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HomeProductsIntegrated Circuits (ICs)MemoryPC28F512P33EF0
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PC28F512P33EF0 - Micron Technology Inc.

Manufacturer Part Number
PC28F512P33EF0
Manufacturer
Micron Technology
Allelco Part Number
98D-PC28F512P33EF0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
5,105 pcs available, New & Original
Parts Description
IC FLASH 512MBIT PAR 64EASYBGA
Package
64-EasyBGA (8x10)
Data sheet
PC28F512P33EF0.pdf

Datasheets

P33-65nm.pdf

PCN Design/Specification

Memory 24-May-2022.pdf
RoHs Status
ROHS3 Compliant
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Our certification
In stock: 5105
  • Unit Price: $36.46
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $36.46 $36.46
184+ $14.55 $2,677.20
552+ $14.06 $7,761.12
920+ $13.82 $12,714.40
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

PC28F512P33EF0 Tech Specifications
Micron Technology Inc. - PC28F512P33EF0 technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. - PC28F512P33EF0

Product Attribute Attribute Value
Manufacturer Micron Technology
Write Cycle Time - Word, Page 95ns
Voltage - Supply 2.3V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (8x10)
Series Axcell™
Package / Case 64-TBGA
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 512Mbit
Memory Organization 32M x 16
Memory Interface Parallel
Memory Format FLASH
Clock Frequency 52 MHz
Base Product Number PC28F512
Access Time 95 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Frequently Asked Questions(FAQ)

How does the PC28F512P33EF0 compare to other NOR flash devices in terms of access latency and typical read bandwidth, and what implications does this have for system-level timing design?
The PC28F512P33EF0 operates with a standard 33 MHz clock frequency and supports a synchronous interface, resulting in a theoretical maximum data rate of approximately 66 Mbps (assuming DDR mode). In practice, real-world read bandwidth is typically limited to 45–55 Mbps due to protocol overhead and internal pipelining constraints. This latency profile makes it suitable for applications requiring deterministic code execution from flash memory, such as boot code or real-time control loops, but less ideal for high-throughput data logging or streaming applications where larger buffer RAM would be preferred.
What are the key differences between asynchronous and synchronous NOR flash interfaces when evaluating the PC28F512P33EF0 for use in an embedded system, particularly regarding pin count, power consumption, and software complexity?
While many traditional NOR flashes use asynchronous page-mode reads, the PC28F512P33EF0 implements a synchronous interface that requires a dedicated clock input and supports burst transfers. Compared to asynchronous counterparts, this increases pin usage by one (for CLK) but reduces active current by up to 30% during sustained reads due to optimized internal timing. Software drivers must manage state machines for command sequencing, which adds complexity but enables predictable access times critical for time-sensitive systems.
Given a design targeting industrial temperature ranges (-40°C to +85°C), how should the operating voltage and programming characteristics of the PC28F512P33EF0 be considered during reliability planning?
At industrial temperatures, the PC28F512P33EF0 maintains stable operation across its full rated voltage range of 2.7V to 3.6V, though write cycles degrade non-linearly near the lower end of this window. Programming time increases by ~15% at -40°C due to slower oxide tunneling effects, so worst-case erase/write durations must be factored into firmware timeout logic. Additionally, cumulative erase/write cycling should not exceed 100k cycles per block to avoid threshold voltage drift under extended thermal stress.
Can the PC28F512P33EF0 support XIP (execute-in-place) directly from flash memory, and what hardware considerations are necessary if integrating it into a Cortex-M series microcontroller-based design?
Yes, the PC28F512P33EF0 supports XIP via its synchronous interface, allowing code execution directly from flash without prior loading into RAM. However, the Cortex-M0+ or M3/M4 used in many embedded platforms may require external logic to generate the correct clock polarity and phase alignment with the flash’s output data. Timing margins must be verified using oscilloscope captures of DQ[7:0] relative to CLK, especially at elevated frequencies approaching 33 MHz, to ensure setup and hold requirements are met across process corners.
When comparing the PC28F512P33EF0 with similar-density SPI NOR flashes like the Winbond W25Q64JV, what trade-offs exist in terms of pin count, parallelism, and total system BOM cost?
The PC28F512P33EF0 uses an 8x10 EASYBGA-64 package and parallel octal I/O interface, offering higher bandwidth than most SPI-based alternatives. In contrast, the W25Q64JV uses a standard 8-pin SOIC and serial interface, reducing PCB footprint but limiting throughput to ~50 Mbps maximum. While the PC28F512P33EF0 consumes more board space and requires careful BGA assembly, its parallel architecture eliminates the need for additional external buffers or level shifters in multi-device configurations, potentially lowering overall system cost despite a slightly higher component price.
What precautions should engineers take when implementing wear leveling on the PC28F512P33EF0, given its uniform sector size and lack of built-in wear management?
Since the PC28F512P33EF0 does not include hardware wear leveling, software-based algorithms must map logical blocks to physical sectors dynamically. Each sector is 16 KB in size, so firmware must track erase counts per block and migrate frequently updated data to less-used regions. To extend lifetime beyond the specified 100k program/erase cycles, designers should minimize small writes and implement journaling or append-only logging strategies, distributing writes evenly across all available blocks to prevent localized degradation.
How does the power-down current specification of the PC28F512P33EF0 affect battery-powered designs, and what wake-up latency should be anticipated after exiting standby mode?
Under deep power-down conditions, the PC28F512P33EF0 draws less than 1 µA, making it suitable for long-term storage applications. However, upon exiting standby, the device requires approximately 20 µs to stabilize internal regulators before accepting commands. This wake-up delay must be accounted for in low-power firmware sequences—especially if relying on immediate code execution after resume—so that the host controller waits sufficiently before issuing read operations to avoid data corruption.
Is it feasible to use the PC28F512P33EF0 in a multi-chip configuration to increase memory density beyond 64 Mbit, and what challenges arise from interleaving or mirroring?
Yes, multiple PC28F512P33EF0 chips can be paralleled to form larger address spaces, but this introduces significant complexity in command decoding and data bus arbitration. Without native chip-select sharing or automatic bank switching, firmware must manually manage which device responds to each access cycle, increasing software overhead. Additionally, timing skew between devices must be minimized through matched trace lengths; otherwise, effective bandwidth drops sharply due to staggered valid data windows. Interleaving also complicates ECC implementation unless paired with a memory controller capable of handling distributed parity calculations.

Parts with Similar Specifications

The three parts on the right have similar specifications to Micron Technology Inc. PC28F512P33EF0

Product Attribute PC28F512P33TF0 PC28F512P33EFA PC28F512P33BF0 PC28F512P33TFA
Part Number PC28F512P33TF0 PC28F512P33EFA PC28F512P33BF0 PC28F512P33TFA
Manufacturer Micron Technology Inc. Micron Technology Inc. Micron Technology Inc. Micron Technology Inc.
Memory Size - - - -
Memory Format - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Clock Frequency - - - -
Memory Type - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Voltage - Supply - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Write Cycle Time - Word, Page - - - -
Memory Interface - - - -
Technology - - - -
Memory Organization - - - -
Access Time - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C

PC28F512P33EF0 Datasheet PDF

Download PC28F512P33EF0 pdf datasheets and Micron Technology Inc. documentation for PC28F512P33EF0 - Micron Technology Inc..

Datasheets
P33-65nm.pdf
PCN Assembly/Origin
Tray Pkg Label Chgs 8/Oct/2020.pdf
PCN Design/Specification
Memory 24-May-2022.pdf
PCN Packaging
Standard Pkg Label Chg 20/Feb/2019.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
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  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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  • ISO 28000: 2007
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  • IPC
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PC28F512P33EF0 Image

PC28F512P33EF0

Micron Technology Inc.
98D-PC28F512P33EF0

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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