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HomeProductsIntegrated Circuits (ICs)Embedded - MicrocontrollersPIC32MX250F256H-50I/PT
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PIC32MX250F256H-50I/PT - Microchip Technology

Manufacturer Part Number
PIC32MX250F256H-50I/PT
Manufacturer
Microchip Technology
Allelco Part Number
32D-PIC32MX250F256H-50I/PT
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
7,411 pcs available, New & Original
Parts Description
IC MCU 32BIT 256KB FLASH 64TQFP
Package
64-TQFP (10x10)
Data sheet
PIC32MX250F256H.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 7411

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Specifications

PIC32MX250F256H-50I/PT Tech Specifications
Microchip Technology - PIC32MX250F256H-50I/PT technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - PIC32MX250F256H-50I/PT

Product Attribute Attribute Value
Manufacturer Microchip Technology
Voltage - Supply (Vcc/Vdd) 2.3V ~ 3.6V
Supplier Device Package 64-TQFP (10x10)
Speed 50MHz
Series PIC® 32MX
RAM Size 32K x 8
Program Memory Type FLASH
Program Memory Size 256KB (256K x 8)
Peripherals Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Package / Case 64-TQFP
Package Tray
Product Attribute Attribute Value
Oscillator Type Internal
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 49
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 28x10b
Core Size 32-Bit Single-Core
Core Processor MIPS32® M4K™
Connectivity I²C, IrDA, LINbus, PMP, SPI, UART/USART, USB OTG
Base Product Number PIC32MX250

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991A2
HTSUS 8542.31.0001

Parts Introduction

PIC32MX250F256H-50I/PT Image
PIC32MX250F256H-50I/PT (1)

Manufacturer Part Number

PIC32MX250F256H-50I/PT

Manufacturer

microchip-technology

Introduction

The PIC32MX250F256H-50I/PT is a high-performance 32-bit microcontroller from Microchip Technology, designed for embedded applications requiring efficient operations at up to 50MHz.

Product Features and Performance

Core Processor: MIPS32® M4K™ for efficient processing and multitasking.

Core Size: 32-Bit Single-Core for powerful computing capabilities.

Speed: Operates at 50MHz, suitable for time-critical applications.

Connectivity: Includes I2C, IrDA, LINbus, PMP, SPI, UART/USART, and USB OTG for versatile peripheral connections.

Peripherals: Features Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT for comprehensive system support.

Number of I/O: Provides 49 input/output ports for extensive external interactions.

Program Memory Size: 256KB, allowing significant application code storage.

Program Memory Type: FLASH for reliable data retention.

RAM Size: 32K x 8, offering ample temporary data storage.

Voltage Supply (Vcc/Vdd): Operates between 2.3V and 3.6V, accommodating low-power requirements.

Data Converters: A/D 28x10b for precise analog to digital conversion.

Oscillator Type: Internal, simplifying the design and reducing the need for external components.

Product Advantages

Integrated USB OTG functionality supports device and host modes, enabling flexible USB applications.

Advanced PWM channels for sophisticated motor control and lighting applications.

Extensive connectivity options facilitate communication with a wide range of peripherals and networks.

High memory capacity supports complex applications and software frameworks.

Key Technical Parameters

50MHz MIPS32® M4K™ core processor

256KB FLASH and 32KB RAM

A/D 28x10b data converters

3V to 3.6V supply voltage range

Quality and Safety Features

Brown-out Detect/Reset and Power-on Reset (POR) provide system stability under fluctuating power conditions.

Watchdog Timer (WDT) for system recovery and maintenance.

Compatibility

Compatible with the MPLAB® IDE and MPLAB XC32 compiler for streamlined development.

Application Areas

Ideal for embedded control systems, industrial automation, IoT devices, and consumer electronics.

Product Lifecycle

Currently in Active status, not nearing discontinuation with ongoing support and availability.

Several Key Reasons to Choose This Product

High processing speed and memory capacity enhance application complexity and performance.

Broad connectivity and advanced peripherals facilitate versatile embedded system designs.

Low power consumption makes it suitable for battery-powered and energy-sensitive applications.

Strong support from Microchip Technology, including software and development tools, simplifies development and reduces time to market.

Frequently Asked Questions(FAQ)

How does the PIC32MX250F256H-50I/PT compare to other PIC32MX250 series devices in terms of program memory and operating voltage range?
The PIC32MX250F256H-50I/PT features 256KB of Flash program memory, which is the maximum available within the PIC32MX250 family. It operates across a supply voltage range of 2.3V to 3.6V, making it suitable for low-power and battery-operated applications. Other variants in the same series may offer smaller memory sizes (such as 128KB or 64KB) but maintain the same voltage flexibility. This configuration allows designers to use a single power rail without level shifting when interfacing with 3.3V peripherals.
What are the key trade-offs when selecting the PIC32MX250F256H-50I/PT for a USB OTG-enabled design?
Implementing USB OTG with the PIC32MX250F256H-50I/PT requires careful attention to clocking and power integrity due to the high-speed signaling demands. The microcontroller supports full-speed USB via its integrated USB module, but achieving reliable enumeration often necessitates precise 48 MHz clock generation using the PLL. Additionally, while the IC includes brown-out detection and power-on reset, external ferrite beads and decoupling capacitors near the VDD pins are strongly recommended to suppress noise during USB data transfers.
Can the PIC32MX250F256H-50I/PT drive multiple I²C buses simultaneously in an industrial control system?
Yes, the PIC32MX250F256H-50I/PT supports multiple independent I²C modules through its peripheral pin select (PPS) feature, allowing flexible assignment of SDA and SCL lines to different physical pins. In practice, this enables up to two concurrent I²C communications—one per hardware module—provided sufficient I/O availability and bus loading considerations are met. However, software overhead increases with each additional active bus, especially under heavy transaction loads.
Is the internal oscillator of the PIC32MX250F256H-50I/PT accurate enough for applications requiring precise timing over temperature?
The device’s internal Fast RC oscillator has a typical accuracy of ±1% at room temperature, degrading to approximately ±5% over the full -40°C to 85°C range. For applications such as motor control or time-critical communication protocols (e.g., CAN), this may be insufficient without calibration or an external crystal. Designers relying on internal oscillation should implement periodic self-calibration routines using the device’s internal phase-locked loop (PLL) feedback mechanism.
What considerations apply when using the analog-to-digital converter (ADC) on the PIC32MX250F256H-50I/PT with sensor inputs spanning wide dynamic ranges?
The PIC32MX250F256H-50I/PT integrates a 10-bit ADC with 28 input channels, offering sufficient resolution for many embedded sensing tasks. However, for signals with large amplitude variations, external programmable gain amplifiers (PGAs) or voltage dividers are typically required to keep input levels within the 0–VDD reference window. Additionally, sample-and-hold behavior and conversion settling time must be accounted for in firmware scheduling to avoid aliasing or inaccurate readings.
How does the DMA capability of the PIC32MX250F256H-50I/PT improve real-time performance in UART-based systems?
The built-in Direct Memory Access controller offloads byte-by-byte UART handling from the CPU, enabling continuous data transfer between serial peripherals and RAM or buffers. This reduces interrupt frequency and CPU utilization—critical in systems transmitting large volumes of telemetry or logging data. For example, a 115200 baud UART can sustain full throughput with minimal latency even when processing other tasks concurrently.
What layout precautions are essential when placing the PIC32MX250F256H-50I/PT on a PCB with mixed-signal components?
Due to its combination of digital logic and analog front ends (like the ADC), the PIC32MX250F256H-50I/PT demands careful partitioning of analog and digital ground planes, with a single-point connection at the power supply entry. High-current digital nets (e.g., GPIO toggling at fast edges) should be routed away from sensitive analog traces. Decoupling capacitors (100nF ceramic plus bulk capacitance) must be placed within 2mm of each VDD/VSS pad to minimize inductance.
Can the PIC32MX250F256H-50I/PT support dual-role operation in a portable device that acts both as host and peripheral?
Yes, the USB OTG module in the PIC32MX250F256H-50I/PT enables dual-role functionality, allowing the device to switch between host and peripheral modes dynamically based on application needs. This requires appropriate pull-up/pull-down resistor configurations on the ID pin and robust VBUS management circuitry to prevent backpowering. Firmware must handle role transitions gracefully to avoid bus conflicts.
How does the watchdog timer configuration affect system reliability when using the PIC32MX250F256H-50I/PT in harsh environments?
The independent Watchdog Timer (WDT) in the PIC32MX250F256H-50I/PT resets the core if not serviced within a defined window, enhancing resilience against software hangs. However, in noisy environments where transient spikes might accidentally trigger resets, adding software redundancy (e.g., heartbeat monitoring of critical tasks) is advisable. The WDT clock source should ideally be derived from a stable internal oscillator rather than the main system clock to avoid co-failure scenarios.
What impact do flash write cycles have on long-term deployment of products using the PIC32MX250F256H-50I/PT?
The PIC32MX250F256H-50I/PT Flash memory supports up to 10,000 erase/write cycles per sector under typical conditions. While sufficient for most firmware update scenarios, frequent rewrites (e.g., logging to non-volatile storage) can degrade performance over time. Designers should implement wear-leveling algorithms or use external EEPROM for data logging to extend operational lifespan.
Is it feasible to run multiple PWM outputs simultaneously on the PIC32MX250F256H-50I/PT without timing conflicts?
Yes, the device provides up to six independent PWM modules with configurable resolution and duty cycles. These can operate concurrently as long as shared resources (like timers or clocks) are properly allocated. For high-precision motor control, pairing PWM with encoder feedback via dedicated capture/compare modules further enhances synchronization and responsiveness.
How does the LINbus support in the PIC32MX250F256H-50I/PT simplify automotive-grade interface implementations?
The integrated LIN transceiver compatibility reduces component count compared to discrete solutions, lowering cost and board space. With baud rates up to 20 kbps and automatic wake-up detection, the PIC32MX250F256H-50I/PT simplifies compliance with automotive network standards while maintaining deterministic response times—critical for body control modules or infotainment subsystems.
What precautions should be taken when booting the PIC32MX250F256H-50I/PT from external memory?
Although primarily designed for internal Flash execution, the PIC32MX250F256H-50I/PT can boot from external SPI Flash under specific configuration. In such cases, signal integrity becomes paramount: trace lengths must match impedance requirements, and pull-up resistors on MOSI/MISO/SCK lines help maintain signal stability. Additionally, firmware must verify checksums before jumping to external code to prevent erratic behavior.
How does the moisture sensitivity level (MSL) rating of MSL 3 influence handling procedures for the PIC32MX250F256H-50I/PT during assembly?
As an MSL 3 device, the PIC32MX250F256H-50I/PT must be stored in moisture barrier bags with desiccant and humidity indicator cards. After opening, it remains usable for up to 168 hours at ≤60% RH before requiring baking. Manufacturers following IPC/JEDEC J-STD-033 guidelines must track exposure time to prevent popcorning during reflow soldering, which could damage the 64-TQFP package.
What advantages does the 50 MHz maximum operating speed provide in compute-intensive applications?
Operating at up to 50 MHz enables the PIC32MX250F256H-50I/PT to execute instructions at ~15 MIPS (MIPS/MHz × clock), providing ample headroom for DSP-like operations such as FFTs or encryption algorithms. Combined with its 32 KB SRAM, this makes it viable for edge-processing tasks previously reserved for larger MCUs, though thermal density may require careful PCB airflow planning.
How does the IrDA module integration benefit wireless sensor node designs using the PIC32MX250F256H-50I/PT?
The built-in IrDA-compliant transceiver eliminates the need for external infrared drivers, reducing bill-of-materials complexity. At 9600 bps to 115.2 kbps, it supports short-range optical communication for proximity detection or simple command links—useful in industrial tagging or asset tracking systems where RF licensing isn’t feasible.
What are the implications of the device’s RoHS3 compliance and REACH status for global manufacturing?
The PIC32MX250F256H-50I/PT meets RoHS3 directives, meaning it contains no restricted substances above threshold limits, including lead-free solder compatibility. Its REACH Unaffected status indicates absence of SVHCs (Substances of Very High Concern), simplifying regulatory documentation for EU and international markets. This dual certification streamlines production approvals across North America, Europe, and Asia.
When would one choose the PIC32MX250F256H-50I/PT over a lower-cost 8-bit AVR or PIC16 variant despite higher unit pricing?
The PIC32MX250F256H-50I/PT justifies its premium in applications demanding mixed-signal integration, moderate computational throughput, and rich connectivity (e.g., USB, Ethernet-ready PMP). For projects requiring future scalability—such as adding Bluetooth Low Energy later via external modules—the ARM-compatible architecture and larger memory footprint offer better ROI than constrained 8-bit alternatives, especially when development time and software portability are considered.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology PIC32MX250F256H-50I/PT

Product Attribute PIC32MX250F256HT-50I/PT PIC32MX250F256HT-50I/MR PIC32MX250F256HT-I/PT PIC32MX250F256H-I/PT
Part Number PIC32MX250F256HT-50I/PT PIC32MX250F256HT-50I/MR PIC32MX250F256HT-I/PT PIC32MX250F256H-I/PT
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Oscillator Type - - - -
Peripherals - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Core Size - - - -
Voltage - Supply (Vcc/Vdd) - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Speed - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Connectivity - - - -
EEPROM Size - - - -
Data Converters - - - -
Number of I/O - - - -
Program Memory Type - - - -
Series - - - -
Core Processor - - - -
RAM Size - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Program Memory Size - - - -

PIC32MX250F256H-50I/PT Datasheet PDF

Download PIC32MX250F256H-50I/PT pdf datasheets and Microchip Technology documentation for PIC32MX250F256H-50I/PT - Microchip Technology.

Datasheets
Cylindrical Battery Holders.pdf
PCN Assembly/Origin
2.73KHz.pdf
PCN Design/Specification
Cancellation Notice 06/Jun/2016.pdf New DeviceDoc 23/May/2016.pdf
HTML Datasheet
PIC32MX1xx,2xx,5xx Datasheet.pdf
PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf MBB/Label Chgs 16/Nov/2018.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

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Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
PIC32MX250F256H-50I/PT Image

PIC32MX250F256H-50I/PT

Microchip Technology
32D-PIC32MX250F256H-50I/PT

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