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HomeProductsIntegrated Circuits (ICs)Data Acquisition - Digital to Analog Converters (DAC)MCP4706A0T-E/CH
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MCP4706A0T-E/CH - Microchip Technology

Manufacturer Part Number
MCP4706A0T-E/CH
Manufacturer
Microchip Technology
Allelco Part Number
32D-MCP4706A0T-E/CH
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
39,240 pcs available, New & Original
Parts Description
IC DAC 8BIT V-OUT SOT23-6
Package
SOT-23-6
Data sheet
MCP4706A0T-E/CH.pdf

Datasheets

MCP4706,16,26.pdf

PCN Assembly/Origin

Bond Wire 17/Jan/2023.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 39240
  • Unit Price: $0.966
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500+ $0.608 $304.00
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Specifications

MCP4706A0T-E/CH Tech Specifications
Microchip Technology - MCP4706A0T-E/CH technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - MCP4706A0T-E/CH

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply, Digital 2.7V ~ 5.5V
Voltage - Supply, Analog 2.7V ~ 5.5V
Supplier Device Package SOT-23-6
Settling Time 6µs (Typ)
Series -
Reference Type External, Supply
Package / Case SOT-23-6
Package Tape & Reel (TR)
Output Type Voltage - Buffered
Product Attribute Attribute Value
Operating Temperature -40°C ~ 125°C
Number of D/A Converters 1
Number of Bits 8
Mounting Type Surface Mount
INL/DNL (LSB) ±0.125, ±0.0125
Differential Output No
Data Interface I²C
Base Product Number MCP4706
Architecture R-2R

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.39.0001

Parts Introduction

MCP4706A0T-E/CH Image
MCP4706A0T-E/CH (1)

Manufacturer Part Number

MCP4706A0T-E/CH

Manufacturer

Microchip Technology

Introduction

The MCP4706A0T-E/CH is a high-performance, 8-bit, single-channel digital-to-analog converter (DAC) from Microchip Technology.

Product Features and Performance

8-bit resolution

1 channel

R-2R architecture

Buffered voltage output

Low power consumption

Excellent linearity (INL/DNL: ±0.125, ±0.0125 LSB)

Fast settling time (6μs typical)

Wide supply voltage range (2.7V to 5.5V)

Wide operating temperature range (-40°C to 125°C)

Product Advantages

High accuracy and linearity

Low power operation

Small footprint (SOT-23-6 package)

Wide voltage and temperature operating ranges

Key Technical Parameters

Resolution: 8 bits

Number of channels: 1

Architecture: R-2R

Output type: Buffered voltage

Supply voltage: 2.7V to 5.5V

Operating temperature: -40°C to 125°C

Settling time: 6μs (typical)

Quality and Safety Features

RoHS3 compliant

Tape and reel packaging

Compatibility

This DAC is compatible with a wide range of microcontrollers and digital systems.

Application Areas

Industrial control systems

Test and measurement equipment

Consumer electronics

Automotive electronics

Product Lifecycle

The MCP4706A0T-E/CH is an active product and is not nearing discontinuation. Replacement or upgraded products may be available in the future.

Key Reasons to Choose This Product

High accuracy and linearity for precise analog signal generation

Low power consumption for battery-powered applications

Small footprint for space-constrained designs

Wide operating voltage and temperature ranges for versatile use

Proven reliability and quality from Microchip Technology

Frequently Asked Questions(FAQ)

How does the MCP4706A0T-E/CH compare to other 8-bit DACs in terms of settling time and power efficiency for battery-powered sensor interface applications?
The MCP4706A0T-E/CH achieves a typical settling time of 6µs, which is notably faster than many comparable 8-bit DACs that often require 10µs or more. This speed advantage enables tighter control loops in real-time systems and reduces dead time between updates. Combined with its ability to operate from a single supply as low as 2.7V, it supports extended battery life in portable instrumentation—particularly when paired with low-power microcontrollers via I2C. Compared to alternatives like the MCP4725 (12-bit), this device trades resolution for lower complexity and faster conversion rates, making it suitable where 8-bit precision suffices and timing constraints are critical.
What are the implications of using an external reference versus the internal supply reference in the MCP4706A0T-E/CH for precision analog output applications?
When configured with an external reference, the MCP4706A0T-E/CH allows independent control over output voltage range and absolute accuracy, enabling calibration against stable references such as bandgap sources. This improves linearity (±0.0125 LSB DNL) and reduces gain error compared to using the internal supply rail directly. However, the benefit depends on the quality of the external reference; poor regulation can degrade performance. For applications requiring tight voltage tolerances across temperature or over long-term drift, an external reference is strongly recommended despite the added component cost and PCB space.
Can the MCP4706A0T-E/CH drive loads below 1 kΩ without additional buffering, and what are the consequences of attempting to do so?
The MCP4706A0T-E/CH features a buffered output stage designed primarily for high-impedance loads. Driving capacitive or resistive loads below approximately 1 kΩ may result in degraded settling behavior due to limited output current capability and potential instability. In such cases, adding an op-amp buffer becomes necessary to maintain both speed and accuracy. Attempting direct connection without verification risks increased settling time beyond 6µs and possible overshoot, especially under dynamic conditions. Designers should consult the output drive characteristics section in the datasheet and consider simulation before committing to tight load configurations.
How does the INL specification of ±0.125 LSB affect actual output voltage deviation in practical use with the MCP4706A0T-E/CH?
Given the full-scale range (FSR) of the MCP4706A0T-E/CH is typically set by the reference voltage (e.g., 3.3 V), an integral nonlinearity (INL) of ±0.125 LSB translates to a maximum deviation of ±1.22 mV at full scale. While this represents excellent linearity for an 8-bit device, cumulative errors across multiple steps could introduce noticeable distortion in audio or measurement systems. For most industrial control or sensor conditioning tasks, this level of INL is negligible, but in high-precision analog front-ends, even this small error might necessitate software correction or higher-resolution replacement.
Why would one choose the MCP4706A0T-E/CH over a PWM-based DAC solution in microcontroller-based systems?
The MCP4706A0T-E/CH provides deterministic analog output without requiring filtering stages, which simplifies board layout and reduces component count compared to PWM-to-analog approaches. Its I2C interface enables direct integration with most modern microcontrollers, offering better noise immunity and lower electromagnetic interference than digital PWM traces near sensitive analog nodes. Additionally, with guaranteed settling time and specified DNL/INL, it delivers predictable performance essential for closed-loop systems like motor control or voltage regulation. The trade-off is higher unit cost and fixed resolution, but for applications demanding repeatable analog behavior, it offers superior reliability and design simplicity.
What considerations apply when cascading multiple MCP4706A0T-E/CH devices on a shared I2C bus for multi-channel analog output?
Each MCP4706A0T-E/CH supports configurable I2C addresses via its A0 pin, allowing up to four devices on a single bus without address conflicts. Care must be taken during initialization sequencing due to the 6µs settling time—concurrent updates should be avoided unless synchronized. Power-up timing differences may also cause transient glitches if not managed. Furthermore, bus capacitance limits rise with each added device, potentially reducing maximum clock speed. Proper pull-up resistor selection and adherence to Microchip’s recommended layout practices ensure robust communication and prevent data corruption in multi-DAC environments.
How does operating temperature affect the accuracy of the MCP4706A0T-E/CH, particularly in automotive or industrial settings?
The MCP4706A0T-E/CH is rated for operation from -40°C to +125°C, covering demanding environments such as automotive under-hood applications. Over this range, the combination of external reference stability and internal circuitry ensures minimal drift in output voltage. However, without a temperature-compensated reference, thermal gradients can still introduce offset shifts on the order of tens of microvolts per degree Celsius. For applications requiring sub-mV stability over wide temperatures, pairing the DAC with a precision temperature-stable reference (e.g., REF5025) significantly enhances overall system accuracy beyond what the DAC alone can guarantee.
Is the MCP4706A0T-E/CH suitable for replacing discrete resistor ladders or R-2R networks in space-constrained designs?
Yes, the MCP4706A0T-E/CH integrates the R-2R ladder architecture internally, eliminating the need for external precision resistors required by discrete solutions. This reduces BOM count, improves consistency between units, and minimizes layout sensitivity to parasitic effects. Its compact SOT-23-6 package occupies less than 3 mm², making it ideal for handheld or wearable electronics where board real estate is at a premium. While discrete implementations allow arbitrary scaling and custom ranges, the integrated approach offers superior reproducibility and ease of calibration, justifying its use in mass-produced consumer or embedded devices.
What role does the Moisture Sensitivity Level (MSL) rating play in the handling and storage of the MCP4706A0T-E/CH during manufacturing?
With an MSL of 1, the MCP4706A0T-E/CH is considered moisture-insensitive and can be stored indefinitely under normal ambient conditions without requiring bake-out prior to reflow soldering. This simplifies inventory management and assembly workflows, especially in high-volume production lines. Manufacturers avoid unnecessary processing steps that delay throughput and increase costs. It also reduces risk of popcorning during thermal cycling, enhancing yield in automated pick-and-place operations. Compliance with JEDEC standards confirms reliable performance throughout typical SMT processes.
How does the choice between Cut Tape (CT) and Digi-Reel packaging affect procurement logistics for the MCP4706A0T-E/CH?
Cut Tape (CT) format is optimal for prototyping and low-volume builds, providing individual components for manual handling and immediate use. Digi-Reel® packaging caters to automated assembly lines by presenting parts in continuous tape suitable for pick-and-place machines, minimizing human intervention and improving placement accuracy. Suppliers offer both formats to match customer workflow needs—engineers selecting CT benefit from flexibility, while those in contract manufacturing prefer reel for scalability. Availability may vary by region and distributor, so specifying packaging preference early avoids delays in project timelines.
Can the MCP4706A0T-E/CH be used in isolated analog output circuits without optocouplers or isolation amplifiers?
No, the MCP4706A0T-E/CH lacks galvanic isolation and cannot safely interface between electrically distinct domains such as high-voltage sensor inputs and low-voltage logic circuits. Applying differential voltages exceeding common-mode limits will damage the device or violate safety standards. Isolation requires external components like optoisolators or dedicated isolation amplifiers, which add latency, cost, and complexity. Therefore, for intrinsically safe systems or medical devices requiring reinforced isolation, alternative architectures must be employed alongside the MCP4706A0T-E/CH rather than relying solely on its built-in capabilities.
What impact does supply voltage ripple have on the performance of the MCP4706A0T-E/CH when using its internal supply as the reference?
Using the analog supply (Vdd) as the reference exposes the MCP4706A0T-E/CH to supply-induced errors proportional to the ripple magnitude. A 10 mVpp ripple at 100 kHz could modulate the output by several millivolts depending on decoupling quality and PSRR (Power Supply Rejection Ratio). While adequate for general-purpose signal generation, this degrades precision in measurement loops or regulated outputs. Decoupling capacitors close to the IC pins help mitigate this, but for best results, an independent clean reference should be used instead of sharing the noisy supply rail.
How does the MCP4706A0T-E/CH support partial power-down modes, and what are the recovery times after wake-up?
The MCP4706A0T-E/CH includes a sleep mode accessible via I2C commands, reducing quiescent current to microamps. Upon exiting sleep, the device resumes normal operation within the specified 6µs settling window, provided the reference and supply are stable. Unlike some competing parts, it does not require explicit reset or reinitialization of registers, preserving user-defined output levels. This feature benefits energy-sensitive applications such as battery-operated dataloggers, where frequent duty-cycling minimizes average power consumption without sacrificing responsiveness during active periods.
Are there any known compatibility issues between the MCP4706A0T-E/CH and certain I2C controllers due to timing requirements?
The MCP4706A0T-E/CH follows standard I2C protocols with typical clock stretching and acknowledge behaviors. Most modern microcontrollers (STM32, PIC, ESP32, etc.) fully support its interface without modification. However, extremely slow I2C clocks (<10 kHz) may lead to timing margin violations if other bus devices stretch excessively or if propagation delays are significant. Additionally, fast-mode-plus devices running above 1 MHz should verify setup/hold times relative to the DAC’s internal sampling instant. In practice, standard fast-mode (400 kHz) operation is well within tolerance for reliable communication.
What precautions should be taken when soldering the MCP4706A0T-E/CH in high-vibration environments?
Although the SOT-23-6 package is mechanically robust, repeated mechanical stress can fatigue solder joints. Use of underfill or conformal coating may enhance durability, though it adds process steps and cost. Alternatively, ensure proper pad design with sufficient copper area and avoid sharp bends in traces connected to the IC. Reflow profiles should comply with IPC-J-STD-001 guidelines to prevent thermal shock. In extreme cases, consider alternative packages like QFN or SOIC for improved mechanical anchoring, though this sacrifices board density.
How does the MCP4706A0T-E/CH handle output glitches during power-up or register writes, and can they be minimized?
Like all R-2R DACs, the MCP4706A0T-E/CH exhibits transient glitches during code transitions due to charge redistribution dynamics. These are typically sub-nanosecond events but can couple into downstream circuits through capacitive coupling. To minimize impact, ensure clean power sequencing, use adequate bypassing near Vdd/Vss pins, and avoid switching heavy loads simultaneously with DAC updates. Writing codes gradually or using dithering techniques can also reduce perceived artifacts in sensitive analog chains. The buffered output helps absorb some of this energy but cannot eliminate glitch energy entirely.
What are the environmental compliance certifications relevant to the MCP4706A0T-E/CH, and how do they influence global deployment strategies?
The MCP4706A0T-E/CH meets RoHS3 and REACH requirements, ensuring freedom from restricted substances like lead, mercury, and SVHCs. ECCN EAR99 status indicates it is not subject to strict export controls under U.S. regulations, facilitating international distribution. HTSUS classification aids customs clearance and tariff determination. Together, these certifications simplify market access across Europe, North America, and Asia, reducing regulatory overhead for manufacturers deploying products containing this component in consumer, industrial, or commercial equipment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology MCP4706A0T-E/CH

Product Attribute MCP4716A0T-E/CH MCP4706A3T-E/CH MCP4716A0T-E/CHVAO MCP4706A1T-E/CH
Part Number MCP4716A0T-E/CH MCP4706A3T-E/CH MCP4716A0T-E/CHVAO MCP4706A1T-E/CH
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Architecture - Current Source R-2R Pipelined
INL/DNL (LSB) - ±4, ±2 ±1 (Max), ±1 (Max) -
Series - - - -
Voltage - Supply, Analog - 3.14V ~ 3.46V 11.4V ~ 16.5V 3V ~ 3.6V
Reference Type - External, Internal External External, Internal
Settling Time - 10ns (Typ) 4.5µs -
Data Interface - LVDS - Parallel I²C LVDS - Parallel, Parallel
Differential Output - Yes No -
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of D/A Converters - 4 4 -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Voltage - Supply, Digital - 1.14V ~ 1.26V 11.4V ~ 16.5V 1.65V ~ 3.6V
Output Type - Current - Unbuffered Voltage - Buffered -
Number of Bits - 16 8 14
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad

MCP4706A0T-E/CH Datasheet PDF

Download MCP4706A0T-E/CH pdf datasheets and Microchip Technology documentation for MCP4706A0T-E/CH - Microchip Technology.

Datasheets
MCP4706,16,26.pdf
PCN Assembly/Origin
Bond Wire 17/Jan/2023.pdf
PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf Packing Changes 10/Oct/2016.pdf

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Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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MCP4706A0T-E/CH Image

MCP4706A0T-E/CH

Microchip Technology
32D-MCP4706A0T-E/CH

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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