About us Contact Us Submit BOM
RFQs(0)
English
Close Menu
View All

Please refer to the English Version as our Official Version.Return

Europe
France(Français) Germany(Deutsch) Italy(Italia) Russian(русский) Poland(polski) Czech(Čeština) Luxembourg(Lëtzebuergesch) Netherlands(Nederland) Iceland(íslenska) Hungarian(Magyarország) Spain(español) Portugal(Português) Turkey(Türk dili) Bulgaria(Български език) Ukraine(Україна) Greece(Ελλάδα) Israel(עִבְרִית) Sweden(Svenska) Finland(Svenska) Finland(Suomi) Romania(românesc) Moldova(românesc) Slovakia(Slovenská) Denmark(Dansk) Slovenia(Slovenija) Slovenia(Hrvatska) Croatia(Hrvatska) Serbia(Hrvatska) Montenegro(Hrvatska) Bosnia and Herzegovina(Hrvatska) Lithuania(lietuvių) Spain(Português) Switzerland(Deutsch) United Kingdom(English)
Asia/Pacific
Japan(日本語) Korea(한국의) Thailand(ภาษาไทย) Malaysia(Melayu) Singapore(Melayu) Vietnam(Tiếng Việt) Philippines(Pilipino)
Africa, India and Middle East
United Arab Emirates(العربية) Iran(فارسی) Tajikistan(فارسی) India(हिंदी) Madagascar(malaɡasʲ)
South America / Oceania
New Zealand(Maori) Brazil(Português) Angola(Português) Mozambique(Português)
North America
United States(English) Canada(English) Haiti(Ayiti) Mexico(español)
HomeProductsIntegrated Circuits (ICs)Specialized ICsOMAPL137DZKBD4
Image may be representation.
See specifications for product details.
Share
 Favorite
EXPRESS OPTION
Payment method

OMAPL137DZKBD4 - Texas Instruments

Manufacturer Part Number
OMAPL137DZKBD4
Manufacturer
Texas Instruments
Allelco Part Number
41D-OMAPL137DZKBD4
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,940 pcs available, New & Original
Parts Description
BGA-256(17x17)
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Compare
Our certification
In stock: 14940
  • Unit Price: $25.05
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $25.05 $25.05
30+ $23.99 $719.70
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

OMAPL137DZKBD4 Tech Specifications
Texas Instruments - OMAPL137DZKBD4 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL137DZKBD4

Product Attribute Attribute Value
Part Number OMAPL137DZKBD4
Package BGA-256(17x17)
Description BGA-256(17x17)
Stock Condition Get 14940 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Texas Instruments
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Parts Introduction

Manufacturer Part Number

OMAPL137DZKBD4

Manufacturer

Texas Instruments

Introduction

The OMAPL137DZKBD4 is a powerful embedded microprocessor from Texas Instruments. It features an ARM926EJ-S core operating at 456MHz, along with signal processing, system control, and memory controller co-processors. This device is designed for a wide range of embedded applications that require high-performance, low-power processing capabilities.

Product Features and Performance

ARM926EJ-S core with 32-bit bus width

456MHz operating speed

Signal processing, system control, and memory controller co-processors

SDRAM memory controller

LCD display and interface controllers

10/100Mbps Ethernet, USB 1.1 and USB 2.0 interfaces

Operating temperature range of -40°C to 90°C

Product Advantages

Powerful processing capabilities for demanding embedded applications

Flexible interface options for connectivity and peripheral integration

Wide operating temperature range for use in harsh environments

Proven ARM architecture and Texas Instruments' reputation for quality

Key Reasons to Choose This Product

High-performance processing power for complex embedded tasks

Comprehensive peripheral support for a wide range of applications

Reliable and well-established Texas Instruments brand

Suitable for a variety of embedded systems and industries

Quality and Safety Features

Surface mount package for reliable and secure installation

256-BGA package with 17x17 ball grid array

Designed to meet stringent quality and safety standards

Compatibility

Compatible with a variety of embedded systems and applications that require a powerful and versatile microprocessor

Application Areas

Industrial automation

Robotics and motion control

Medical devices

Automotive electronics

Surveillance and security systems

Telecommunications equipment

Product Lifecycle

The OMAPL137DZKBD4 is an active product in our website's sales team's portfolio. There are no immediate plans for discontinuation, and there are no direct equivalents or alternative models currently available. For the latest information on product availability and support, please contact our website's sales team.

Frequently Asked Questions(FAQ)

What are the key architectural trade-offs when selecting the OMAPL137DZKBD4 for embedded signal processing applications requiring real-time performance?
The OMAPL137DZKBD4 integrates an ARM926EJ-S core with a C674x DSP, enabling heterogeneous computing but introducing complexity in memory latency and cache coherency management. While the 456MHz ARM core supports control logic efficiently, the C674x DSP handles high-throughput data paths, which may require careful partitioning of tasks to avoid contention on shared resources like DDR2 interfaces. Designers must evaluate whether fixed-point or floating-point workloads dominate, as the absence of hardware graphics acceleration limits multimedia use cases compared to more modern SoCs.
How does the OMAPL137DZKBD4 compare to the OMAPL138 in terms of peripheral integration and power efficiency for industrial control systems?
The OMAPL138 typically offers enhanced peripherals such as dual Ethernet MACs and additional USB ports, making it better suited for network-heavy applications. In contrast, the OMAPL137DZKBD4 provides a single 10/100Mbps Ethernet interface, USB 1.1 and 2.0, and LCD controller—sufficient for basic industrial HMI applications. Power consumption profiles are similar at idle (~1W), but the OMAPL138’s extra interfaces can increase dynamic power under load. For cost-sensitive designs without redundant communication channels, the OMAPL137DZKBD4 delivers adequate functionality with lower component count.
What considerations apply to thermal management when deploying the OMAPL137DZKBD4 in extended temperature ranges up to 90°C?
Operating at TJ max = 90°C requires attention to PCB layout and airflow, especially given the 256-BGA package’s limited exposed thermal pad options. Natural convection alone may not suffice in sealed enclosures; passive heatsinks or thermal vias under the BGA are recommended. Since junction-to-ambient thermal resistance isn’t specified by TI, empirical testing under worst-case DSP load (e.g., sustained FFT operations) is advised. At 456MHz peak utilization, die temperatures could approach 80–85°C even at 25°C ambient if airflow is restricted.
Can the OMAPL137DZKBD4 drive external DDR2 memory directly, and what timing constraints should be anticipated?
Yes, the device includes integrated SDRAM controllers supporting DDR2-667 operation. However, achieving stable performance demands precise trace length matching (< ±50 mils skew), proper termination, and adherence to TI-recommended layout guidelines in the reference manual. Timing margins become tighter near the -40°C lower limit due to slower DRAM characteristics, potentially necessitating conservative CAS latency settings. Failure to meet these requirements may result in intermittent errors during memory-intensive DSP tasks.
Is the OMAPL137DZKBD4 suitable for battery-powered edge devices requiring low quiescent current?
While the ARM926EJ-S supports sleep modes down to sub-milliamp currents, the presence of multiple always-on peripherals—including PHYs for USB and Ethernet—limits deep power-down capability. Quiescent current typically hovers around 20–50mA in active standby mode, depending on clock gating configuration. For ultra-low-power applications, alternative processors with integrated PMUs and deeper sleep states would be preferable unless constant connectivity is required.
How does interrupt latency compare between the ARM core and C674x DSP in the OMAPL137DZKBD4 during concurrent system events?
The ARM926EJ-S experiences interrupt latency of approximately 12 cycles (~27ns at 456MHz) for non-nested interrupts, while the C674x achieves deterministic response times under 10 cycles (~22ns). However, shared resources like the internal crossbar can cause pipeline stalls during simultaneous accesses, effectively increasing effective latency. Designers must coordinate interrupt priorities and avoid polling loops in tight timing-critical paths, particularly in motor control or sensor fusion scenarios.
What impact do voltage fluctuations have on reliability when using the OMAPL137DZKBD4 with mixed 1.8V and 3.3V I/O domains?
The device tolerates I/O voltages up to 3.6V, allowing direct interfacing with legacy 3.3V sensors without level shifters. However, noise coupling between analog peripherals (e.g., McASP audio) and digital buses becomes critical if ground planes are poorly partitioned. Voltage sag on the 1.8V core supply during DSP bursts can trigger resets due to insufficient margin in the internal regulators. A minimum 5% headroom on VDD_CORE is advisable under full computational load.
Should developers expect support for real-time operating systems (RTOS) like FreeRTOS or VxWorks when using the OMAPL137DZKBD4?
Yes, the ARM926EJ-S architecture is fully compatible with mainstream RTOSes, provided the MMU is disabled or configured appropriately. TI supplies BSPs and kernel patches for both FreeRTOS and VxWorks, though memory partitioning between ARM and DSP requires custom glue code due to lack of hardware coherence. Scheduling across cores adds overhead compared to homogeneous multiprocessors, so task allocation must balance determinism with throughput.
What role does the HPI interface play in OMAPL137DZKBD4-based systems involving external host processors?
The Host Port Interface (HPI) enables high-speed communication between the OMAPL137DZKBD4 and an external master CPU, typically used to offload control-plane functions while letting the DSP handle real-time signal chains. Bandwidth peaks at 80MB/s (640Mb/s), sufficient for streaming ADC/DAC data buffers. Latency depends on HPI register access patterns; burst transfers minimize overhead, but frequent context switches degrade responsiveness in time-sensitive loops.
How does the absence of SATA support affect storage expansion options when integrating the OMAPL137DZKBD4 into medical imaging equipment?
Without native SATA, bulk data transfer relies on USB 2.0 (480Mbps theoretical), which may bottleneck large image files unless compressed. Alternatives include SD/MMC via dedicated pins or external USB-to-SATA bridges, though added components increase bill-of-materials cost and footprint. Given the OMAPL137DZKBD4’s moderate processing bandwidth (≈1.8GB/s memory subsystem), uncompressed DICOM datasets exceeding 100MB could saturate USB pipes, necessitating onboard buffering or preprocessing.
Are there known issues with the OMAPL137DZKBD4’s McASP module when driving professional audio CODECs over long cables?
The Multichannel Audio Serial Port (McASP) supports up to 32-bit stereo streams but lacks built-in echo cancellation or jitter attenuation. Long cable runs (>3m) introduce impedance mismatches and clock drift, risking buffer underruns. Implementing differential signaling (e.g., TLV320AIC31xx series) and using the device’s internal PLL for clock recovery improves robustness. Additionally, avoiding shared ground loops between analog and digital sections prevents hum artifacts.
How should designers validate boot sequence integrity when prototyping with the OMAPL137DZKBD4 and external NOR flash?
BootROM expects SPI or GPMC-connected NOR flash with specific command sequences. Common failure points include incorrect CS# timing, improper MPU region assignments for executable code, or misaligned vector table addresses. TI recommends validating early-stage bring-up using JTAG and examining SYSCFG registers to confirm boot source selection. CRC checks on firmware images before programming help detect corruption, especially during mass reprogramming cycles.
What are the implications of the Moisture Sensitivity Level 3 classification for the OMAPL137DZKBD4 in high-humidity manufacturing environments?
MSL 3 mandates baking prior to reflow if parts sit beyond 168 hours post-packaging, particularly in tropical climates. Absorption of moisture leads to popcorning during soldering, potentially causing solder joint cracks or delamination from the 17x17 BGA array. Facilities must track lot numbers and enforce dry storage protocols; otherwise, yield loss and field failures increase significantly in humid assembly lines.
Does the OMAPL137DZKBD4 support virtualization extensions, and how would this benefit multi-tenant embedded systems?
No, the ARM926EJ-S lacks virtualization hardware support, preventing Type-1 hypervisor deployment. Instead, software partitioning via hypervisors like Xen or bare-metal isolation using memory protection units (MPU) offers coarse-grained separation. This suffices for legacy safety-critical applications where deterministic behavior outweighs flexibility, but modern containerized workloads remain impractical on this platform.
What precautions are necessary when routing high-speed signals adjacent to the OMAPL137DZKBD4’s DDR2 interface to maintain signal integrity?
Differential pairs must maintain controlled impedance (typically 100Ω ±10%) with consistent spacing to minimize crosstalk. Adjacent routing of USB or Ethernet traces should maintain >3× trace width separation or be shielded with ground vias. Termination resistors placed close to DRAM devices reduce reflections, but placement tolerance must stay within 5mm of pads. Simultaneous switching noise (SSN) from BGA balls can couple into analog circuits, requiring careful layer stack design with solid ground planes underneath memory layers.
How does the lack of ECC memory support affect error resilience in automotive vision-processing applications using the OMAPL137DZKBD4?
Uncorrected DRAM errors can propagate silently through image buffers, leading to corrupted feature maps in object detection pipelines. While soft errors occur infrequently at sea level, radiation-induced bit flips in aerospace or high-altitude deployments pose higher risks. Mitigation strategies include periodic memory scrubbing routines and checksum validation of critical data structures, albeit at the expense of processing cycles.
What development tools are officially supported for debugging the OMAPL137DZKBD4, and how do they impact debug overhead?
TI’s Code Composer Studio (CCS) with XDS100v3 JTAG emulator provides full visibility into both ARM and DSP cores, including breakpoints and watchpoints. However, halting one core often affects the other due to shared caches and interconnects, complicating race condition analysis. Real-time tracing via ETM reduces overhead but consumes significant external RAM, limiting usable buffer depth for long-duration captures.
Why might the OMAPL137DZKBD4 be chosen despite newer ARM Cortex-A series alternatives available today?
Legacy designs leveraging existing toolchains, certification requirements (e.g., ISO 26262), or specialized DSP instruction sets (C674x) may justify continued use. Additionally, its integrated peripherals reduce external chip count for simple HMI + audio systems, lowering EMI and board area. Though outperformed by modern cores in raw IPC, the OMAPL137DZKBD4 remains viable in niche applications where proven reliability and low pin count outweigh performance demands.

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
Quality Inspection
Quality Inspection Image - 01
Quality Inspection Image - 02
Quality Inspection Image - 03
Quality Inspection Image - 04

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Texas Instruments

OMAPL137DZKBD4

Texas Instruments
41D-OMAPL137DZKBD4

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

Allelco
About Us
History
Certifications
Recruitment
Policies
Terms & Conditions
Privacy Policy
Cookie Policy
Services
Order Tracking
Return & Replacement
Frequently Asked Questions
Contact Us
Order
Shipping & Delivering
Payment Methods
My Account
The BlogsHot PartsChange LanguageNewsSite map
Contact Us
Headquarters Address:
Room C 13/F Harvard Commercial Building
105-111 Thomson Road Wan Chai
HongKong
Service Tel: +852-91464856
Service Email: info@allelco.com
Follow us
Copyright © 2012-2025 AllelcoElec.com. All rights reserved.
0 RFQ
Shopping cart (0 Items)
It is empty.
Submit RFQ
Compare List (0 Items)
It is empty.
Feedback

Your feedback matters! At Allelco, we value the user experience and strive to improve it constantly.
Please share your comments with us via our feedback form, and we'll respond promptly.
Thank you for choosing Allelco.

Subject
E-mail
Comments
Captcha
Drag or click to upload file
Upload File
types: .xls, .xlsx, .doc, .docx, .jpg, .png and .pdf.
Max file size: 10MB