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HomeProductsConnectors, InterconnectsD-Sub Connector AssembliesM24308/3-1Z
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M24308/3-1Z - Positronic

Manufacturer Part Number
M24308/3-1Z
Manufacturer
Positronic
Allelco Part Number
32D-M24308/3-1Z
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,852 pcs available, New & Original
Parts Description
CONN DSUB PLUG 9P PNL MT SLD CUP
Package
Box
Data sheet
M24308/3-1Z.pdf
RoHs Status
 
Our certification
In stock: 5852

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Specifications

M24308/3-1Z Tech Specifications
Positronic - M24308/3-1Z technical specifications, attributes, parameters and parts with similar specifications to Positronic - M24308/3-1Z

Product Attribute Attribute Value
Manufacturer Positronic
Wire Gauge 20-28 AWG
Voltage Rating 1700V
Termination Solder Cup
Shell Size, Connector Layout 1 (DE, E)
Shell Material, Finish Steel, Yellow Chromate Plated Zinc
Series Military, MIL-DTL-24308
Package Box
Operating Temperature -55°C ~ 150°C
Number of Rows 2
Number of Positions 9
Mounting Type Panel Mount
Material Flammability Rating UL94 V-0
Ingress Protection -
Product Attribute Attribute Value
Flange Feature Housing/Shell (Unthreaded)
Features -
Dielectric Material Polycyclohexylenedimethylene Terephthalate (PCT)
Current Rating (Amps) 7.5A
Contact Type Signal
Contact Material Copper Alloy
Contact Form -
Contact Finish Thickness 50.0µin (1.27µm)
Contact Finish Gold
Connector Type Plug, Male Pins
Connector Style D-Sub
Color Black
Base Product Number M24308/3
Backset Spacing -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
ECCN EAR99
HTSUS 8536.69.5050

Parts Introduction

Manufacturer Part Number

M24308/3-1Z

Manufacturer

itt-interconnect-solutions

Introduction

This D-Sub, D-Shaped Connector Assembly is part of the 24308-Style, DMM Series. It features a male plug connector with 9 positions and 2 rows, designed for panel mount applications. The connector has a steel shell with a yellow chromate plated zinc finish, and gold-plated contacts.

Product Features and Performance

9 positions, 2 rows

Panel mount configuration

Steel shell with yellow chromate plated zinc finish

Gold-plated contacts

Solder cup termination

Operating temperature range: -55°C to 150°C

Current rating: 7.5A

Dielectric material: Polyester

Product Advantages

Durable construction for reliable performance

Gold-plated contacts for superior conductivity and corrosion resistance

Wide operating temperature range suitable for various applications

Key Reasons to Choose This Product

Robust and reliable design for demanding environments

Excellent conductivity and corrosion resistance with gold-plated contacts

Versatile panel mount configuration for easy installation

Quality and Safety Features

Manufactured to high-quality standards for reliable performance

Meets relevant industry specifications and safety requirements

Compatibility

Designed for use in various D-Sub, D-Shaped connector applications

Application Areas

Suitable for a wide range of industrial, commercial, and electronic applications that require a durable and reliable D-Sub connector

Product Lifecycle

The M24308/3-1Z is an active product. There may be equivalent or alternative models available from the manufacturer or other suppliers. Please contact our website's sales team for the latest product information and availability.

Frequently Asked Questions(FAQ)

What solder cup wire gauge compatibility should I verify when designing a harness for the M24308/3-1Z connector?
The M24308/3-1Z accepts wire sizes from 20 to 28 AWG per the solder cup termination specification. When selecting wire gauge, confirm that your PCB or panel routing can accommodate the finished solder joint diameter—28 AWG wire produces smaller joints suitable for compact layouts, while 20 AWG provides lower resistance and better current handling for higher-load signal lines. Verify solder cup depth and pitch with your assembly partner, as improper wire insertion depth or diameter mismatch can create intermittent connections under vibration. The M24308/3-1Z's 7.5A current rating should drive your 20 AWG selection if any signal line approaches 3–5A continuous current.
How does the gold contact finish thickness of the M24308/3-1Z affect mating cycle life and contact resistance over time?
The M24308/3-1Z specifies 50.0µin (1.27µm) gold plating over copper alloy base material. This thickness provides contact resistance stability across approximately 500–1000 mating cycles under normal insertion/extraction conditions. Gold's low oxidation rate prevents the contact resistance rise seen in bare copper or silver-plated alternatives, but the thin 1.27µm layer means the underlying copper alloy becomes exposed if contacts experience excessive wiping or abrasive debris. For high-reliability applications requiring >2000 cycles, inspect the M24308/3-1Z's mating surfaces periodically and consider protective contact caps during storage to preserve the gold layer integrity.
Can the M24308/3-1Z connector be used in high-temperature avionic or engine compartment environments, and what derating should apply?
The M24308/3-1Z operates across -55°C to 150°C, meeting avionic de-ice and engine compartment thermal ranges. However, the polycyclohexylenedimethylene terephthalate (PCT) dielectric material exhibits creep and dielectric strength degradation above 130°C continuous exposure. At 150°C, derate the 1700V voltage rating by 10–15% and reduce the 7.5A current rating to 6–6.5A to account for contact resistance rise and insulation stiffness loss. The yellow chromate plated zinc shell may also experience surface oxidation acceleration above 130°C in moist environments. For sustained operation near the 150°C upper limit, validate connector performance with thermal cycling tests rather than relying on datasheet nameplate ratings for the M24308/3-1Z.
How do the MIL-DTL-24308 military qualification requirements for the M24308/3-1Z compare to commercial D-Sub alternatives in terms of contact durability and environmental sealing?
The M24308/3-1Z meets MIL-DTL-24308 military specifications, which mandate tighter contact retention forces, lower contact resistance limits, and defined mating cycle performance versus unqualified commercial D-Sub connectors. However, the M24308/3-1Z lacks a backshell or environmental boot—it provides no ingress protection rating and relies entirely on solder cup termination at the connector rear. Commercial D-Sub alternatives like the FCC17E09PM series substitutes may offer molded boots or sealed backshells for enhanced water and contaminant ingress protection, trading off the M24308/3-1Z's established military qualification pedigree. If environmental sealing is critical, evaluate sealed commercial variants; if mil-spec traceability and contact performance are paramount, the M24308/3-1Z remains the appropriate choice despite its open termination design.
What is the practical insertion force and mating reliability window for the M24308/3-1Z when used in high-vibration aerospace or automotive applications?
The M24308/3-1Z's solder cup design and mil-spec contact geometry typically produce insertion forces between 15–25 lbf, but exact values depend on contact wear and mating sequence. Under sustained 10–20 Hz vibration environments, the M24308/3-1Z's unkeyed 9-position D-Sub geometry allows rotational micro-motion within the mating interface, risking fretting corrosion on the gold contact layer. To mitigate vibration-induced mating looseness, use a strain relief boot or cable clamp positioned within 50–75 mm of the M24308/3-1Z connector shell, and perform periodic visual inspection of contact alignment. For mission-critical aerospace applications, consider secured D-Sub variants with latch-lock mechanisms rather than relying solely on the M24308/3-1Z's friction-based mating retention.
Why is the M24308/3-1Z classified as RoHS non-compliant, and what alternative connectors should I evaluate for restricted-substance environments?
The M24308/3-1Z is RoHS non-compliant primarily due to the yellow chromate plated zinc shell finish, which contains hexavalent chromium (Cr VI), a restricted substance under EU RoHS Directive 2002/95/EC and its amendments. The copper alloy contact material itself may also contain trace lead or other legacy elements incompatible with RoHS sourcing requirements. Substitutes listed for the M24308/3-1Z—such as FCC17E09PM series variants—are often manufactured to RoHS-compliant specifications using trivalent chromium (Cr III) plating or alternative nickel-copper finishes. If your design or supply chain mandates RoHS compliance, cross-reference the M24308/3-1Z substitute part numbers with full material declarations (MDCs) from your distributor before design commitment, as the MIL-DTL-24308 qualification itself does not guarantee RoHS applicability.
How should I verify that solder joint integrity on the M24308/3-1Z will survive thermal cycling and mechanical shock in harsh field environments?
Solder cup terminations on the M24308/3-1Z are susceptible to joint cracking under thermal cycling (-55°C to 150°C transitions) and mechanical shock because stress concentrations form at the solder fillet interface. The copper alloy contact leads have thermal expansion coefficients differing from both the solder alloy and PCB substrate, creating cyclic stress. To validate M24308/3-1Z solder joint reliability, conduct accelerated thermal cycling tests (typically 5–10 cycles across the full -55°C to 150°C range) coupled with mechanical shock testing (MIL-STD-810 Method 514.8 or equivalent) on representative harnesses. Inspect joints optically and via X-ray after testing to detect incipient cracks. During assembly, use controlled-temperature solder processes and apply underfill or conformal coating around M24308/3-1Z solder joints in high-reliability applications to reduce thermal stress concentration.
What is the effective operating voltage margin for the M24308/3-1Z in high-altitude or low-pressure environments where arcing risk increases?
The M24308/3-1Z's 1700V rating assumes standard atmospheric pressure and sea-level air gap ionization characteristics. At high altitude (>25,000 feet) or in reduced-pressure cabins, atmospheric pressure drops significantly, lowering the breakdown voltage of air gaps between M24308/3-1Z contacts by 10–20% depending on altitude and humidity. For safety-critical analog signal lines operating above 500V, reduce the M24308/3-1Z's effective operating voltage to 1450–1550V when altitude or pressure reduction is part of the operational environment. For digital signal and low-voltage control circuits (<50V), the M24308/3-1Z voltage margin remains sufficient across the full altitude range. Conduct arcing and tracking tests per MIL-STD-454 Standard Test Method 2009 if altitude operation is specified in your qualification requirements.
How do the panel mount and solder cup termination methods of the M24308/3-1Z interact, and what assembly sequence minimizes stress on the connector?
The M24308/3-1Z combines panel mount through-hole positioning with rear solder cup wire termination, creating a dual-constraint architecture. During assembly, mechanical panel mounting stress (insertion force, fastener torque, and thermal expansion) is transmitted directly through the connector shell to the solder joints. If panel mounting is performed before solder cup termination, mechanical stress can cause micro-cracking in pre-soldered joints when the panel is secured. The recommended assembly sequence for the M24308/3-1Z is: (1) solder wire leads to solder cups in a controlled temperature environment; (2) cool and inspect joints; (3) perform final panel mount insertion with strain relief positioned to absorb deflection forces. This sequence isolates solder thermal stresses from mechanical panel insertion forces, significantly reducing joint failure rates in high-vibration or shock environments.
What contact material interactions should I consider when the M24308/3-1Z mates with gold-plated receptacles, and are there compatibility concerns?
The M24308/3-1Z's copper alloy male pins with 50.0µin gold plating will mate with receptacle contacts across a broad range of finishes (gold, nickel, silver, or tin). However, galvanic corrosion risk emerges if the M24308/3-1Z's underlying copper alloy is exposed through thin gold plating and contacts a dissimilar metal (e.g., nickel-plated receptacle) in a moist or salt-spray environment. The electrochemical potential between copper and nickel, combined with electrolyte presence (humidity or salt contamination), accelerates localized corrosion at the contact interface. When specifying M24308/3-1Z mating receptacles, prioritize gold-plated or silver-plated options to minimize galvanic potential difference. If only nickel-plated receptacles are available, apply a conformal coating to the M24308/3-1Z connector rear and ensure field environment moisture control to prevent accelerated corrosion.
Is the M24308/3-1Z suitable for continuous operating duty in subsea or marine splash-zone applications, and what protective measures are required?
The M24308/3-1Z is not rated for subsea deployment or marine splash-zone service without significant protective modifications. The connector lacks any formal ingress protection rating, and the solder cup termination is directly exposed to moisture ingress. The yellow chromate plated zinc shell corrodes rapidly in salt spray environments, with visible degradation occurring within 500–1000 hours per ASTM B117 salt fog testing. The 50.0µin gold contact plating, while corrosion-resistant, offers insufficient protection if the underlying copper alloy corrodes. For marine or coastal applications, encapsulate the M24308/3-1Z in a potted backshell or sealed junction box, apply protective grease or wax to solder joints, and consider periodic cleaning and contact relubrication. Alternatively, evaluate sealed connector families designed specifically for marine environments, as the M24308/3-1Z's military designation does not guarantee salt-fog resistance.
What thermal management considerations apply when the M24308/3-1Z carries near-rated current (6–7.5A) in the upper temperature range of -55°C to 150°C?
At 7.5A continuous current and 150°C ambient, the M24308/3-1Z's solder cup contacts dissipate approximately 0.5–0.8W per contact pair due to contact resistance (typically 15–30 mΩ). The PCT dielectric material softens above 130°C, reducing mechanical stiffness and allowing contact micro-motion, which further increases resistive heating and accelerates gold layer wear. Thermal modeling should account for self-heating: the actual contact temperature may reach 165–180°C when ambient is 150°C and current is 7.5A. To manage thermal stress on the M24308/3-1Z, reduce operating current to ≤5A near 150°C, increase connector-to-wire strain relief spacing to allow convective cooling, and avoid potting or shielding the connector shell in high-current designs. For sustained high-current duty, validate the M24308/3-1Z design via thermal imaging or temperature cycling tests rather than relying on nameplate derating alone.
How does the 9-position DE shell size of the M24308/3-1Z compare functionally to smaller D-Sub variants like DB-9, and what are the mechanical footprint implications?
The M24308/3-1Z uses a DE (also termed 'E' or 'standard') shell size with 9 positions arranged in a 2-row configuration, distinctly larger than the DB-9 (also 9-position but single-row, compact) geometry. The DE shell of the M24308/3-1Z is approximately 24–26 mm wide and 17–19 mm tall, while DB-9 variants are ~19 mm wide and ~13 mm tall. The larger M24308/3-1Z footprint provides greater contact-to-contact spacing (reducing crosstalk and ground-loop coupling), superior current-carrying capacity per contact (7.5A total for the M24308/3-1Z versus 5A typical for DB-9), and better mechanical robustness for solder cup termination. However, panel cutout and backplate layout demands increase significantly. When panel real estate is constrained, DB-9 alternatives reduce footprint; when signal integrity, current capacity, or mechanical durability of the M24308/3-1Z are critical, the larger DE shell geometry justifies the increased panel penetration.

Parts with Similar Specifications

The three parts on the right have similar specifications to Positronic M24308/3-1Z

Product Attribute M24308/3-1Z M24308/3-19Z M24308/3-1Z M24308/3-1Z
Part Number M24308/3-1Z M24308/3-19Z M24308/3-1Z M24308/3-1Z
Manufacturer Cinch Connectivity Solutions ITT Cannon, LLC ADI Electronics ITT Cannon, LLC
Wire Gauge - - - -
Flange Feature - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Material Flammability Rating - - - -
Series - - - -
Current Rating (Amps) - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Shell Size, Connector Layout - - - -
Contact Form - - - -
Contact Type - - - -
Color - - - -
Ingress Protection - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Base Product Number - DAC34H84 MAX500 ADS62P42
Termination - - - -
Shell Material, Finish - - - -
Contact Finish Thickness - - - -
Contact Material - - - -
Contact Finish - - - -
Features - - - Simultaneous Sampling
Connector Style - - - -
Dielectric Material - - - -
Backset Spacing - - - -
Number of Rows - - - -
Voltage Rating - - - -
Number of Positions - - - -
Connector Type - - - -

M24308/3-1Z Datasheet PDF

Download M24308/3-1Z pdf datasheets and Positronic documentation for M24308/3-1Z - Positronic.

Datasheets
Professional, Industrial and Military.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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M24308/3-1Z

Positronic
32D-M24308/3-1Z

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