: -40°C to 85°C

Compatibility

8-SOIC (0.154", 3.90mm Width) package

Surface mount mounting type

Application Areas

General-purpose analog circuit design

Instrumentation and measurement applications

Battery-powered portable devices

Sensor conditioning and signal processing

Product Lifecycle

The TLV2322ID is an active product and is not nearing discontinuation.

Replacement or upgrade options may be available from Texas Instruments.

Key Reasons to Choose This Product

Excellent DC and AC performance characteristics

Wide supply voltage range suitable for various applications

Low power consumption for battery-powered designs

Compact and versatile dual op-amp in a space-saving SOIC-8 package

Reliable and long-lasting performance due to RoHS3 compliance and wide temperature range

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the TLV2322ID for low-power sensor signal conditioning in battery-operated devices?
The TLV2322ID offers exceptionally low supply current of 20 µA per channel, making it suitable for energy-constrained applications. However, this power efficiency comes with a modest slew rate of 0.03 V/µs and a gain bandwidth product of only 85 kHz. These characteristics limit its effectiveness in driving high-speed transients or amplifying signals requiring wide dynamic range. Designers must balance noise performance and input bias current (0.6 pA) against speed requirements. For slow-changing sensor outputs like thermistors or photodiodes, these limitations are acceptable, but they would introduce significant distortion in piezoelectric transducer interfaces or high-impedance capacitive load scenarios.
How does the TLV2322ID compare to other CMOS amplifiers in terms of offset voltage stability under varying supply conditions?
With an initial input offset voltage of 1.1 mV, the TLV2322ID provides better than average precision for a CMOS amplifier in its class. When compared to higher-performance op amps like the LTC2067, which offer sub-100 µV offsets but at much higher power, the TLV2322ID represents a middle ground. Unlike precision bipolar-input amplifiers, CMOS devices like this one exhibit more pronounced offset drift with temperature—approximately 5–10 µV/°C typical. This makes the TLV2322ID less ideal for DC-coupled amplification over wide temperature ranges unless trimmed or compensated in firmware. Its LinCMOS architecture ensures rail-to-rail output swing within the 2V to 8V operating range, improving signal headroom relative to non-RRO parts.
Can the TLV2322ID reliably drive capacitive loads common in modern communication front-ends without instability?
The TLV2322ID has limited capability to drive capacitive loads due to its low unity-gain bandwidth and moderate phase margin. While it can manage small capacitances (<100 pF) in non-critical feedback paths, driving larger loads such as those found in antenna matching networks or long cable terminations often leads to ringing or oscillation. In comparison to dedicated unity-gain stable amplifiers like the OPA333, the TLV2322ID lacks internal compensation tailored for high-capacitive loads. If used in such configurations, a series isolation resistor (typically 10–100 Ω) is recommended between the output and the capacitor, though this reduces output drive efficiency and may affect settling behavior in fast-switching systems.
What layout considerations are essential when using the TLV2322ID in mixed-signal environments to minimize noise coupling?
Given its ultra-low input bias current and sensitivity to parasitic capacitance, the TLV2322ID requires careful PCB layout to preserve signal integrity. Input traces should be kept short and shielded from digital switching nodes. Guard rings around sensitive nodes help reduce leakage currents. The 8-SOIC package has moderate thermal resistance, so adequate copper pour on adjacent layers aids heat dissipation during continuous high-output-current operation. Since the device consumes only 20 µA total, thermal management is less critical than in high-power designs, but decoupling capacitors (100 nF ceramic placed close to V+ and V− pins) remain vital to suppress supply-induced ripple, especially in single-supply configurations where the amplifier operates near ground.
Is the TLV2322ID suitable for use in medical instrumentation requiring high CMRR and low drift over time?
While the TLV2322ID offers respectable DC precision for a CMOS op amp, its common-mode rejection ratio (CMRR) is typically limited to 80 dB or lower, which falls short of what’s expected in precision medical equipment. Devices such as the INA128 or ADS1298 provide far superior CMRR and integrated front-end features. The TLV2322ID’s 0.03 V/µs slew rate also constrains its ability to handle rapid physiological signal changes accurately. Therefore, while usable in simple analog conditioning stages for ECG peripherals or glucose monitors, it should not serve as the primary gain stage in high-fidelity bioamplifiers without additional calibration and shielding.
How does the power consumption of the TLV2322ID impact system lifetime in IoT edge nodes powered by coin-cell batteries?
Operating at 20 µA per channel across a 2.5V supply yields roughly 100 µW total dissipation. In a dual-channel configuration drawing continuously, this results in approximately 26 mAh per year at 3V, significantly straining coin-cell capacity (e.g., CR2032 holds ~225 mAh). While this is competitive among general-purpose CMOS amplifiers, alternatives like the MCP6L02 consume even less current (0.5 µA max), offering longer lifetimes. Thus, the TLV2322ID is viable only if duty cycling or sleep modes are implemented, reducing average current below 1 µA. Otherwise, battery replacement frequency becomes impractical for maintenance-free deployments.
What substitution risks exist if replacing the TLV2322ID with the TLV2322IDR in an existing design?
Both the TLV2322ID and TLV2322IDR share identical electrical specifications and pinout, differing only in packaging: ID denotes tube packaging while IDR indicates reel packaging for automated assembly. Functionally interchangeable, the IDR variant is preferred in mass production for tape-and-reel handling. No circuit redesign is needed, but board-level inspection confirms correct footprint alignment. However, lead time and availability may vary; sourcing solely from ID may limit supply chain flexibility in high-volume manufacturing. Designers should update BOM references accordingly without altering schematic logic.
Why might a designer choose the TLV2322ID over a traditional JFET-input op amp despite its higher offset voltage?
Although JFET-input amplifiers often exhibit lower input bias current and slightly better linearity, the TLV2322ID’s CMOS architecture enables rail-to-rail output swing and operates down to 2V supplies—unachievable by most JFET parts. This makes it ideal for low-voltage, single-supply systems where full-scale signal utilization is critical. Additionally, its 30 mA output current exceeds many JFET devices, enabling direct drive of small loads without external buffering. When combined with its 0.6 pA bias current—lower than many JFETs—it avoids polarization current issues in high-impedance sources. Thus, despite the 1.1 mV offset, it excels in space-constrained, low-voltage applications where dynamic range outweighs absolute accuracy.
What are the implications of the TLV2322ID’s Moisture Sensitivity Level (MSL) rating of 1 for industrial deployment?
An MSL of 1 indicates that the TLV2322ID is not susceptible to moisture-induced damage under normal storage conditions and does not require baking before reflow soldering. This simplifies handling in harsh industrial environments where humidity fluctuations occur. Components can be stored indefinitely on open shelves without degradation, reducing logistics overhead compared to MSL 3 or higher parts. However, users must still follow standard ESD precautions during manual assembly, as all SOIC packages remain vulnerable to electrostatic discharge despite their robustness to humidity.
How does the TLV2322ID perform in single-supply versus dual-supply configurations regarding input common-mode range?
The TLV2322ID supports input voltages from 0V up to (V+ – 1.2V), allowing true single-supply operation down to 2V. In contrast, many traditional op amps require negative rails for proper input staging. This feature enables direct connection of sensor outputs referenced to ground without level-shifting circuitry. However, in single-supply mode, input signals must avoid the absolute minimum voltage (below ground), necessitating careful biasing. Dual-supply operation extends the effective common-mode range symmetrically around zero, useful for unipolar-to-bipolar signal conversion. Either way, the 85 kHz GBW ensures adequate response for audio or sensor data below 40 kHz bandwidths.
Are there hidden costs or compatibility concerns when integrating the TLV2322ID into legacy 5V microcontroller-based designs?
While the TLV2322ID can operate on 5V rails within its 2–8V specification, some microcontrollers output logic levels that approach the supply rail (e.g., 4.8V on 5V systems). Driving such outputs into the TLV2322ID’s input may violate absolute maximum ratings if the input exceeds V+ + 0.3V. Additionally, the 0.03 V/µs slew rate limits how quickly the op amp can respond to sharp digital edges, potentially causing latency in control loops. Though not inherently incompatible, designers must ensure interface margins and consider using clamping diodes or level translation if bidirectional signaling occurs. Furthermore, legacy footprints may lack optimal thermal relief, increasing risk of cold joints during hand-soldering.
What role does the LinCMOS™ technology play in the reliability and noise performance of the TLV2322ID?
LinCMOS™ combines CMOS input stages with complementary bipolar output transistors, enabling both low input bias current (0.6 pA) and robust output drive (30 mA). This hybrid approach improves linearity and reduces crossover distortion compared to pure CMOS designs. It also enhances immunity to latch-up—a concern in older CMOS technologies—improving yield and long-term reliability. Noise-wise, the device exhibits input-referred voltage noise around 40 nV/√Hz at 1 kHz, which is reasonable for its power class. However, this increases in higher bandwidths, limiting suitability for ultra-low-noise applications like ultrasound preamplifiers where specialized JFET or bipolar inputs dominate.
Can the TLV2322ID be safely used in automotive-grade temperature monitoring circuits spanning -40°C to 85°C?
Yes, the TLV2322ID is specified for operation across -40°C to 85°C, meeting standard commercial industrial ranges. Automotive applications often require wider ranges (-40°C to 125°C), so this part alone wouldn’t qualify for full AEC-Q100 compliance. However, it suffices for non-safety-critical monitoring tasks such as cabin temperature sensing or battery thermal management, provided the surrounding system meets functional safety standards independently. Parameter drift over temperature—especially offset voltage and gain—should still be accounted for in calibration routines. Its low quiescent current further benefits battery-powered telemetry units in remote sensors.
How does the TLV2322ID’s output current capability compare to its slew rate in driving resistive loads?
The TLV2322ID delivers up to 30 mA per channel into resistive loads, which is sufficient for most analog signal chains. However, the 0.03 V/µs slew rate imposes a fundamental limit on how fast the output can ramp under large swings. For example, transitioning from 0V to 5V requires about 167 µs—too slow for PWM demodulation or fast ADC sampling. In such cases, even though the output can sink/source 30 mA, the amplifier cannot keep up dynamically. This mismatch means high-current capability doesn’t translate to high-speed performance, requiring external buffers or faster op amps for demanding drive applications.
What verification steps are recommended before finalizing the TLV2322ID in a production-ready analog front end?
Before locking the design, validate real-world behavior including startup transient response, PSRR under load, and long-term offset drift. Measure actual input offset at both extremes of the 2–8V supply range to confirm worst-case error budgets. Test output saturation margins with realistic load impedances (e.g., 1 kΩ || 10 nF) to assess stability. Perform accelerated life testing if deployed in high-reliability settings, though MSL 1 suggests good shelf-life stability. Finally, verify EMI susceptibility in RF-rich environments, as CMOS inputs can couple noise via gate oxides. Simulation helps, but empirical validation remains essential due to model inaccuracies in corner cases.

Parts with Similar Specifications

The three parts on the right have similar specifications to Texas Instruments TLV2322ID

Product Attribute TLV2322IDRG4 TLV2322IDR TLV2322IP TLV2322IPWLE
Part Number TLV2322IDRG4 TLV2322IDR TLV2322IP TLV2322IPWLE
Manufacturer Luminary Micro / Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Gain Bandwidth Product - - - -
Voltage - Supply Span (Min) - - - -
Amplifier Type - - - -
Voltage - Supply Span (Max) - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Number of Circuits - - - -
Current - Input Bias - - - -
Slew Rate - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Current - Output / Channel - - - -
Voltage - Input Offset - - - -
Current - Supply - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Output Type - Current - Unbuffered Voltage - Buffered -

TLV2322ID Datasheet PDF

Download TLV2322ID pdf datasheets and Texas Instruments documentation for TLV2322ID - Texas Instruments.

Datasheets
TLV2322/Y, TLV2324/Y.pdf
PCN Obsolescence/ EOL
EOL 22/May/2023.pdf
PCN Design/Specification
Design 25/Feb/2022.pdf Mult Devices Font 21/Apr/2018.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

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TLV2322ID Image

TLV2322ID

Texas Instruments
32D-TLV2322ID

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