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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersPIC12F1501-I/SN
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PIC12F1501-I/SN - Microchip Technology

Manufacturer Part Number
PIC12F1501-I/SN
Manufacturer
Microchip Technology
Allelco Part Number
32D-PIC12F1501-I/SN
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
62,770 pcs available, New & Original
Parts Description
IC MCU 8BIT 1.75KB FLASH 8SOIC
Package
8-SOIC
Data sheet
PIC12F1501-I/SN.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 62770
  • Unit Price: $0.556
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $0.556 $0.56
10+ $0.453 $4.53
30+ $0.402 $12.06
100+ $0.351 $35.10
500+ $0.32 $160.00
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

PIC12F1501-I/SN Tech Specifications
Microchip Technology - PIC12F1501-I/SN technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - PIC12F1501-I/SN

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 2.3V ~ 5.5V
Supplier Device Package 8-SOIC
Speed 20MHz
Series PIC® 12F
RAM Size 64 x 8
Program Memory Type FLASH
Program Memory Size 1.75KB (1K x 14)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 8-SOIC (0.154", 3.90mm Width)
Package Tube
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 5
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 4x10b
Core Size 8-Bit
Core Processor PIC
Connectivity -
Base Product Number PIC12F1501

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

PIC12F1501-I/SN Image
PIC12F1501-I/SN (1)

Manufacturer Part Number

PIC12F1501-I/SN

Manufacturer

Microchip Technology

Introduction

An 8-bit microcontroller designed for embedded applications

Product Features and Performance

8-Bit core processor

Maximum speed of 20MHz

5 I/O pins

75KB of FLASH program memory

Programmable Brown-out Detect/Reset (BOD)

Power-on Reset (POR)

Pulse Width Modulation (PWM) support

Watchdog Timer (WDT)

Internal Oscillator

Product Advantages

Low power consumption

Broad operating voltage range from 2.3V to 5.5V

Integrated Analog-to-Digital Converter (ADC)

Flexible programming capabilities

Compact 8-SOIC package for space-constrained applications

Key Technical Parameters

Core Size: 8-Bit

Program Memory Size: 1.75KB (1K x 14)

RAM Size: 64 x 8

Data Converters: A/D 4x10b

Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V

Operating Temperature: -40°C ~ 85°C (TA)

Quality and Safety Features

Extended operating temperature range

Stable internal oscillator

Safety features like Brown-out Detect and Watchdog Timer

Compatibility

SOIC mounting compatible with standard PCB assembly

Support for MIcrochip MPLAB IDE for development

Application Areas

Consumer Electronics

Industrial Control Systems

Automotive sectors

Internet of Things (IoT) devices

Product Lifecycle

Active product status

Not close to discontinuation

Replacements or upgrades readily available

Several Key Reasons to Choose This Product

Ideal for cost-sensitive and space-constrained applications

Support for a variety of communication protocols

Compatible with Microchip's extensive software and hardware tool ecosystem

Robust design with safety features to enhance reliability

Comprehensive documentation and community support

Frequently Asked Questions(FAQ)

How does the PIC12F1501-I/SN handle voltage monitoring during power-up and brownout conditions, and what role does its internal peripherals play in system reliability?
The PIC12F1501-I/SN integrates a precision brown-out detect (BOD) circuit that monitors the supply voltage and triggers a reset if Vcc drops below approximately 2.0V, ensuring the microcontroller operates within safe voltage limits. Combined with the Power-on Reset (POR) feature, this provides robust protection against undervoltage events during startup or transient dips. These internal peripherals eliminate the need for external supervisory ICs in many low-voltage applications, reducing component count while improving response time to voltage anomalies.
What are the practical implications of the PIC12F1501-I/SN’s 64-byte RAM size when implementing data logging or state retention functions in embedded systems?
With only 64 bytes of RAM—distributed across general-purpose registers and working memory—the PIC12F1501-I/SN is suitable for simple control tasks but imposes strict limitations on data buffering or runtime variable storage. For example, storing more than a few sensor readings or maintaining complex application states would require external SRAM or reliance on flash-based non-volatile storage with write-cycle management. Designers must optimize code footprint and minimize stack usage to avoid out-of-memory conditions during execution.
In what scenarios would the internal oscillator configuration of the PIC12F1501-I/SN be preferred over an external crystal, and how does frequency accuracy impact peripheral timing?
The PIC12F1501-I/SN uses an internal calibrated RC oscillator running up to 20MHz, which is ideal for cost-sensitive, non-time-critical applications where ±1% frequency tolerance suffices—such as basic motor control or LED sequencing. Unlike external crystals, it eliminates PCB space and assembly complexity, though it may drift with temperature or supply variation. For PWM generation or ADC sampling, this drift can introduce timing errors; thus, high-precision analog measurements or communication protocols like UART at higher baud rates may require external clocking for consistent performance.
How does the trade-off between program memory size and I/O availability affect system architecture decisions when using the PIC12F1501-I/SN in compact sensor nodes?
The PIC12F1501-I/SN offers 1.75KB of flash memory and five programmable I/O pins, creating a constrained resource environment typical of ultra-low-cost IoT endpoints. While sufficient for firmware that reads sensors via ADC and transmits via simple serial output, complex logic requiring multiple digital inputs or interrupt-driven tasks may exceed either memory capacity or pin availability. Engineers often implement state machines with minimal code branching or reuse I/O through multiplexing rather than expanding hardware, accepting functional simplicity in exchange for integration density.
Can the PIC12F1501-I/SN support continuous ADC sampling from all four channels simultaneously, and what factors limit real-time data acquisition throughput?
The PIC12F1501-I/SN features a 10-bit successive approximation ADC with four input channels, but it cannot sample all channels continuously due to internal switching overhead and conversion time (~10–20µs per channel depending on clock). To acquire data from all four channels at full resolution, a total acquisition window exceeding 50µs is required, limiting maximum sampling rate to under 20kSPS across all channels. Real-time performance depends heavily on CPU load and whether conversions are triggered by interrupts or polling, making it suitable for periodic sensing rather than high-speed data capture.
How does the operating voltage range of 2.3V to 5.5V influence compatibility with common battery-powered designs, and what design considerations arise when interfacing legacy 5V logic components?
The wide operating voltage range allows the PIC12F1501-I/SN to operate directly from alkaline or Li-ion cells down to near-depleted levels (as low as 2.3V), extending battery life in portable devices. However, interfacing with standard 5V TTL/CMOS systems requires level shifting, since the MCU’s logic high threshold at 2.3V may not reliably recognize 3.3V signals as valid highs. Level shifters or resistive dividers should be used for bidirectional communication to prevent undefined states and ensure noise margin compliance.
What are the key differences between the PIC12F1501-I/SN and other members of the PIC® 12F family in terms of memory organization and peripheral integration?
Compared to larger PIC12F variants such as the PIC12F683, the PIC12F1501-I/SN lacks dedicated EEPROM, has reduced RAM (64 bytes vs. 128+), and omits comparators and timers beyond basic WDT and PWM modules. However, it maintains core 8-bit PIC architecture and shares similar instruction set compatibility, enabling code portability with careful attention to memory constraints. This makes it ideal for applications where flash-only storage and minimal peripherals suffice, whereas devices like the PIC12F683 support user-accessible EEPROM for configuration persistence.
Why might the PIC12F1501-I/SN be selected over higher-pin-count MCUs despite its limited I/O, and what architectural strengths justify this choice in certain embedded designs?
Despite only five I/O lines, the PIC12F1501-I/SN excels in ultra-low-pin-count applications such as single-sensor monitoring or actuator driving where cost, board area, and power consumption dominate requirements. Its integrated BOD, POR, and WDT reduce external circuitry needs, lowering bill-of-materials cost. Additionally, Microchip’s MPLAB ecosystem supports rapid prototyping, enabling designers to validate concepts quickly before scaling to larger platforms—making it a pragmatic starting point for constrained environments.
How does the Moisture Sensitivity Level (MSL) rating of 1 impact manufacturing handling and storage for the PIC12F1501-I/SN, especially in automated assembly environments?
With an MSL rating of 1, the PIC12F1501-I/SN is considered moisture-insensitive and can withstand unlimited exposure to ambient humidity without requiring bake-out prior to reflow soldering. This simplifies inventory management and enables just-in-time procurement in high-volume manufacturing, reducing storage constraints and minimizing thermal stress risks associated with pre-conditioning processes.
What precautions should be taken when programming the PIC12F1501-I/SN to ensure reliable flash memory updates, given its limited erase/write endurance?
Although flash memory offers millions of write cycles, frequent modifications to specific pages can degrade longevity. Best practice involves reserving dedicated flash blocks for configuration data and using wear-leveling algorithms when storing mutable parameters. Avoid writing during critical operations; instead, buffer updates in RAM and commit periodically. Also, ensure stable power during erase/write cycles to prevent corruption—use the device’s built-in BOR and WDT to recover from brownouts.
How does the absence of external oscillator pins affect clock stability and EMI characteristics in PCB layouts using the PIC12F1501-I/SN?
Since the PIC12F1501-I/SN relies solely on its internal oscillator, there are no dedicated XTAL pins, simplifying layout and reducing trace lengths that could act as antennas. This lowers susceptibility to external RF interference and minimizes conducted emissions from crystal circuits. However, internal oscillators may generate slightly higher harmonic noise compared to filtered crystal sources, so proper decoupling capacitors near Vdd and analog ground planes remain essential for clean ADC operation.
In what ways does the PIC12F1501-I/SN support fail-safe operation in industrial environments, and how do its watchdog timer and reset features contribute to system resilience?
The Watchdog Timer (WDT) automatically resets the device if software hangs due to infinite loops or unhandled exceptions, enhancing fault tolerance in unattended deployments. Paired with POR and BOD, these mechanisms ensure deterministic recovery from power disturbances or software faults. In industrial settings where temperature varies from -40°C to 85°C, these features help maintain operational continuity without manual intervention, provided firmware includes proper initialization sequences upon reset.
How does the package type (8-SOIC) influence thermal performance and PCB footprint when integrating the PIC12F1501-I/SN into dense assemblies?
The 8-SOIC (3.9mm width) package provides moderate thermal dissipation due to exposed pad connectivity to ground planes, but its small surface area limits heat spreading compared to larger packages like QFN or DIP. In high-temperature environments near 85°C, sustained current draw on GPIOs or internal peripherals should be monitored to avoid localized heating. However, for most low-power applications, natural convection cooling suffices, and the compact form factor enables high-density routing on double-sided PCBs.
What are the implications of the ECCN classification (EAR99) for international distribution of products containing the PIC12F1501-I/SN, particularly in export-controlled regions?
Classified under EAR99, the PIC12F1501-I/SN is generally exempt from U.S. export licensing requirements, facilitating global sourcing and distribution. This applies unless combined with encryption or military-grade components that trigger additional controls. Most commercial embedded systems incorporating this MCU can be freely exported to most countries without special permits, streamlining supply chain logistics for multinational manufacturers.
How does the lack of dedicated communication peripherals (e.g., SPI/I²C/UART) affect connectivity options when using the PIC12F1501-I/SN, and what workarounds exist?
The PIC12F1501-I/SN has no native UART, SPI, or I²C modules, limiting direct interfacing with standard sensors or displays. Instead, software bit-banging techniques emulate simple protocols over GPIOs, though they consume CPU cycles and reduce responsiveness. Alternatively, external interface ICs can be added, but this increases component count. For low-data-rate applications, Manchester encoding or pulse-width modulation-based signaling may suffice, trading speed for simplicity.
What role does the base product number (PIC12F1501) play in variant selection, and how do packaging differences (like tube vs. reel) impact procurement workflows?
The base product number (PIC12F1501) identifies the core microcontroller family, allowing engineers to compare derivatives with different pin counts or memory sizes. Packaging choices such as tube (for prototype quantities) versus reel (for automated pick-and-place) affect handling and automation suitability. Tube packaging suits hand-soldered prototypes, while reel format aligns with SMT production lines, influencing procurement lead times and minimum order quantities from distributors.
How does the RoHS3 compliance status of the PIC12F1501-I/SN align with modern environmental regulations, and what materials restrictions apply?
As RoHS3 compliant, the PIC12F1501-I/SN adheres to EU Directive 2015/863, restricting hazardous substances including lead, mercury, cadmium, and four phthalates beyond the original six. This ensures compatibility with global electronics recycling standards and avoids regulatory penalties in environmentally conscious markets. No additional testing or documentation is typically required beyond standard compliance declarations, simplifying compliance reporting for OEMs.
When selecting between the PIC12F1501-I/SN and alternative microcontrollers with similar pin counts, what hidden costs should be evaluated beyond unit price and datasheet specifications?
Beyond BOM cost, consider development tool licensing (e.g., MPLAB X IDE), debugger/programmer expenses, and long-term software maintenance burden. The PIC12F1501-I/SN benefits from mature toolchains and community support, reducing debugging time. However, if future scalability to larger PIC families is anticipated, investing in compatible tooling early avoids costly rework. Also, assess power consumption under worst-case conditions—lower quiescent current can outweigh marginal price differences in battery-powered deployments.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology PIC12F1501-I/SN

Product Attribute PIC12F1501T-I/SN PIC12F1501T-I/MS PIC12F1501-I/MS PIC12F1501-E/SN
Part Number PIC12F1501T-I/SN PIC12F1501T-I/MS PIC12F1501-I/MS PIC12F1501-E/SN
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Base Product Number - DAC34H84 MAX500 ADS62P42
Speed - - - -
Connectivity - - - -
Oscillator Type - - - -
Core Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Number of I/O - - - -
Data Converters - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Core Processor - - - -
RAM Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Program Memory Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Program Memory Size - - - -
Series - - - -
Peripherals - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
EEPROM Size - - - -

PIC12F1501-I/SN Datasheet PDF

Download PIC12F1501-I/SN pdf datasheets and Microchip Technology documentation for PIC12F1501-I/SN - Microchip Technology.

Datasheets
Configurable Logic Cell Tip N Tricks.pdf New Peripherals Tips N Tricks.pdf PIC12(L)F1501.pdf
PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf Packing Changes 10/Oct/2016.pdf
PCN Assembly/Origin
Manufacturing Change 07/Apr/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

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PIC12F1501-I/SN Image

PIC12F1501-I/SN

Microchip Technology
32D-PIC12F1501-I/SN

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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