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Home Products Integrated Circuits (ICs)Embedded - Microcontrollers~~PIC32MX360F512L-80I/BG~~

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PIC32MX360F512L-80I/BG - Microchip Technology

Name: Microchip Technology PIC32MX360F512L-80I/BG
Brand: Microchip Technology
SKU: PIC32MX360F512L-80I/BG
Availability: InStock
Rating: 5 (10 reviews)

Manufacturer Part Number: PIC32MX360F512L-80I/BG

Manufacturer: Microchip Technology

Allelco Part Number: 32D-PIC32MX360F512L-80I/BG

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 4,748 pcs available, New & Original

Parts Description: IC MCU 32BIT 512KB FLSH 121TFBGA

Package: 121-TFBGA (10x10)

Data sheet: PIC32MX360F512L.pdf

PCN Design/Specification
Cylindrical Battery Holders.pdf

PCN Packaging
Label and Packing Changes 23/Sep/2015.pdf MBB/Label Chgs 16/Nov/2018.pdf

HTML Datasheet
PIC32 Microcontroller Brochure.pdf PIC32MX Flash Programming Spec.pdf PIC32MX3xx,4xx Datasheet.pdf

RoHs Status: ROHS3 Compliant

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In stock: 4748

Specifications

PIC32MX360F512L-80I/BG Tech Specifications
Microchip Technology - PIC32MX360F512L-80I/BG technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology - PIC32MX360F512L-80I/BG

Product Attribute	Attribute Value
Manufacturer	Microchip Technology
Voltage - Supply (Vcc/Vdd)	2.3V ~ 3.6V
Supplier Device Package	121-TFBGA (10x10)
Speed	80MHz
Series	PIC® 32MX
RAM Size	32K x 8
Program Memory Type	FLASH
Program Memory Size	512KB (512K x 8)
Peripherals	Brown-out Detect/Reset, DMA, POR, PWM, WDT
Package / Case	121-TFBGA

Product Attribute	Attribute Value
Package	Tray
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
EEPROM Size	-
Data Converters	A/D 16x10b
Core Size	32-Bit Single-Core
Core Processor	MIPS32® M4K™
Connectivity	I²C, IrDA, LINbus, PMP, SPI, UART/USART
Base Product Number	PIC32MX360

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001

Parts Introduction

PIC32MX360F512L-80I/BG (1)

Manufacturer Part Number

PIC32MX360F512L-80I/BG

Manufacturer

Microchip Technology

Introduction

High-performance 32-bit microcontroller with MIPS M4K core

Product Features and Performance

MIPS32 M4K Core

32-bit Architecture

80MHz Operating Speed

512KB Flash Memory

32KB RAM

10-bit Analog-to-Digital Converters

16 ADC Channels

Integrated Oscillator

I2C, IrDA, LINbus, PMP, SPI, UART/USART Connectivity

DMA, PWM, WDT Peripherals

Brown-out Detect/Reset and POR for System Reliability

Surface Mount 121-TFBGA Package

Product Advantages

High computing power

Efficient power consumption

Rich peripheral set for versatile applications

Robust reliability features

Broad operating temperature range

Key Technical Parameters

80MHz Clock Speed

512KB Flash Program Memory

32KB RAM

3V to 3.6V Supply Voltage Range

-40°C to 85°C Operating Temperature

Quality and Safety Features

Brown-out Detect/Reset

Power-on Reset (POR)

Watchdog Timer (WDT)

Compatibility

Compatible with various communication protocols

Supports multiple serial interfaces

Application Areas

Industrial Control

Internet of Things (IoT)

Consumer Electronics

Automotive

Medical Devices

Product Lifecycle

Active status

Current technology offering likely to have a long life cycle

Several Key Reasons to Choose This Product

High-speed 32-bit performance for demanding applications

Flexible connectivity options for diverse uses

Extensive built-in peripherals reduce external component needs

Strong support for development from Microchip Technology

Robust design with safety features suited for critical applications

Broad voltage range and temperature tolerance for harsh environments

Frequently Asked Questions(FAQ)

How does the PIC32MX360F512L-80I/BG compare to other 32-bit microcontrollers in terms of flash memory size and operating frequency when targeting embedded applications requiring real-time performance?: The PIC32MX360F512L-80I/BG offers 512KB of embedded flash memory paired with an 80MHz MIPS32 M4K core, enabling efficient execution of complex firmware routines typical in real-time control systems. While some competing MCUs may offer higher frequencies or larger memories, this device strikes a balance suitable for cost-sensitive designs where moderate throughput and sufficient code storage are required, without exceeding necessary performance headroom.

What are the key trade-offs when selecting the PIC32MX360F512L-80I/BG for a low-power industrial sensor node versus a high-throughput data logger application?: For low-power sensor nodes, the PIC32MX360F512L-80I/BG’s 2.3V to 3.6V supply range supports energy-efficient operation during sleep modes, though its 80MHz peak speed is underutilized. In contrast, data loggers leverage the full 80MHz capability for rapid data processing and buffering, potentially increasing average current draw. The 512KB flash provides ample space for both scenarios, but power profiling must account for peripheral usage such as ADC sampling rates and UART baud rates to optimize battery life.

Can the PIC32MX360F512L-80I/BG reliably drive multiple I2C peripherals at standard speeds while also supporting SPI-based communication with external flash?: Yes, the PIC32MX360F512L-80I/BG includes native I2C, SPI, and UART/USART interfaces, allowing concurrent communication with I2C sensors and SPI flash memory. At 80MHz system clock, the peripheral modules can operate at their maximum specified speeds (e.g., up to 400kHz fast-mode I2C), provided proper GPIO configuration and interrupt handling prevent bus contention. Timing analysis using the MIPS32 M4K pipeline ensures consistent response under multi-master conditions.

How should designers evaluate the impact of temperature range (-40°C to 85°C) on stability when deploying the PIC32MX360F512L-80I/BG in automotive edge devices?: The industrial temperature grade of the PIC32MX360F512L-80I/BG allows deployment in environments with thermal cycling, but long-term reliability requires attention to PCB layout, decoupling near the 121-TFBGA package, and clock source stability. Internal oscillators may drift slightly with temperature; thus, critical timing applications might benefit from external crystal tuning. Thermal simulations should confirm junction temperatures stay within safe limits during peak load cycles.

Is the 32K x 8 RAM sufficient for implementing a real-time motor control algorithm using PWM and DMA transfers on the PIC32MX360F512L-80I/BG?: A 32KB SRAM provides adequate workspace for most motor control tasks involving lookup tables, PID state variables, and DMA buffers. With DMA handling ADC-to-memory transfers and PWM register updates offloaded from CPU cycles, the core can dedicate cycles to trajectory computation. However, complex field-oriented control algorithms with floating-point math may require software emulation due to lack of FPU, increasing cycle count and necessitating careful memory partitioning.

What considerations apply when bootloading firmware updates into the PIC32MX360F512L-80I/BG over UART, given its flash architecture?: Firmware updates via UART require implementing a bootloader that respects flash write/erase block boundaries—typically 1KB sectors—and avoids overwriting active code regions. The PIC32MX360F512L-80I/BG supports in-system programming (ISP), but erase operations suspend interrupts temporarily, which may disrupt time-critical tasks. Redundant image slots and CRC validation enhance robustness, ensuring partial writes don’t corrupt running applications.

How does the choice between internal vs external oscillator affect system jitter when using the PIC32MX360F512L-80I/BG for precision ADC measurements?: The internal oscillator provides convenience but exhibits higher phase noise (~1–3% frequency tolerance), which can degrade ADC sampling accuracy in high-resolution applications. For 10-bit conversions across 16 channels, this margin may be acceptable, but if achieving <1 LSB error is required, an external crystal with ±20ppm stability significantly reduces timing uncertainty during sample-and-hold phases.

What design constraints arise from mounting the PIC32MX360F512L-80I/BG in a 121-TFBGA (10x10) package for compact PCB layouts?: The fine-pitch BGA package demands precise solder mask definition and via-in-pad stitching to ensure reliable connections under thermal stress. Stencil printing must account for paste volume to avoid bridging between adjacent pads, especially around power rails supplying the core logic. X-ray inspection is recommended post-assembly to verify joint integrity, particularly in mass-production environments.

Does the PIC32MX360F512L-80I/BG support dynamic voltage scaling to conserve power during intermittent operation?: While the device operates reliably across 2.3V to 3.6V, it lacks hardware-assisted dynamic voltage and frequency scaling (DVFS). Designers must implement software-controlled clock switching between internal PLL modes and manage supply rails manually if ultra-low-power operation is essential. This simplifies firmware but shifts optimization responsibility to external regulators or LDOs tailored to runtime needs.

How can developers mitigate potential flash wear-out issues when frequently updating non-volatile parameters on the PIC32MX360F512L-80I/BG?: Flash endurance for the PIC32MX360F512L-80I/BG is rated for 10,000 write cycles per sector. To extend lifespan, implement wear-leveling algorithms that distribute updates across multiple logical blocks mapped to physical sectors. Store counters in RAM or protected flash regions, and consider using EEPROM emulation techniques sparingly only when absolute reliability outweighs memory overhead.

What role does the watchdog timer play in ensuring robustness when using the PIC32MX360F512L-80I/BG in unattended remote installations?: The integrated WDT provides hardware-enforced recovery from software hangs caused by stack overflows or infinite loops. In remote deployments, periodic “heartbeat” signals from main loop execution reset the WDT; failure to do so triggers a controlled restart, restoring functionality without user intervention. Careful timeout calibration prevents false resets during legitimate long operations like sensor polling bursts.

When interfacing the PIC32MX360F512L-80I/BG with a touchscreen controller via I2C, what signal integrity measures are advisable?: Given the 10x10mm footprint and high pin density, routed I2C traces should maintain impedance control, minimize stub lengths, and include series termination resistors (typically 22–47Ω) near the microcontroller. Pull-up resistors matching bus capacitance ensure rise times stay within I2C specification (<1µs for standard mode), preventing arbitration failures especially at elevated ambient temperatures affecting trace resistance.

Parts with Similar Specifications

The three parts on the right have similar specifications to Microchip Technology PIC32MX360F512L-80I/BG

Product Attribute
Part Number	PIC32MX360F512LT-80I/BG	PIC32MX360F512LT-80V/BG	PIC32MX360F256LT-80I/BG	PIC32MX360F512L-80I/PT
Manufacturer	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Speed	-	-	-	-
Connectivity	-	-	-	-
Supplier Device Package	-	196-NFBGA (12x12)	16-PDIP	64-VQFN (9x9)
Oscillator Type	-	-	-	-
Package / Case	-	196-LFBGA	16-DIP (0.300', 7.62mm)	64-VFQFN Exposed Pad
Program Memory Type	-	-	-	-
Program Memory Size	-	-	-	-
RAM Size	-	-	-	-
Series	-	-	-	-
Voltage - Supply (Vcc/Vdd)	-	-	-	-
Core Size	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Data Converters	-	-	-	-
EEPROM Size	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Core Processor	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Peripherals	-	-	-	-

PIC32MX360F512L-80I/BG Datasheet PDF

Download PIC32MX360F512L-80I/BG pdf datasheets and Microchip Technology documentation for PIC32MX360F512L-80I/BG - Microchip Technology.

PCN Design/Specification: Cylindrical Battery Holders.pdf
PCN Packaging: Label and Packing Changes 23/Sep/2015.pdf MBB/Label Chgs 16/Nov/2018.pdf
HTML Datasheet: PIC32 Microcontroller Brochure.pdf PIC32MX Flash Programming Spec.pdf PIC32MX3xx,4xx Datasheet.pdf

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Customer Reviews

Evaluation: 10 Articles

Dani***alkerTech

Jun 1, 2026

Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.
Yuki***aka88

May 26, 2026

信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。
Stev***aker

May 20, 2026

Solid diode for power rectification. Works well in switching circuits.
Bran***Lewis

May 11, 2026

Compact FPGA with good performance. Suitable for basic signal processing tasks.
Oliv***arris

May 7, 2026

Reliable I/O expander. Works well in embedded control applications.
Jess***Jones

Apr 17, 2026

It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.
Mich***Smith

Apr 17, 2026

Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.
Aman***arris

Apr 3, 2026

It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.
Mike***nch

Apr 3, 2026

Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.
Daic***K.

Mar 23, 2026

Very good. No issue after long time testing.

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Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

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Use our account for the shipment. Refer to the table below for the approximate charges.

(Different time frame / countries / package size has different price.)

Delivery Method

Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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