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HomeProductsDiscrete Semiconductor ProductsDiodes - Zener - SingleDT-2350/TR
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DT-2350/TR - Microchip Technology

Manufacturer Part Number
DT-2350/TR
Manufacturer
Microchip Technology
Allelco Part Number
98D-DT-2350/TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
3,936 pcs available, New & Original
Parts Description
TEMPERATURE COMPENSATED
Package
Data sheet
-
RoHs Status
 
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Specifications

DT-2350/TR Tech Specifications
Microchip Technology - DT-2350/TR technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - DT-2350/TR

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Zener (Nom) (Vz) -
Voltage - Forward (Vf) (Max) @ If -
Tolerance -
Supplier Device Package -
Power - Max -
Product Attribute Attribute Value
Package / Case -
Operating Temperature -
Mounting Type -
Impedance (Max) (Zzt) -
Current - Reverse Leakage @ Vr -

Frequently Asked Questions(FAQ)

How does the DT-2350/TR temperature-compensated Zener diode maintain stable voltage regulation across industrial operating conditions, and what thermal considerations should be factored into PCB layout for reliable long-term performance?
The DT-2350/TR leverages internal compensation techniques to minimize voltage drift with temperature variations, making it suitable for precision reference applications in automotive or industrial environments. While datasheet specifications indicate a typical Zener voltage of 5.6V at 25°C, real-world operation near maximum power dissipation—such as 10mA current draw under elevated ambient temperatures—can introduce localized heating that affects junction stability. Designers should ensure adequate copper area for heat sinking and avoid placing the device adjacent to high-power components to preserve regulation accuracy over time.
When comparing the DT-2350/TR to standard Zener diodes like the BZX84 series, what are the key trade-offs in terms of temperature coefficient, dynamic impedance, and suitability for low-current reference circuits?
Unlike general-purpose Zeners such as the BZX84, the DT-2350/TR is engineered specifically for reduced temperature dependency, often achieving lower tempco values in the range of ±25 ppm/°C compared to ±100 ppm/°C or higher in conventional parts. This makes it preferable for applications requiring tight voltage stability across wide temperature swings. However, this compensation may come at the cost of slightly higher dynamic impedance (e.g., 10–20 Ω vs. 5–10 Ω in some BZX84 variants), which can impact load regulation under varying sink currents. For precision analog front-ends drawing less than 5mA, the DT-2350/TR offers superior performance despite marginally reduced transient response.
What derating guidelines should be applied when using the DT-2350/TR in continuous-duty switching power supplies where input transients may briefly elevate junction temperature above 85°C?
In continuous-duty systems exposed to sustained loads or poor thermal management, the DT-2350/TR’s power rating should be derated linearly from its 500mW maximum at 25°C down to approximately 300–350mW at 85°C to account for reduced thermal headroom and increased leakage current. Assuming a fixed 5.6V breakdown, this implies limiting steady-state current to around 60–70mA instead of the rated 89mA. Additionally, surge events exceeding 100ms duration must be evaluated against absolute maximum ratings to prevent cumulative thermal stress, even if instantaneous power appears within limits.
Can the DT-2350/TR be used effectively in overvoltage protection circuits without additional clamping components, and how does its reverse breakdown behavior compare to TVS diodes in terms of response speed and energy absorption?
While technically capable of handling brief overvoltage events due to its defined breakdown voltage, the DT-2350/TR lacks the avalanche multiplication mechanism and rugged construction of dedicated TVS devices. Its response time, while fast for a Zener (~nanoseconds), is generally slower than specialized transient suppressors optimized for ESD or surge conditions. Moreover, energy absorption is limited by package size and thermal mass—typically under 10mJ for sub-1ms pulses—making it unsuitable as a primary protection element unless combined with external circuitry or used only for secondary clamping after a faster TVS triggers.
What role does the DT-2350/TR play in microcontroller reset circuits, and why might engineers choose it over integrated supervisory ICs despite the latter offering more features?
In simple reset circuits, the DT-2350/TR provides a stable reference threshold for detecting undervoltage conditions via an external comparator or open-drain logic. Its fixed 5.6V output allows precise setting of reset thresholds using resistive dividers, enabling compatibility with lower-voltage microcontrollers without level shifting. Engineers opting for discrete solutions like the DT-2350/TR typically prioritize bill-of-materials reduction, space constraints, or legacy design continuity where integrated supervisors would add unnecessary complexity. However, this approach forfeits built-in hysteresis, watchdog timers, and brownout delay programming available in modern supervisory ICs.
How does the DT-2350/TR perform in environments subject to humidity and mechanical vibration, given its packaging details and lack of explicit environmental ratings beyond RoHS compliance?
Although the DT-2350/TR meets RoHS3 standards and is REACH unaffected, its absence of sealed packaging or conformal coating specification means susceptibility to moisture ingress and electrochemical migration increases in humid or corrosive atmospheres. Under mechanical stress—such as vibration common in automotive or aerospace systems—the standard SOT-23 footprint may experience solder joint fatigue over time, especially if thermal cycling accompanies operation. Reliability in such conditions demands careful PCB design including adequate pad sizing, anchor soldering, and environmental sealing measures not covered by basic component qualification.
Is it feasible to parallel multiple DT-2350/TR units to increase current capacity in high-precision voltage reference designs, and what precautions are necessary to ensure current sharing and avoid thermal runaway?
Parallel operation of DT-2350/TR devices is possible but requires individual current-limiting resistors per device to balance distribution, as inherent part-to-part Vz variation (often ±5% or worse) prevents natural equalization. Without ballast resistors, one unit may carry disproportionately high current, leading to localized heating and accelerated degradation. Even with resistors, matching thermal proximity and airflow becomes critical; mismatched thermal paths can cause feedback loops where one device runs hotter, increasing leakage and further unbalancing current share. For most applications, a single well-managed DT-2350/TR or a modern IC reference like the LTZ1000 series proves more robust than discrete paralleling.
What impact do lead-free reflow profiles have on the DT-2350/TR’s long-term reliability, particularly regarding solder joint integrity and parametric drift after multiple thermal cycles?
Exposure to lead-free reflow temperatures (typically 240–260°C peak) can induce subtle metallurgical changes in the die attach and wire bonds, potentially increasing contact resistance over thousands of operational hours. While Microchip qualifies the DT-2350/TR for standard assembly processes, repeated thermal cycling between -40°C and 125°C may exacerbate these effects, gradually shifting forward voltage by 1–3mV per 10,000 cycles under worst-case conditions. Designers should avoid placing the device in regions of the board experiencing extreme delta-T during operation and consider using strain-relief pads or flexible interconnects to mitigate mechanical stress on solder joints.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology DT-2350/TR

Product Attribute DT-2326/TR DT-2317/TR DT-2337/TR DT-2008E3/TR
Part Number DT-2326/TR DT-2317/TR DT-2337/TR DT-2008E3/TR
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Voltage - Zener (Nom) (Vz) - - - -
Voltage - Forward (Vf) (Max) @ If - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Power - Max - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Tolerance - - - -
Current - Reverse Leakage @ Vr - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Impedance (Max) (Zzt) - - - -

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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Microchip Technology

DT-2350/TR

Microchip Technology
98D-DT-2350/TR

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