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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersATSAMD21G17A-AU
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ATSAMD21G17A-AU - Microchip Technology

Manufacturer Part Number
ATSAMD21G17A-AU
Manufacturer
Microchip Technology
Allelco Part Number
32D-ATSAMD21G17A-AU
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
15,754 pcs available, New & Original
Parts Description
IC MCU 32BIT 128KB FLASH 48TQFP
Package
48-TQFP (7x7)
Data sheet
ATSAMD21G17A-AU.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Specifications

ATSAMD21G17A-AU Tech Specifications
Microchip Technology - ATSAMD21G17A-AU technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - ATSAMD21G17A-AU

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V
Supplier Device Package 48-TQFP (7x7)
Speed 48MHz
Series SAM D21G, Functional Safety (FuSa)
RAM Size 16K x 8
Program Memory Type FLASH
Program Memory Size 128KB (128K x 8)
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Package / Case 48-TQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 38
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 14x12b; D/A 1x10b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M0+
Connectivity I²C, LINbus, SPI, UART/USART, USB
Base Product Number ATSAMD21

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

ATSAMD21G17A-AU Image
ATSAMD21G17A-AU (1)

Manufacturer Part Number

ATSAMD21G17A-AU

Manufacturer

microchip-technology

Introduction

The ATSAMD21G17A-AU is a high-performance, ARM Cortex-M0+ based microcontroller particularly designed for efficiency and power management in embedded applications.

Product Features and Performance

ARM Cortex-M0+ core, optimized for low-power applications, operating at up to 48MHz

Advanced connectivity features including I2C, LINbus, SPI, UART/USART, and USB

On-chip peripherals like DMA, I2S, PWM, and a Watchdog Timer (WDT) enhance functionality

128KB of Flash memory and 16KB of SRAM provide ample storage for code and data

Integrated Brown-out Detect/Reset and Power-on Reset circuits for improved stability

Internal oscillator for reduced component count

A/D converters (14x12b) and D/A converters (1x10b) for analog interface

Product Advantages

Low power consumption extends battery life in portable devices

Ample I/O lines and memory capabilities support complex applications

Integrated USB interface facilitates easy programming and communication

Comprehensive peripheral set enables versatile application design

Key Technical Parameters

Core Size: 32-Bit Single-Core

Speed: 48MHz

Number of I/O: 38

Program Memory Size: 128KB

RAM Size: 16KB

Voltage Supply: 1.62V ~ 3.6V

Data Converters: A/D 14x12b, D/A 1x10b

Operating Temperature: -40°C ~ 85°C

Quality and Safety Features

Embedded with Functional Safety (FuSa) features for safety-critical applications

Compatibility

Compatible with a range of development tools and software from Microchip and third-party providers

Application Areas

Ideal for IoT devices, sensor management, medical devices, and industrial control systems

Product Lifecycle

Currently in an active phase, not nearing discontinuation

Continuous support with updates, replacements, or upgrades available

Several Key Reasons to Choose This Product

Efficient and powerful ARM Cortex-M0+ core for high-performance applications

Extensive connectivity and on-chip peripherals support enables versatile uses

Low power consumption is ideal for battery-powered devices

Comprehensive development support from Microchip simplifies design and deployment

Robust quality and safety features make it suitable for critical applications

Frequently Asked Questions(FAQ)

How does the ATSAMD21G17A-AU compare to other members of the ATSAMD21 series in terms of memory architecture and power efficiency for battery-powered embedded applications?
The ATSAMD21G17A-AU features 128KB of internal FLASH memory and 16KB of SRAM, providing a balanced memory footprint suitable for mid-complexity control tasks. Unlike lower-end variants such as the ATSAMD21E15, which offer only 32KB FLASH, this model supports larger firmware images while maintaining the same 48-TQFP packaging and core configuration. Its operating voltage range of 1.62V to 3.6V enables operation from single-cell Li-ion batteries down to near-threshold levels, making it competitive with similar Cortex-M0+ devices like the STM32L0xx series. However, its active current consumption at 48MHz is approximately 3.6 mA/Vcc, which is slightly higher than ultra-low-power alternatives but still within acceptable limits for most industrial sensing applications.
What are the key considerations when selecting between the ATSAMD21G17A-AU and alternative ARM Cortex-M0+ MCUs like the nRF52832 or STM32G031 for USB-enabled IoT edge nodes?
While the ATSAMD21G17A-AU includes native USB 2.0 full-speed support and integrates a hardware CRC engine for efficient packet handling, the nRF52832 offers Bluetooth LE alongside USB, making it more suitable for wireless-connected devices. In contrast, the STM32G031 provides comparable performance but lacks integrated USB PHY unless paired with an external transceiver. For designs requiring only USB serial communication without RF functionality, the ATSAMD21G17A-AU’s lower pin count and absence of redundant radio circuitry reduce BOM cost and board space. Additionally, its internal voltage regulator allows direct operation from unregulated power sources down to 1.62V, simplifying power design in systems where brown-out protection must be tightly managed.
Can the ATSAMD21G17A-AU safely operate over an extended temperature range typical of automotive environments, and what modifications would be required?
The ATSAMD21G17A-AU is rated for -40°C to +85°C, which aligns with industrial standards but falls short of AEC-Q100 Grade 2 requirements (up to 105°C). For true automotive compliance, thermal derating or additional heatsinking may be necessary during peak current transients, especially when driving capacitive loads through GPIO pins. Moreover, clock stability at low temperatures can require careful layout of the internal RC oscillator bypass capacitors to maintain timing accuracy. Therefore, while usable in non-automotive edge deployments, certification-critical applications should consider thermally enhanced packaging options or alternative devices with wider junction temperature ratings.
Is it feasible to use the ATSAMD21G17A-AU in functional safety (FuSa) applications under ISO 26262 or IEC 61508 frameworks, and what development practices are recommended?
Although the device belongs to Microchip’s Functional Safety (FuSa) qualified portfolio, actual certification depends on system-level implementation rather than chip capability alone. To meet SIL 2 or ASIL B requirements, developers must implement diagnostic features such as lockstep comparators (not available on this MCU), memory ECC (absent here), and periodic self-tests using built-in watchdogs and CRC checks on critical code segments. Given that the ATSAMD21G17A-AU lacks hardware redundancy, software-based fault detection and graceful degradation strategies become essential. Full certification would require third-party assessment of toolchains, failure modes analysis, and documentation per safety lifecycle processes—resources typically beyond small-scale prototyping efforts.
How does the internal oscillator accuracy of the ATSAMD21G17A-AU impact USB communication reliability, and what calibration techniques are advised?
The device uses a calibrated internal 48 MHz RC oscillator with ±1% tolerance at room temperature, which is sufficient for USB full-speed timing (±0.25% clock tolerance required). However, drift across temperature and supply voltage can exceed this margin, potentially causing enumeration failures. Microchip recommends loading factory-programmed trim values and performing dynamic calibration via USB SOF packets or external RTC references. Alternatively, pairing with a precision 32.768 kHz crystal enables automatic compensation algorithms that adjust RC frequency based on accumulated timing error over time, improving long-term USB stability in unattended deployments.
What are the trade-offs between using the ATSAMD21G17A-AU with internal flash versus external serial flash for data logging applications exceeding 128KB?
Storing data beyond 128KB requires either compression, streaming to host, or external storage such as SPI NOR flash. Using external flash adds component count, increases PCB real estate, and introduces latency in read/write operations due to protocol overhead. However, it preserves internal memory for runtime variables and reduces erase cycles on internal FLASH, extending endurance. For continuous logging at 1 KB/sec, an external W25Q64CV (8MB) accessed via SPI can buffer weeks of data with minimal CPU intervention, leveraging DMA channels available on the ATSAMD21G17A-AU. This approach balances memory constraints with application needs better than attempting to partition large arrays into fragmented internal sectors.
How many simultaneous ADC conversions can the ATSAMD21G17A-AU support, and what affects conversion resolution in practical sensor interfaces?
The ATSAMD21G17A-AU integrates 14-channel 12-bit successive approximation ADCs with up to 1 Msps throughput per channel. Multiple channels can be sampled sequentially using the internal sequencer, though interleaved sampling introduces settling-time errors if input signals change rapidly. In practice, achieving full 12-bit accuracy demands careful attention to reference voltage stability, input impedance matching, and anti-aliasing filtering. When measuring thermistors or strain gauges, oversampling and averaging across 16–64 samples yields effective resolutions closer to 14 bits. However, simultaneous conversion across all 14 channels is not possible; instead, time-division multiplexing must be employed, introducing scheduling complexity in multitasking environments.
What precautions should be taken when connecting the ATSAMD21G17A-AU’s USB port directly to a PC without isolation, and how does this affect ESD robustness?
Direct connection exposes the MCU to common-mode surges and ground loops, increasing risk of latch-up or signal integrity issues. Although the device includes ESD protection diodes on D+/D− lines rated for ±8 kV contact discharge per IEC 61000-4-2, these are intended for transient events only, not continuous exposure. Best practice involves using a ferrite bead, series resistors (e.g., 22 Ω), and TVS diodes compliant with USB-IF specifications. Additionally, decoupling capacitors near VBUS and proper grounding of shield layers minimize noise coupling into sensitive analog circuits. Without isolation, floating the board during debugging can cause unpredictable resets due to charge accumulation on parasitic capacitances.
How does the ATSAMD21G17A-AU handle brown-out detection thresholds, and can they be adjusted dynamically for energy harvesting systems?
The device supports three fixed brown-out detection (BOD) levels selectable via software: 2.7V, 2.9V, and 3.0V. These cannot be programmed dynamically, limiting flexibility in variable-voltage systems like solar-powered sensors. For energy harvesting applications where Vcc dips below nominal rails during load transitions, disabling BOD entirely risks corrupted flash writes, while enabling it too aggressively may trigger false resets during brief power troughs. A workaround involves monitoring Vcc via the internal bandgap reference and implementing soft reset logic in firmware that distinguishes brown-outs from watchdog timeouts. Nevertheless, this adds complexity compared to devices with adjustable BOD thresholds or integrated power management ICs.
In what scenarios would the ATSAMD21G17A-AU’s PWM peripheral outperform dedicated motor control ICs, and what limitations apply?
The ATSAMD21G17A-AU offers up to 12 PWM channels with 16-bit resolution and programmable dead time insertion, suitable for driving brushed DC motors or LED dimming with moderate switching frequencies (<100 kHz). It outperforms simple timer-based solutions by offloading timing calculations to hardware, reducing CPU overhead. However, it lacks gate drivers, high-side/low-side configurations, or fault protection features found in motor driver ICs like the DRV8833. Thus, it serves best in low-current actuator control where simplicity outweighs need for ruggedness. External MOSFETs and bootstrap circuits would still be required for inductive loads, negating much of the integration benefit unless interfacing with existing driver stages.
How does the package size of the ATSAMD21G17A-AU influence thermal performance in dense PCB layouts, and what mitigation strategies exist?
The 48-pin TQFP (7×7 mm) package has limited exposed pad area for heat dissipation compared to QFN alternatives. Under sustained 48 MHz operation with multiple peripherals active, junction temperatures can rise above ambient by 25–35°C depending on copper pour and airflow. While not catastrophic, prolonged thermal stress may accelerate electromigration in bond wires. Enhancing thermal performance requires solid ground planes beneath the IC, vias to inner layers, and minimizing high-frequency current paths through shared return planes. Thermal vias under the EPAD improve conduction to top-layer heatsinks, though solder wicking remains a risk during reflow soldering.
What role does the internal DMA controller play in optimizing data flow between peripherals and memory on the ATSAMD21G17A-AU, and how does it reduce CPU load?
The DMA controller enables autonomous transfer of data between peripherals (ADC, UART, SPI) and memory blocks without CPU intervention, freeing cycles for application logic. For example, capturing 1000 ADC samples at 10 kSPS can occur entirely in background mode, with interrupts only signaling completion. This prevents buffer overruns in real-time systems and eliminates polling overhead. Configuring DMA channels via registers requires careful synchronization to avoid race conditions during descriptor updates. Maximum throughput is constrained by bus arbitration between AHB masters, but typical payloads achieve >50% CPU utilization savings in sensor fusion pipelines.
Can the ATSAMD21G17A-AU interface with I²C sensors operating at 5V logic levels without level shifting, and what risks arise?
The ATSAMD21G17A-AU’s I/O pins tolerate up to VDD + 0.5V, allowing direct connection to 5V-tolerant I²C devices only if their output high voltage (VOH) does not exceed 3.6V. Many 5V I²C sensors assert VOH near 4.5V, which exceeds the absolute maximum rating and risks damaging the MCU. Even if the sensor claims “5V tolerant,” its leakage currents may degrade signal integrity on SCL/SDA lines. Level shifters like TXS0108E or discrete MOSFET-based solutions are strongly recommended. Alternatively, using pull-up resistors to 3.3V instead of 5V ensures compatibility without external components, assuming the slave device accepts 3.3V logic.
How does the choice of crystal oscillator versus internal RC oscillator affect boot time and power consumption during startup on the ATSAMD21G17A-AU?
With the internal RC oscillator enabled, the ATSAMD21G17A-AU boots in ~1 ms, drawing <10 µA during wake-up. Switching to an external 16 MHz crystal adds several milliseconds due to PLL locking delays and requires stable biasing networks, increasing startup current to ~1–2 mA. However, the crystal provides superior long-term stability (<±20 ppm vs. ±1% RC), critical for USB or Ethernet applications. For battery-operated devices with infrequent wake cycles, RC mode minimizes energy loss during sleep, whereas always-on systems benefit from precise timing at the cost of higher quiescent power.
What constraints apply when using the ATSAMD21G17A-AU’s USART in synchronous mode with SPI-compatible slaves, and how does signal routing affect performance?
The USART module supports synchronous operation with MOSI/MISO lines, but only one direction can be active per transaction. Bidirectional communication requires two separate USART instances or manual pin swapping. Clock polarity and phase must match the slave’s expectations, typically CPOL=0, CPHA=0 for Mode 0. Signal skew between SCK and data lines must remain under 1 ns to prevent setup/hold violations at 10 MHz SPI speeds. On densely routed boards, differential lengths and matched trace impedances reduce crosstalk, especially when sharing routes with high-speed USB signals near D+/D− pairs.
How reliable is the internal watchdog timer (WDT) on the ATSAMD21G17A-AU in preventing hangs caused by stack overflows or infinite loops, and what recovery mechanisms exist?
The WDT operates independently of the main clock and resets the system after a programmable interval (16 ms to 8 s in steps). It effectively detects software stalls but cannot distinguish between benign delays and fatal faults. Stack overflows may corrupt WDT reload logic before triggering a reset, leading to missed deadlines. Mitigation includes placing critical variables in non-volatile memory, enabling memory protection units if available (not present here), and structuring interrupt handlers to avoid deep nesting. Post-reset recovery requires persistent state storage (e.g., FRAM or battery-backed RAM) or reinitialization flags to restore operational context.
What impact does flash memory wear have on firmware update strategies using the ATSAMD21G17A-AU, and how can write endurance be extended?
The ATSAMD21G17A-AU’s flash has a typical endurance of 10,000 write/erase cycles per sector. Frequent firmware updates to active code regions accelerate wear, potentially leading to permanent failure after years of daily updates. To extend lifespan, firmware should be split into immutable bootloader and updatable application sections, with the latter stored in a circular buffer that shifts sectors after each update. Alternatively, using external EEPROM or FRAM for configuration data avoids internal flash modification altogether. Wear leveling algorithms must account for asymmetric sector sizes and ensure even distribution across available blocks.
Why might the ATSAMD21G17A-AU be preferred over higher-clock-speed Cortex-M4 parts for simple control loops, despite slower raw throughput?
At 48 MHz, the ATSAMD21G17A-AU delivers sufficient performance for most PID controllers, sensor polling, and CAN-like protocols, while consuming significantly less power than M4 counterparts running at 100+ MHz. Its deterministic instruction pipeline and absence of branch prediction reduce jitter in time-critical loops, which is crucial for motor control or real-time communication stacks. Furthermore, the integrated peripherals eliminate need for external chips, reducing latency and board complexity. Unless floating-point computation or DSP-intensive filtering is required, the M0+ core’s simplicity offers better energy efficiency and lower EMI—key advantages in portable or remote installations.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology ATSAMD21G17A-AU

Product Attribute ATSAMD21G17A-AUT ATSAMD21G17A-AU ATSAMD21G17A-UUT ATSAMD21G17A-AF
Part Number ATSAMD21G17A-AUT ATSAMD21G17A-AU ATSAMD21G17A-UUT ATSAMD21G17A-AF
Manufacturer Microchip Technology Atmel Microchip Technology Microchip Technology
Core Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Voltage - Supply (Vcc/Vdd) - - - -
Data Converters - - - -
Core Processor - - - -
Connectivity - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Peripherals - - - -
Program Memory Type - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Number of I/O - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
EEPROM Size - - - -
Speed - - - -
RAM Size - - - -
Oscillator Type - - - -
Series - - - -
Program Memory Size - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

ATSAMD21G17A-AU Datasheet PDF

Download ATSAMD21G17A-AU pdf datasheets and Microchip Technology documentation for ATSAMD21G17A-AU - Microchip Technology.

Datasheets
SAM D21/DA1 Family Datasheet.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Packaging
MBB/Label Chgs 16/Nov/2018.pdf Transfer to Microchip/Label/Pkg 5/Sep/2016.pdf
PCN Design/Specification
SAM D21/DA1 05/Apr/2021.pdf SAM D21/DA1 10/Sep/2021.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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ATSAMD21G17A-AU Image

ATSAMD21G17A-AU

Microchip Technology
32D-ATSAMD21G17A-AU

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