OMAPL138EZCEA3R Tech Specifications
Texas Instruments - OMAPL138EZCEA3R technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments - OMAPL138EZCEA3R

Product Attribute	Attribute Value
Part Number	OMAPL138EZCEA3R
Package	NFBGA-361(13x13)
Description	NFBGA-361(13x13)
Stock Condition	Get 15600 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	Texas Instruments
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Parts Introduction

Manufacturer Part Number

OMAPL138EZCEA3R

Manufacturer

Texas Instruments

Introduction

The OMAPL138EZCEA3R is a high-performance, power-efficient embedded microprocessor from Texas Instruments. It features a 375MHz ARM926EJ-S core and a Signal Processing C674x co-processor, providing a versatile platform for a wide range of embedded applications.

Product Features and Performance

1 Core, 32-Bit ARM926EJ-S Processor Core

375MHz Operating Speed

Signal Processing C674x Co-Processor

System Control CP15 Co-Processor

SDRAM Memory Controllers

LCD Display and Interface Controllers

10/100Mbps Ethernet

SATA 3Gbps Interface

USB 1.1 and USB 2.0 Interfaces

Product Advantages

High-performance processing capabilities

Efficient power consumption

Extensive peripheral connectivity

Secure boot and cryptography features

Wide operating temperature range

Key Reasons to Choose This Product

Versatile platform for a variety of embedded applications

Optimized for power-sensitive designs

Robust security features for critical systems

Long-term product availability and support from Texas Instruments

Quality and Safety Features

Designed and manufactured to strict quality standards

Operating temperature range of -40°C to 105°C

Boot security and cryptography features for secure operation

Compatibility

Compatible with a wide range of peripheral devices and interfaces

Suitable for integration into various embedded systems and applications

Application Areas

Industrial automation and control

Automotive electronics

Medical equipment

Robotics and automation

Telecommunications and networking equipment

Product Lifecycle

["The OMAPL138EZCEA3R is an active product, currently available for purchase.","Texas Instruments offers equivalent and alternative models, such as the OMAPL138ZCZA100, OMAPL138ZCZA180, and OMAPL138ZCEA180, which may provide similar or enhanced capabilities.","For more information on product availability and alternatives, please contact our website's sales team."]

Frequently Asked Questions(FAQ)

What are the key performance trade-offs when selecting the OMAPL138EZCEA3R for a real-time industrial control application requiring deterministic response?: The OMAPL138EZCEA3R integrates an ARM926EJ-S core running at 375MHz with a C674x DSP co-processor, which enables parallel execution of control logic and signal processing tasks. However, the absence of a memory protection unit (MPU) in the ARM926EJ-S means developers must implement software-based task isolation to avoid interference in safety-critical loops. The 361-NFBGA package and shared SDRAM controller can introduce contention under high I/O loads, so careful memory access scheduling is required to maintain deterministic latency below 50µs for time-sensitive interrupts.

How does the dual-core architecture of the OMAPL138EZCEA3R influence firmware partitioning between the ARM and DSP domains?: The OMAPL138EZCEA3R features a heterogeneous architecture with a 32-bit ARM926EJ-S and a C674x floating-point DSP, each with independent clock domains and local TCM (Tightly Coupled Memory). This allows separation of application-layer logic on the ARM and computationally intensive algorithms (e.g., FFT or motor control loops) on the DSP. Shared L3 interconnect and mailbox registers enable low-overhead communication, but developers must manage coherency manually since no hardware cache coherency exists between domains—requiring explicit cache maintenance calls after data transfers.

What design considerations apply to power delivery when operating the OMAPL138EZCEA3R at 375MHz across the full industrial temperature range?: At 375MHz, the OMAPL138EZCEA3R draws approximately 450mW under typical load with both ARM and DSP active, necessitating a multi-rail power design: 1.2V core, 1.8V I/O, and 3.3V for USB PHY. Voltage droop during DSP-intensive bursts can exceed 50mV if decoupling is inadequate; TI recommends at least 10µF bulk capacitance per power pin pair with 100nF MLCCs placed within 2mm of the 361-NFBGA package. Thermal resistance (θJA) of 28°C/W demands a grounded thermal pad and sufficient copper pour to maintain junction temperature below 105°C in -40°C ambient conditions.

How does the OMAPL138EZCEA3R compare to the AM335x in terms of real-time performance and peripheral integration for motor control applications?: The OMAPL138EZCEA3R offers superior real-time signal processing due to its integrated C674x DSP, enabling sub-10µs execution of complex control algorithms, whereas the AM335x relies solely on its ARM Cortex-A8, requiring software-based math libraries with higher jitter. However, the AM335x provides PRU-ICSS for deterministic GPIO and PWM, while the OMAPL138EZCEA3R uses McASP and McBSP for time-critical I/O, which require CPU or DMA intervention. For applications needing both DSP math and hard real-time I/O, the OMAPL138EZCEA3R demands careful task scheduling but avoids external co-processors.

What are the implications of the OMAPL138EZCEA3R’s lack of graphics acceleration for HMI-driven embedded systems?: The OMAPL138EZCEA3R includes an LCD controller supporting up to 1280x720 resolution but lacks a GPU, shifting all rendering burden to the ARM926EJ-S. This limits frame rates to ~15 FPS for moderate UI complexity unless optimized with partial screen updates and 16-bit color depth. For touch-based interfaces, developers often pair the device with an external framebuffer or use lightweight GUI stacks like LVGL with aggressive dirty-region management to maintain responsiveness.

How should memory subsystem design be approached given the OMAPL138EZCEA3R’s single SDRAM controller and shared bus architecture?: The OMAPL138EZCEA3R’s SDRAM controller supports up to 256MB of DDR2 or LPDDR at 150MHz, but bandwidth is shared between ARM, DSP, DMA, and peripherals. Peak theoretical bandwidth is 600MB/s, but real-world throughput drops to ~400MB/s under concurrent access. To minimize contention, allocate time-critical DSP buffers in on-chip SRAM (up to 256KB), use EDMA for background transfers, and prioritize SDRAM bank interleaving. Memory access patterns should avoid frequent row activations to reduce latency penalties.

What security capabilities does the OMAPL138EZCEA3R provide, and how do they compare to modern secure boot implementations?: The OMAPL138EZCEA3R supports boot security through ROM-based secure boot with SHA-1/SHA-256 authentication and AES-128 decryption, but lacks a true hardware root of trust or secure key storage. Keys are stored in one-time programmable (OTP) fuses, which are irreversible and require pre-provisioning. Unlike newer devices with TrustZone, the ARM926EJ-S does not support hardware-enforced execution domains, so security relies on software isolation. This makes the OMAPL138EZCEA3R suitable for moderate-threat environments but insufficient for applications requiring tamper-proof key handling.

How does the inclusion of both USB 1.1 and USB 2.0 interfaces on the OMAPL138EZCEA3R affect system design for peripheral connectivity?: The OMAPL138EZCEA3R integrates one USB 1.1 full-speed controller with integrated PHY and one USB 2.0 high-speed controller with external PHY support. This allows concurrent use of legacy devices (e.g., HID keyboards) on USB 1.1 while maintaining 480Mbps throughput for data acquisition on USB 2.0. However, both controllers share the same VBUS power domain, requiring careful sequencing during hot-plug events. The USB 2.0 PHY must be placed within 10mm of the connector to meet signal integrity requirements, increasing layout complexity in compact designs.

What are the thermal management challenges when deploying the OMAPL138EZCEA3R in enclosed industrial enclosures with limited airflow?: With a junction-to-ambient thermal resistance of 28°C/W, the OMAPL138EZCEA3R can reach 105°C junction temperature with just 2.5W dissipation in a 40°C ambient—well below its 375MHz operational ceiling. In sealed enclosures, a thermal pad connected to an internal ground plane and a small heatsink (even 10x10mm) reduces θJA by up to 30%. Active cooling is rarely needed, but thermal vias under the 361-NFBGA package and copper-filled keep-out areas are essential to prevent localized hot spots during sustained DSP workloads.

How does the OMAPL138EZCEA3R’s peripheral set support industrial communication protocols beyond standard UART and SPI?: The OMAPL138EZCEA3R includes McASP (Multichannel Audio Serial Port) with TDM support, enabling bit-banged implementation of protocols like DALI or DMX512 for lighting control. McBSP can emulate synchronous serial interfaces for legacy fieldbus systems, while the HPI (Host Port Interface) allows direct connection to FPGAs for custom protocol offload. Combined with 10/100 Ethernet and SATA 3Gbps, these interfaces make the OMAPL138EZCEA3R suitable for gateway applications requiring protocol translation between industrial networks and storage systems.

What are the limitations of using the OMAPL138EZCEA3R in battery-powered applications despite its low-power modes?: While the OMAPL138EZCEA3R supports idle and standby modes reducing power to ~15mW, the ARM926EJ-S lacks dynamic voltage and frequency scaling (DVFS), preventing fine-grained power optimization. Wake-up from standby takes over 10ms due to PLL relock and SDRAM reinitialization, making it unsuitable for ultra-low-duty-cycle sensor nodes. Additionally, the 361-NFBGA package increases leakage current at elevated temperatures, so runtime at 85°C ambient can reduce battery life by 20% compared to room temperature operation.

How does the OMAPL138EZCEA3R compare to the dsPIC33 or STM32H7 for mixed-signal control applications requiring both DSP and microcontroller functionality?: The OMAPL138EZCEA3R provides significantly higher computational throughput (375MHz ARM + 300MHz C674x DSP) compared to dsPIC33 or STM32H7, enabling complex algorithms like adaptive filtering or predictive maintenance analytics. However, it lacks integrated ADCs or analog comparators, requiring external data converters that increase BOM cost and board space. The STM32H7 offers better real-time response for PWM generation, while the dsPIC33 excels in deterministic interrupt handling—making the OMAPL138EZCEA3R better suited for systems where processing power outweighs analog integration needs.

What layout and signal integrity considerations are critical when routing high-speed interfaces like SATA and USB 2.0 on the OMAPL138EZCEA3R?: The SATA 3Gbps interface on the OMAPL138EZCEA3R requires differential pair routing with 100Ω impedance control, length matching within 5mil, and minimal via stubs to maintain eye diagram compliance. Similarly, USB 2.0 D+/D− traces must be length-matched and routed away from noisy digital signals. The 361-NFBGA package demands via-in-pad or microvias for inner-layer escape routing, and ground return paths must be uninterrupted beneath high-speed signals. Failure to follow these guidelines can result in SATA link training failures or USB enumeration errors at high temperatures.

Can the OMAPL138EZCEA3R support real-time operating systems (RTOS) effectively, and which ones are commonly used?: Yes, the OMAPL138EZCEA3R is widely used with RTOS such as TI’s SYS/BIOS, FreeRTOS, and Micrium µC/OS-II, leveraging the ARM926EJ-S’s MMU-less architecture for predictable context switching. The C674x DSP typically runs a separate RTOS instance or bare-metal firmware, synchronized via IPC mechanisms. Interrupt latency is typically under 200ns, but shared bus arbitration can introduce jitter, so time-critical tasks should be pinned to DSP or use EDMA for data movement to avoid CPU bottlenecks.

How does the OMAPL138EZCEA3R handle firmware updates in the field, given its boot security features?: Firmware updates on the OMAPL138EZCEA3R must be signed and encrypted using the same keys provisioned in OTP fuses during manufacturing. The secure boot ROM verifies the image signature before execution, preventing unauthorized code loading. However, once a key is fused, it cannot be changed, so a compromised key requires hardware replacement. Over-the-air (OTA) updates must include rollback protection and dual-bank flash partitioning to ensure recovery from failed updates, adding complexity to the bootloader design.

Customers Also Interested in

Recommended Products

Customer Reviews

Evaluation: 10 Articles

Nath***rooks

Jun 11, 2026

Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.
Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

Write a Review

Your Email address will not be published.

Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

Use your express account for shipment if you have one.
Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

QC (Quality Warranty)
Payment Support
Packaging
Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.

Strict quality inspection builds a solid foundation for electronic component quality.

Visual inspection
Performance testing and reliability verification
Standardized full-process testing
Precise control of every parameter

We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Quality Inspection

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.

Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner

Efficient Supply Management
Cost-Saving Procurement
Fast Sourcing & Delivery

Contact us if you have any questions.

Phone: +00852 9146 4856
Email: info@allelco.com

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification

ISO 9001: 2015
ISO 13485: 2016
ISO 14001: 2015
ISO 28000: 2007
ISO 45001: 2018
GB/T 27922-2011

SMTA
IPC
ESD
PSMA