MCP607-I/SN - Microchip Technology

Manufacturer Part Number

MCP607-I/SN

Manufacturer

Microchip Technology

Introduction

The MCP607-I/SN is a dual operational amplifier (op-amp) integrated circuit (IC) designed for use in general-purpose instrumentation and buffer applications.

Product Features and Performance

Dual op-amp in a single package

Rail-to-rail input and output

Low input offset voltage of 250 μV

Low input bias current of 1 pA

Wide supply voltage range of 2.5 V to 6 V

High gain bandwidth product of 155 kHz

Low power consumption with 18.7 mA supply current per channel

Low slew rate of 0.08 V/μs

Product Advantages

Suitable for a wide range of low-power, low-noise instrumentation and buffer applications

Compact 8-SOIC surface-mount package saves board space

Excellent DC and AC performance characteristics

Key Technical Parameters

Package: 8-SOIC (0.154", 3.90mm Width)

Mounting Type: Surface Mount

Operating Temperature Range: -40°C to 85°C

Number of Circuits: 2

Gain Bandwidth Product: 155 kHz

Supply Voltage Range: 2.5 V to 6 V

Supply Current per Channel: 18.7 mA

Input Offset Voltage: 250 μV

Input Bias Current: 1 pA

Slew Rate: 0.08 V/μs

Output Current per Channel: 17 mA

Quality and Safety Features

RoHS3 compliant

Manufactured by the industry-leading Microchip Technology

Compatibility

Compatible with a wide range of general-purpose instrumentation and buffer applications

Application Areas

Instrumentation and control systems

Sensor signal conditioning

Buffering and level shifting

Medical equipment

Industrial automation

Product Lifecycle

The MCP607-I/SN is an active product in Microchip Technology's portfolio and is not nearing discontinuation.

Replacements and upgrades are available from Microchip Technology.

Several Key Reasons to Choose This Product

Excellent DC and AC performance characteristics, including low input offset voltage, low input bias current, and high gain bandwidth product

Wide supply voltage range and low power consumption make it suitable for a variety of low-power applications

Compact surface-mount package saves valuable board space

Robust design and manufacturing by the industry-leading Microchip Technology

Compatibility with a wide range of instrumentation and buffer applications