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HomeProductsIntegrated Circuits (ICs)Memory23K640T-I/ST
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23K640T-I/ST - Microchip Technology

Manufacturer Part Number
23K640T-I/ST
Manufacturer
Microchip Technology
Allelco Part Number
32D-23K640T-I/ST
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
58,870 pcs available, New & Original
Parts Description
IC SRAM 64KBIT SPI 20MHZ 8TSSOP
Package
8-TSSOP
Data sheet
23K640T-I/ST.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 58870
  • Unit Price: $0.394
  • Subtotal: $0.00

Want a better price?
Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $0.394 $0.39
10+ $0.324 $3.24
30+ $0.29 $8.70
100+ $0.256 $25.60
500+ $0.235 $117.50
1000+ $0.225 $225.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

23K640T-I/ST Tech Specifications
Microchip Technology - 23K640T-I/ST technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - 23K640T-I/ST

Product Attribute Attribute Value
Manufacturer Microchip Technology
Write Cycle Time - Word, Page -
Voltage - Supply 2.7V ~ 3.6V
Technology SRAM
Supplier Device Package 8-TSSOP
Series -
Package / Case 8-TSSOP (0.173', 4.40mm Width)
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 64Kbit
Memory Organization 8K x 8
Memory Interface SPI
Memory Format SRAM
Clock Frequency 20 MHz
Base Product Number 23K640

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0041

Parts Introduction

23K640T-I/ST Image
23K640T-I/ST (1)

Manufacturer Part Number

23K640T-I/ST

Manufacturer

Microchip Technology

Introduction

The 23K640T-I/ST is a volatile SRAM memory chip designed for high-speed, reliable data storage and retrieval in embedded systems.

Product Features and Performance

Volatile Memory Type: SRAM

Memory Format: SRAM

Technology: SRAM

Memory Size: 64Kbit

Memory Organization: 8K x 8

Memory Interface: SPI

Clock Frequency: 20 MHz

Voltage Supply: 2.7V to 3.6V

Operating Temperature: -40°C to 85°C

Mounting Type: Surface Mount

Package/Case: 8-TSSOP

Product Advantages

High-speed SPI interface facilitates fast data transfer.

Compact 8-TSSOP package suitable for space-constrained applications.

Wide operating voltage and temperature range enhance robustness and reliability.

Key Technical Parameters

Memory Size: 64Kbit

Memory Organization: 8K x 8

SPI Interface

Clock Frequency: 20 MHz

Voltage: 2.7V to 3.6V

Operating Temperature: -40°C to 85°C

Quality and Safety Features

Stable operation over a wide range of temperatures and voltages ensures reliability in harsh conditions.

Compatibility

Compatible with systems requiring a fast and reliable SPI SRAM memory interface.

Application Areas

Embedded systems

Industrial applications

Consumer electronics

Automotive electronics

Communication infrastructure

Product Lifecycle

Currently in active production.

Not nearing discontinuation.

Replacements or upgrades are generally available for this series.

Several Key Reasons to Choose This Product

Fast data access and transfer speed with a 20 MHz SPI interface.

Reliable operation in extreme conditions, from -40°C up to 85°C.

Low power consumption facilitated by 2.7V to 3.6V supply range.

Compact and robust 8-TSSOP surface mount packaging.

Compatible with a wide range of industrial and consumer applications.

Frequently Asked Questions(FAQ)

How does the 23K640T-I/ST SRAM IC perform in terms of access time and bandwidth when interfacing with a 3.3V microcontroller running at 20 MHz SPI clock?
The 23K640T-I/ST supports a maximum SPI clock frequency of 20 MHz, which enables full-speed operation with compatible microcontrollers. At this clock rate, the effective data transfer rate is approximately 2 Mbytes per second (20 Mbps / 8 bits). While the absolute access time isn't specified in the datasheet, typical asynchronous SRAMs like this one exhibit access times in the low nanosecond range—often under 50 ns—when operating within the 2.7V to 3.6V supply range. This allows for efficient real-time data logging or buffering in embedded systems where sustained throughput is required without requiring tight timing margins.
What are the key differences between the 23K640T-I/ST and alternative models like N64S830HAT22I in terms of interface compatibility and voltage tolerance?
The 23K640T-I/ST uses an SPI interface and operates across a 2.7V to 3.6V supply range, making it suitable for mixed-voltage environments such as interfacing 3.3V logic with lower-voltage sensors or peripherals. In contrast, the N64S830HAT22I typically features a parallel interface and often requires higher operating voltages (e.g., 3.3V or 5V), limiting its use in space-constrained or low-power applications. Additionally, the SPI-based 23K640T-I/ST consumes fewer pins than parallel alternatives, which can be critical in compact PCB designs using microcontrollers with limited I/O.
Can the 23K640T-I/ST be used in battery-powered IoT edge devices that require low standby current and occasional data buffering?
Yes, the 23K640T-I/ST is well-suited for low-power edge applications due to its wide 2.7V to 3.6V supply range. At 3.3V, typical active current draw during SPI transactions is around 1–2 mA at 20 MHz. However, since it's volatile SRAM, it lacks non-volatile retention and draws static current even in standby mode—typically less than 1 µA when powered down via chip select. For ultra-low-power designs, pairing it with a sleep-mode capable microcontroller and minimizing wake-up intervals can help balance performance with energy efficiency.
What considerations should engineers evaluate when selecting the 23K640T-I/ST versus larger-capacity SRAMs for a data logging application requiring 128 KB of storage?
While the 23K640T-I/ST provides 64 Kbytes of memory, an application needing 128 KB would require two identical ICs or a higher-density alternative. Using multiple SPI SRAMs increases pin count and firmware complexity due to address decoding and chip selection overhead. Engineers should assess whether the system can tolerate segmented storage or if a single-chip solution with higher capacity—such as a 128 Kbit SPI SRAM—would reduce board complexity and improve reliability through fewer components.
How does the operating temperature range of the 23K640T-I/ST affect its suitability for industrial automation environments?
The 23K640T-I/ST operates from -40°C to +85°C, meeting standard industrial temperature requirements. This range ensures stable performance in automotive control units, factory automation controllers, and outdoor monitoring systems exposed to thermal cycling. Unlike commercial-grade parts limited to 0°C to 70°C, this component maintains reliable read/write integrity at extremes, reducing failure risk in harsh environments where solder joint fatigue or semiconductor behavior shifts could otherwise compromise data integrity.
Is it feasible to cascade multiple 23K640T-I/ST devices on the same SPI bus for expanded memory capacity without significant protocol overhead?
Yes, multiple 23K640T-I/ST devices can share an SPI bus using unique chip select lines for individual addressing. Each device responds only when selected, allowing up to four such ICs (assuming a four-wire SPI master) to expand total memory to 256 Kbytes. However, firmware must manage address mapping and avoid contention during simultaneous accesses. This approach introduces minimal protocol overhead but requires careful layout to maintain signal integrity across long traces or shared buses, especially at 20 MHz clock speeds.
What impact does Moisture Sensitivity Level (MSL) 1 have on the handling and storage requirements for the 23K640T-I/ST during assembly?
With an MSL rating of 1, the 23K640T-I/ST is classified as moisture-insensitive and can be stored indefinitely under normal conditions without baking prior to reflow soldering. This simplifies inventory management and reduces processing steps in high-volume manufacturing, particularly beneficial for electronics manufacturers aiming to minimize lead times and avoid additional drying procedures that increase costs and cycle time.
How does the package size of the 23K640T-I/ST compare to other common memory packages in terms of PCB footprint and routing density?
The 23K640T-I/ST comes in an 8-TSSOP package measuring 4.40 mm x 3.00 mm, offering a compact footprint ideal for space-constrained designs. Compared to SOIC-8 (5.3 mm x 7.6 mm), it occupies roughly half the area, enabling denser layouts. However, TSSOP’s finer pitch (0.65 mm) demands tighter manufacturing tolerances than wider-pitch alternatives. When designing PCBs, engineers must ensure adequate trace spacing and consider testability during layout to avoid bridging or opens due to high pin density.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology 23K640T-I/ST

Product Attribute 23K640T-E/ST 23K640T-I/SN 23K256T-I/ST 23K640-I/SN
Part Number 23K640T-E/ST 23K640T-I/SN 23K256T-I/ST 23K640-I/SN
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Write Cycle Time - Word, Page - - - -
Memory Format - - - -
Technology - - - -
Memory Organization - - - -
Memory Interface - - - -
Memory Size - - - -
Clock Frequency - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Base Product Number - DAC34H84 MAX500 ADS62P42
Series - - - -
Memory Type - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

23K640T-I/ST Datasheet PDF

Download 23K640T-I/ST pdf datasheets and Microchip Technology documentation for 23K640T-I/ST - Microchip Technology.

Datasheets
Cylindrical Battery Holders.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf
PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf Packing Changes 10/Oct/2016.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Payment Support

The payment method can be chosen from the methods shown below: Wire Transfer (T/T, Bank Transfer), Western Union, Credit card, PayPal.
  • HKBea
  • Paypal
  • MasterCard
  • Western-Union
  • VISA
Stable Delivery, Sincere Partnership — Your Faithful Supply Chain Partner
  • Efficient Supply Management
  • Cost-Saving Procurement
  • Fast Sourcing & Delivery
Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
23K640T-I/ST Image

23K640T-I/ST

Microchip Technology
32D-23K640T-I/ST

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