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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersPIC12F1501T-I/MS
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PIC12F1501T-I/MS - Microchip Technology

Manufacturer Part Number
PIC12F1501T-I/MS
Manufacturer
Microchip Technology
Allelco Part Number
32D-PIC12F1501T-I/MS
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
54,550 pcs available, New & Original
Parts Description
IC MCU 8BIT 1.75KB FLASH 8MSOP
Package
8-MSOP
Data sheet
PIC12F1501T-I/M.pdf

Datasheets

PIC12(L)F1501.pdf

PCN Assembly/Origin

2.73KHz.pdf
RoHs Status
ROHS3 Compliant
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In stock: 54550

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Specifications

PIC12F1501T-I/MS Tech Specifications
Microchip Technology - PIC12F1501T-I/MS technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - PIC12F1501T-I/MS

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 2.3V ~ 5.5V
Supplier Device Package 8-MSOP
Speed 20MHz
Series PIC® 12F
RAM Size 64 x 8
Program Memory Type FLASH
Program Memory Size 1.75KB (1K x 14)
Peripherals Brown-out Detect/Reset, POR, PWM, WDT
Package / Case 8-TSSOP, 8-MSOP (0.118', 3.00mm Width)
Package Tape & Reel (TR)
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 5
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 4x10b
Core Size 8-Bit
Core Processor PIC
Connectivity -
Base Product Number PIC12F1501

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 2 (1 Year)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.31.0001

Parts Introduction

PIC12F1501T-I/MS Image
PIC12F1501T-I/MS (1)

Manufacturer Part Number

PIC12F1501T-I/MS

Manufacturer

Microchip Technology

Introduction

The PIC12F1501T-I/MS is a compact, high-performance microcontroller featuring a powerful PIC architecture with a 20MHz clock speed. It is part of the PIC® 12F series and designed for various low-power and space-constrained applications.

Product Features and Performance

Core Processor: PIC

Core Size: 8-Bit

Speed: 20MHz

Connectivity: Not applicable

Peripherals: Brown-out Detect/Reset, Power-on Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT)

Number of I/O: 5

Program Memory Size: 1.75KB (1K x 14)

Program Memory Type: FLASH

RAM Size: 64 x 8

Voltage Supply: 2.3V ~ 5.5V

Data Converters: 4x10 bit ADC

Oscillator Type: Internal

Operating Temperature: -40°C ~ 85°C

Product Advantages

Integrated analog features including ADCs for versatile sensor interfacing.

Low power consumption suitable for battery-powered applications.

Wide operating voltage range to accommodate diverse design requirements.

Small form factor for space-constrained applications.

Key Technical Parameters

Speed: 20MHz

Program Memory Size: 1.75KB

RAM Size: 64 Bytes

Operating Voltage: 2.3V to 5.5V

ADC Resolution: 10-bit

Temperature Range: -40°C to 85°C

Quality and Safety Features

Built-in features for reset management such as Brown-out Detect/Reset and Power-on Reset ensure reliable operation under fluctuating power conditions.

Watchdog Timer for system reliability and recovery from fault conditions.

Compatibility

Compatible with various development environments provided by Microchip Technology.

Easy integration into existing designs thanks to its standard MSOP 8-pin package.

Application Areas

Ideal for low-power, portable applications such as wearable technology, sensor nodes, and small-scale automation systems.

Useful in applications requiring analog integration and direct sensor interfacing.

Product Lifecycle

Status: Active

This model is currently in active production with no immediate discontinuation planned, ensuring long-term availability and support.

Several Key Reasons to Choose This Product

High-performance 8-bit architecture at a competitive price point.

Low power consumption extends the battery life of portable devices.

Versatile ADC options and integrated peripherals support a wide range of application needs without external components.

Robust operation in demanding environments with a wide temperature range.

Supported by Microchip's extensive development tools and software resources.

Small form factor for applications where space is a premium.

Frequently Asked Questions(FAQ)

How does the PIC12F1501T-I/MS compare to other 8-bit PIC microcontrollers in terms of power consumption and program memory density for battery-operated applications?
The PIC12F1501T-I/MS operates at a supply voltage range of 2.3V to 5.5V, making it suitable for low-voltage systems where power efficiency is critical. With only 1.75KB of FLASH program memory organized as 1K x 14 bits, this device offers constrained but sufficient code space for simple control tasks. While not the largest in memory footprint within the PIC12F family, its combination of internal oscillator (eliminating external crystal costs) and low active current makes it competitive in ultra-low-power embedded designs where every microampere counts.
What are the key trade-offs when selecting the PIC12F1501T-I/MS for a sensor data acquisition system requiring analog inputs and minimal GPIO usage?
This microcontroller includes four 10-bit ADC channels, which aligns well with basic sensor reading needs. However, the limited 64-byte RAM constrains the amount of temporary data buffering during conversions or signal processing. With five I/O pins total, careful pin allocation is necessary if analog inputs are used—each ADC channel typically consumes one pin. The absence of dedicated communication peripherals like UART or SPI may necessitate bit-banging for interfacing, increasing software complexity unless external logic handles protocol translation.
Can the PIC12F1501T-I/MS reliably operate in industrial environments with temperature fluctuations between -40°C and +85°C?
Yes, the device is specified for operation across the commercial industrial temperature range of -40°C to +85°C, ensuring stable performance under thermal stress. The internal oscillator maintains timing accuracy within datasheet-defined tolerances across this range, though users should still consider worst-case clock drift in timing-critical applications. No additional compensation circuitry is required due to the built-in calibration features of the PIC® core.
How does the package type (8-MSOP) influence PCB layout considerations when integrating the PIC12F1501T-I/MS into compact consumer electronics?
The 8-MSOP package measures 3.00mm in width and uses a 0.118" pitch, enabling high component density on small PCBs. Its surface-mount design supports automated assembly, but requires precise solder paste application and reflow profiles to avoid tombstoning, especially given the small pad geometry. Thermal vias beneath the package can help dissipate heat from nearby components but must be placed carefully to avoid shorting adjacent pins.
Is it feasible to implement over-the-air firmware updates using the PIC12F1501T-I/MS without an external bootloader chip?
Due to its modest 1.75KB FLASH memory, implementing a full OTA update mechanism would consume a significant portion of available code space, leaving little room for application logic. While possible in simple scenarios with minimal delta updates, the lack of hardware support for serial protocols (UART/SPI/I²C) means any communication layer must be software-emulated, increasing development time and error risk. External flash or EEPROM would likely be needed alongside this MCU for firmware storage during updates.
What is the impact of using the internal oscillator versus an external crystal with the PIC12F1501T-I/MS in terms of cost and reliability?
Using the internal oscillator eliminates the need for external crystals, capacitors, and layout routing, reducing BOM cost and PCB real estate by approximately 15–20%. It also enhances reliability by removing fragile ceramic resonators susceptible to shock or humidity. However, the internal RC oscillator may drift up to ±2% depending on voltage and temperature, potentially affecting timing-sensitive peripherals like PWM or watchdog intervals—critical factors in precision control loops.
How does the Moisture Sensitivity Level (MSL) classification of MSL 2 affect manufacturing handling of the PIC12F1501T-I/MS?
Classified as MSL 2, this device must be stored in dry packaging and assembled within one year of exposure to ambient conditions per JEDEC standards. After opening the moisture barrier bag, it has a maximum floor life of 168 hours before requiring baking, assuming standard storage humidity. Proper handling procedures prevent popcorning during reflow soldering, which could compromise solder joints and device integrity.
Are there any known limitations when combining the ADC functionality with simultaneous PWM output on the PIC12F1501T-I/MS?
While both ADC and PWM modules exist in the core, they do not share resources directly. However, simultaneous use can introduce noise coupling through shared ground planes or supply rails, degrading ADC accuracy. Careful PCB grounding and decoupling are essential. Additionally, interrupt latency from PWM ISRs may delay ADC sampling windows, potentially skewing conversion timing—especially problematic in high-frequency PWM modes above 10kHz.
In what ways does the absence of EEPROM memory affect data persistence strategies when using the PIC12F1501T-I/MS in metering or calibration applications?
Without dedicated EEPROM, non-volatile data storage must rely on FLASH memory, which has limited write endurance (~10k cycles). For frequent parameter logging or configuration changes, this imposes strict write rate constraints to avoid premature failure. Alternatives include using external FRAM or flash ICs, though they add complexity. Alternatively, batch-write configurations during infrequent events reduces wear while maintaining data integrity.
How does the RoHS3 compliance status of the PIC12F1501T-I/MS influence global regulatory acceptance in automotive or medical device designs?
RoHS3 compliance ensures the device meets current European Union directives restricting hazardous substances, including stricter requirements for phthalates. This broadens market eligibility beyond consumer electronics into regulated industries such as medical and industrial automation. However, end-system designers must verify full chain-of-custody documentation, as some subcomponents may still carry transitional exemptions pending full phase-in schedules.
What design precautions are recommended when driving inductive loads directly from I/O pins of the PIC12F1501T-I/MS?
Although five I/O pins are available, sourcing or sinking high-current loads like relays or motors can damage the MCU due to back-EMF. A flyback diode across the load and possibly a series resistor limit inrush current. Transistor drivers (e.g., NPN/PMOS pairs) should be used instead of direct drive whenever currents exceed 20mA or voltages approach the 5.5V rail to protect the microcontroller’s output structures.
Can the Watchdog Timer (WDT) configuration be safely adjusted post-deployment in fielded systems using the PIC12F1501T-I/MS?
Once programmed, most WDT settings (clock source, prescaler ratio) are locked unless a special unlock sequence is executed via firmware—a process that itself depends on correct clock timing. Field reprogramming introduces risk of bricking devices if power fails mid-operation. Therefore, thorough pre-deployment validation in simulated environments is strongly advised before shipping final units.
How does the ECCN classification of EAR99 affect international export controls when sourcing multiple units of PIC12F1501T-I/MS?
Classified under EAR99, these devices fall under U.S. Commerce Control List (CCL) category 5, Part 2 and are generally exempt from licensing requirements for most destinations. However, exporters must still comply with local regulations in importing countries, particularly regarding dual-use potential in military or surveillance applications. End-user agreements should be reviewed to ensure compliance with sanctioned entities lists.
What role does the Base Product Number PIC12F1501 play in selecting compatible development tools and debug interfaces?
The base number PIC12F1501 identifies the entire family of variants sharing the same core architecture, enabling tool compatibility across pin-compatible parts. Microchip’s ICD 3, PICkit™ 4, and other debuggers support all members of this series, simplifying prototyping. Software libraries and HAL implementations are often reusable across these models, accelerating development despite differences in peripheral availability or memory size.
How does the operating frequency of 20MHz affect real-time response in interrupt-driven applications using the PIC12F1501T-I/MS?
At 20MHz, each instruction cycle takes approximately 62.5ns (assuming single-cycle instructions). This allows tight control loops with sub-microsecond latency, beneficial for motor control or fast sensor feedback. However, complex math operations (e.g., floating-point) will consume more cycles, potentially missing deadlines if not optimized. Interrupt nesting and context switching overhead must also be accounted for in deterministic timing budgets.
What are the implications of using the Cut Tape (CT) packaging format versus reel-based delivery for small-volume production runs involving PIC12F1501T-I/MS?
Cut tape is ideal for prototyping or very low-volume builds where individual placement is manageable manually or with pick-and-place machines calibrated for discrete components. It avoids the cost of full reels but increases per-unit handling effort and risk of misalignment. For higher volumes, Digi-Reel® format improves throughput and reduces placement errors through standardized feeder compatibility with automated assembly lines.
How does the DiGi-Electronics Verified status enhance trust in the PIC12F1501T-I/MS for commercial product deployment?
Verification by DiGi-Electronics confirms the part has undergone functional testing aligned with manufacturer specifications, reducing supply chain uncertainty. This third-party validation reassures engineers that the component performs as expected under real-world conditions, mitigating risks associated with counterfeit or improperly graded devices—particularly important in safety-critical or long-lifecycle applications.
Given its small RAM size (64 x 8), what strategies minimize stack overflow when implementing nested function calls or interrupt service routines in PIC12F1501T-I/MS projects?
Minimizing stack depth starts with avoiding deep recursion and limiting local variable usage in ISRs. Instead, defer heavy processing to main loop tasks after flagging completion via flags. Global or static buffers reduce heap fragmentation, and compiler optimization (-O2) helps eliminate redundant pushes. Monitoring stack usage during simulation tools (like MPLAB X IDE) provides visibility into worst-case consumption before deployment.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology PIC12F1501T-I/MS

Product Attribute PIC12F1501T-I/MU PIC12F1501-I/MS PIC12F1501T-I/MF PIC12F1501T-I/SN
Part Number PIC12F1501T-I/MU PIC12F1501-I/MS PIC12F1501T-I/MF PIC12F1501T-I/SN
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Number of I/O - - - -
Series - - - -
Connectivity - - - -
Program Memory Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Core Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply (Vcc/Vdd) - - - -
Data Converters - - - -
RAM Size - - - -
EEPROM Size - - - -
Peripherals - - - -
Core Processor - - - -
Speed - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Program Memory Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Oscillator Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

PIC12F1501T-I/MS Datasheet PDF

Download PIC12F1501T-I/MS pdf datasheets and Microchip Technology documentation for PIC12F1501T-I/MS - Microchip Technology.

Datasheets
PIC12(L)F1501.pdf
HTML Datasheet
Configurable Logic Cell Tip N Tricks.pdf PIC12(L)F1501, PIC16(L)F150x Brief.pdf
PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf Packing Changes 10/Oct/2016.pdf
PCN Assembly/Origin
2.73KHz.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

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In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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PIC12F1501T-I/MS Image

PIC12F1501T-I/MS

Microchip Technology
32D-PIC12F1501T-I/MS

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