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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersATSAMG55J19B-AU
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ATSAMG55J19B-AU - Microchip Technology

Manufacturer Part Number
ATSAMG55J19B-AU
Manufacturer
Microchip Technology
Allelco Part Number
32D-ATSAMG55J19B-AU
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
6,337 pcs available, New & Original
Parts Description
IC MCU 32BIT 512KB FLASH 64LQFP
Package
64-LQFP (10x10)
Data sheet
ATSAMG55J19B-AU.pdf

PCN Assembly/Origin

2.73KHz.pdf

HTML Datasheet

SAM G55G,J Summary.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf

PCN Packaging

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 6337
  • Unit Price: $5.695
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $5.695 $5.70
10+ $5.571 $55.71
30+ $5.488 $164.64
100+ $5.404 $540.40
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

ATSAMG55J19B-AU Tech Specifications
Microchip Technology - ATSAMG55J19B-AU technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - ATSAMG55J19B-AU

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V
Supplier Device Package 64-LQFP (10x10)
Speed 120MHz
Series SAM G55
RAM Size 176K x 8
Program Memory Type FLASH
Program Memory Size 512KB (512K x 8)
Peripherals DMA, I²S, POR, PWM, WDT
Package / Case 64-LQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 48
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 8x12b
Core Size 32-Bit Single-Core
Core Processor ARM® Cortex®-M4
Connectivity I²C, SPI, UART/USART, USB
Base Product Number ATSAMG55

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

ATSAMG55J19B-AU Image
ATSAMG55J19B-AU (1)

Manufacturer Part Number

ATSAMG55J19B-AU

Manufacturer

Microchip Technology

Introduction

ARM Cortex-M4 based microcontroller for embedded applications requiring high-performance and low-power consumption.

Product Features and Performance

32-Bit Single-Core ARM Cortex-M4 Processor

Operating Speed of 120MHz

High Connectivity with I2C, SPI, UART/USART, USB

Enhanced Peripheral Set Including DMA, I2S, POR, PWM, WDT

48 Programmable I/O Lines

512KB Flash Memory

176KB SRAM

Internal Oscillator for Device Clock

Product Advantages

Optimized for low-power applications

High system performance with Cortex-M4 architecture

Ample memory resources for complex applications

Comprehensive set of peripherals for versatile usage

ATSAMG55J19B-AU Image
ATSAMG55J19B-AU (2)

Key Technical Parameters

Core Size: 32-Bit

Program Memory Size: 512KB (512K x 8)

RAM Size: 176K x 8

Number of I/O: 48

Voltage Supply Range: 1.62V to 3.6V

Data Converters: 8-Channel, 12-bit A/D Converter

Speed: 120MHz

Operating Temperature Range: -40°C to 85°C

Quality and Safety Features

Industrial operating temperature range ensuring reliability

Watchdog Timer for system safety

Power-on Reset (POR) circuit

Compatibility

Surface Mount 64-LQFP Package for PCB assembly

Compatible with various development tools and software

Application Areas

Internet of Things (IoT) devices

Consumer Electronics

Industrial Control Systems

Automotive

Medical devices

Product Lifecycle

Product Status: Active

Not nearing discontinuation

Availability of replacements and upgrades through Microchip Technology

Several Key Reasons to Choose This Product

High-speed ARM Cortex-M4 core suitable for demanding applications

Extensive connectivity options for versatile external interfacing

Large memory capacity facilitating complex software and buffer storage

Efficient power management for battery-operated devices

Robust temperature range catering to harsh environments

Direct support and resources from Microchip Technology

Frequently Asked Questions(FAQ)

How does the ATSAMG55J19B-AU handle power consumption in battery-powered applications, and what design considerations are necessary to meet low-power requirements?
The ATSAMG55J19B-AU operates within a supply voltage range of 1.62V to 3.6V, which supports energy-efficient operation in portable devices. Its ARM Cortex-M4 core includes sleep modes that reduce current draw during idle periods. Designers should leverage the device’s peripheral clock gating, disable unused I/O pins, and configure the brown-out reset (BOR) appropriately to maintain stable operation under varying supply conditions. For extended battery life, dynamic frequency scaling and minimizing active time through efficient interrupt-driven programming are essential strategies.
What is the maximum achievable data throughput for SPI communication with the ATSAMG55J19B-AU, and how does it compare to UART/USART performance in typical sensor data acquisition scenarios?
The ATSAMG55J19B-AU’s SPI module can operate at up to 120MHz system clock divided by 2, yielding a theoretical SPI clock rate of 60MHz. In practice, with proper signal integrity and slave timing margins, sustained transfer rates above 10 Mbps are feasible. UART/USART typically maxes out around 12–25 Mbps depending on baud rate configuration, but actual throughput is often limited by protocol overhead and buffer handling. For high-frequency sensor polling or memory-mapped peripherals, SPI offers higher deterministic bandwidth; for simple command-response protocols, UART may suffice with lower complexity.
Can the ATSAMG55J19B-AU drive multiple external memory interfaces simultaneously, and what bus architecture limitations should be considered when connecting flash or SDRAM?
The ATSAMG55J19B-AU features flexible pin multiplexing, allowing multiple SPI or QSPI instances, but only one primary external memory interface can be active at a time due to shared address/data lines. The internal 176KB RAM restricts direct access to large datasets without buffering. When interfacing with external flash or SDRAM, designers must allocate sufficient DMA channels to prevent CPU bottlenecks and ensure timing compliance per the memory datasheet. Careful partitioning of memory regions via linker scripts helps manage code execution from internal vs. external flash.
What oscillator configurations are supported by the ATSAMG55J19B-AU, and how reliable is internal clocking in industrial environments?
The device includes an internal 48MHz RC oscillator with ±1% accuracy at room temperature, suitable for many non-time-critical applications. Alternatively, a crystal oscillator can be connected to XTAL pads for higher precision. In industrial environments (-40°C to 85°C), the internal oscillator maintains stability within specified drift limits, though external crystals offer better long-term accuracy. Always verify startup time and warm-up characteristics against application timing requirements before finalizing clock selection.
How does the ATSAMG55J19B-AU implement USB functionality, and what firmware development challenges arise when using its built-in USB controller?
The ATSAMG55J19B-AU integrates a full-speed USB 2.0 transceiver capable of acting as a device with support for endpoints and standard class drivers. Firmware development requires careful attention to descriptor tables, endpoint buffering, and interrupt prioritization. Due to limited RAM (176KB), managing large USB packets demands efficient memory usage. Developers must also handle USB suspend/resume events properly to comply with power management expectations and avoid enumeration failures.
Is the ATSAMG55J19B-AU suitable for safety-critical automotive applications, and what certifications or validation steps are recommended before deployment?
While the ATSAMG55J19B-AU is not inherently qualified for automotive-grade operation, its commercial temperature range (-40°C to 85°C) and robust peripheral set make it viable for certain industrial uses. For automotive systems requiring ASIL compliance, additional qualification—such as AEC-Q100 testing—is mandatory. Designers should conduct fault injection testing, watchdog monitoring, and redundancy checks in firmware to mitigate single-point failures. Use of lockstep cores or external safety monitors may be necessary beyond MCU capabilities alone.
How many analog input channels does the ATSAMG55J19B-AU provide, and what sampling resolution should be expected when reading multiple sensors concurrently?
The ATSAMG55J19B-AU includes eight 12-bit successive approximation register (SAR) ADC channels. With a maximum conversion rate of ~1 Msps per channel, simultaneous sampling across all inputs is possible with proper sequencer configuration. However, interleaved sampling introduces jitter; for accurate multi-sensor readings, staggered triggers or dedicated sequences per channel improve linearity. Expected effective resolution degrades slightly with faster sampling due to settling time constraints, so calibration routines are advisable for precision applications.
What is the typical flash write endurance for the ATSAMG55J19B-AU, and how should wear leveling be implemented in non-volatile logging applications?
The flash memory in the ATSAMG55J19B-AU typically supports 10,000 program/erase cycles per sector. For logging systems writing frequently, a circular buffer with wear-leveling logic—either in hardware (if supported) or software—must distribute writes evenly across sectors. Given the 512KB total flash size, partitioning into logical blocks and tracking erase counts minimizes degradation. Microchip provides APIs for sector management, but custom algorithms are often needed to align with application data structures.
Can the ATSAMG55J19B-AU operate reliably in high-vibration environments, and how does package choice affect mechanical robustness?
The 64-LQFP (10x10) package offers moderate mechanical strength compared to BGA alternatives, but solder joint fatigue remains a concern under prolonged vibration. Thermal cycling between -40°C and 85°C accelerates this risk. Using underfill material and ensuring adequate PCB pad design improves reliability. While the part itself doesn’t include vibration-specific hardening, adherence to IPC Class 2 soldering standards and conformal coating can enhance durability in demanding installations.
What cryptographic acceleration features does the ATSAMG55J19B-AU offer, and how do they impact real-time performance in secure communication stacks?
The ATSAMG55J19B-AU lacks dedicated hardware encryption engines found in higher-end MCUs, so AES, SHA, or RSA operations run entirely on the Cortex-M4 core. This imposes CPU load—typically consuming 20–30% of processing time for AES-128-CBC encryption at 120MHz. Real-time systems may require offloading to external security chips or optimizing stack usage to maintain deadlines. Software libraries from Microchip or third parties can accelerate routines, but latency-sensitive designs should factor in these overheads early.
How does the ATSAMG55J19B-AU compare to the ATSAMD21G18 in terms of memory capacity and peripheral integration for IoT edge nodes?
Unlike the ATSAMD21G18 (which has 256KB flash and no USB), the ATSAMG55J19B-AU doubles program memory (512KB) and adds native USB support along with enhanced ADCs and PWM modules. Both share similar power profiles, but the SAM G55 series targets more complex IoT gateways needing higher compute throughput and richer connectivity. The trade-off is increased cost and slightly higher pin count, making the G55 preferable for applications requiring local processing beyond basic sensor aggregation.
Are there any known errata or silicon revisions affecting the ATSAMG55J19B-AU’s DMA controller, and how can they be mitigated in production code?
Certain early silicon revisions exhibit DMA channel priority inversion under heavy bus contention, where a lower-priority transfer delays a higher-priority one unexpectedly. Mitigation involves limiting concurrent DMA requests or inserting NOP cycles between critical transfers. Always consult the latest errata bulletin from Microchip and apply recommended workarounds such as manual arbitration or disabling unused channels during high-throughput bursts.
What development tools and debug interfaces are officially supported for the ATSAMG55J19B-AU, and what limitations exist when using open-source toolchains?
Microchip Studio (formerly Atmel Studio) and IAR Embedded Workbench are fully supported with optimized ARM GCC toolchain compatibility. JTAG and SWD interfaces enable real-time debugging, but SWD requires careful trace length matching for reliable operation above 10 MHz. Open-source toolchains like Eclipse with GCC may lack advanced optimizations for DSP instructions on the Cortex-M4, potentially impacting performance in signal-processing tasks. Linker script tuning is often necessary to fit code into constrained flash layouts.
How does the ATSAMG55J19B-AU manage wake-up latency from deep sleep modes, and what factors influence recovery time in battery backup scenarios?
Deep sleep modes reduce power significantly but increase wake-up latency due to oscillator stabilization delays. Typical resume time from standby mode exceeds 1 ms when relying on internal oscillators, while waking via external crystal adds another 2–3 ms. Factors influencing recovery include pre-wake peripheral initialization, PLL relocking time, and flash wait states reconfiguration. Applications requiring sub-millisecond response must avoid deep sleep or use faster wake sources like external interrupts with minimal setup overhead.
What is the recommended decoupling strategy for the ATSAMG55J19B-AU in noisy industrial settings, and how many bulk capacitors are typically required?
Place a 100nF ceramic capacitor as close as possible to each VDD/VSS pair on the 64-LQFP package, plus one 10µF tantalum or ceramic bulk capacitor near the power entry point. In electrically harsh environments, add ferrite beads and consider dual-layer filtering with series resistors if EMI is severe. Ensure all bypass caps have low ESL and ESR to suppress high-frequency noise from switching regulators or motor loads sharing the same board.
Can the ATSAMG55J19B-AU interface directly with 5V logic peripherals without level shifting, and what risks should be avoided?
No—the device operates at 1.62V to 3.6V, so 5V signals exceed absolute maximum ratings and risk damaging I/O pins. Level shifters or resistive dividers must be used when connecting to 5V devices. Direct connection could cause latch-up or permanent damage even if functional temporarily. Always verify voltage thresholds of external components against the ATSAMG55J19B-AU’s VIH/VIL specs and use bidirectional translators for bidirectional buses like I2C.
What is the typical PCB footprint and thermal performance of the ATSAMG55J19B-AU in compact designs, and how much copper area improves heat dissipation?
The 64-LQFP (10x10 mm) package has small thermal resistance (~40°C/W junction-to-air), so passive cooling relies heavily on PCB copper. Adding a solid ground plane and thermal vias under the exposed pad reduces hotspot temperatures by 10–15°C in typical layouts. In dense designs, airflow and heatsinking may be insufficient; consider derating clock speeds or using external cooling if sustained 120MHz operation occurs continuously under full load.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology ATSAMG55J19B-AU

Product Attribute ATSAMG55J19B-AUT ATSAMG55J19A-AU ATSAMG55J19A-AUT ATSAMG55J19B-MU
Part Number ATSAMG55J19B-AUT ATSAMG55J19A-AU ATSAMG55J19A-AUT ATSAMG55J19B-MU
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Number of I/O - - - -
Connectivity - - - -
Series - - - -
Program Memory Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply (Vcc/Vdd) - - - -
RAM Size - - - -
Oscillator Type - - - -
Core Size - - - -
Speed - - - -
Peripherals - - - -
Program Memory Size - - - -
Core Processor - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Data Converters - - - -
EEPROM Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

ATSAMG55J19B-AU Datasheet PDF

Download ATSAMG55J19B-AU pdf datasheets and Microchip Technology documentation for ATSAMG55J19B-AU - Microchip Technology.

PCN Assembly/Origin
2.73KHz.pdf
HTML Datasheet
SAM G55G,J Summary.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf
PCN Packaging
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

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ATSAMG55J19B-AU Image

ATSAMG55J19B-AU

Microchip Technology
32D-ATSAMG55J19B-AU

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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