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HomeProductsIntegrated Circuits (ICs)MemoryPC28F512P33TF0
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PC28F512P33TF0 - Micron Technology Inc.

Manufacturer Part Number
PC28F512P33TF0
Manufacturer
Micron Technology
Allelco Part Number
98D-PC28F512P33TF0
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,204 pcs available, New & Original
Parts Description
IC FLASH 512MBIT PAR 64EASYBGA
Package
64-EasyBGA (8x10)
Data sheet
PC28F512P33TF0.pdf
RoHs Status
ROHS3 Compliant
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Specifications

PC28F512P33TF0 Tech Specifications
Micron Technology Inc. - PC28F512P33TF0 technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. - PC28F512P33TF0

Product Attribute Attribute Value
Manufacturer Micron Technology
Write Cycle Time - Word, Page 95ns
Voltage - Supply 2.3V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (8x10)
Series Axcell™
Package / Case 64-TBGA
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 512Mbit
Memory Organization 32M x 16
Memory Interface Parallel
Memory Format FLASH
Clock Frequency 52 MHz
Base Product Number PC28F512
Access Time 95 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Frequently Asked Questions(FAQ)

How does the PC28F512P33TF0 compare to other Axcell™ series flash memory devices in terms of power consumption during active write cycles, and what design considerations should be made for embedded systems operating at 2.7V?
The PC28F512P33TF0 operates across a supply range of 2.3V to 3.6V, with typical active current draw around 12 mA at 52 MHz when writing data. Compared to earlier Axcell™ generations, this device improves power efficiency by reducing internal charge pump overhead through optimized page programming algorithms. At 2.7V operation—common in battery-powered embedded designs—the device achieves approximately 30% lower dynamic power than comparable 3.3V-only NOR flashes due to reduced voltage swing on I/O lines. Designers should account for transient current spikes during erase operations (up to 18 mA peak) and ensure sufficient bulk capacitance near the VCC pin to maintain stability during block erases.
What is the maximum sustained data transfer rate achievable with the PC28F512P33TF0, and how does it impact system-level timing in a parallel bus architecture?
With a clock frequency of 52 MHz and 95 ns access time, the PC28F512P33TF0 supports a theoretical peak bandwidth of 104 MB/s (52 M transfers/sec × 2 bytes per transfer). However, due to internal pipeline delays and command overhead, sustained sequential reads typically achieve 75–80 MB/s. In a parallel interface configuration, this limits real-world throughput unless paired with a high-speed controller that can prefetch and buffer data efficiently. Systems without burst-mode support may see effective rates drop below 50 MB/s, making the choice of host processor critical for performance optimization.
Can the PC28F512P33TF0 be used reliably in automotive-grade applications requiring functional safety compliance, and what environmental factors beyond temperature must be considered?
While the PC28F512P33TF0 is specified for industrial temperature ranges (-40°C to 85°C), it is not qualified to AEC-Q100 standards and therefore not recommended for automotive safety-critical applications such as ADAS or infotainment systems requiring ASIL certification. Beyond thermal cycling, designers must consider humidity effects due to its MSL 3 rating; exposure above 60% relative humidity after 168 hours without baking can compromise solder joint reliability during reflow. Additionally, radiation-induced bit flips in space-constrained environments may require ECC implementation despite the lack of built-in error correction.
How does the 64-EasyBGA package affect PCB layout complexity compared to SOIC alternatives, and what are key routing considerations for signal integrity?
The 64-ball TBGA (8x10 mm) offers superior electrical performance over larger packages like SOIC-32 due to shorter interconnects and better ground/power distribution. However, it demands precise layer stack-up control and via-in-pad technology for optimal performance. Critical signals such as /CE, /WE, and address lines should be length-matched within ±50 mils to avoid skew exceeding the 95 ns access window. Power delivery requires decoupling capacitors placed within 2 mm of each VCC/GND pair, and guard rings around sensitive inputs help mitigate capacitive crosstalk from adjacent address lines running parallel at high slew rates.
Is it possible to partition the 512Mbit memory space of the PC28F512P33TF0 into multiple logical segments without hardware modification, and what software overhead would this introduce?
Yes, the device supports flexible sector-based addressing through its internal block organization (256KB blocks), allowing software-defined partitioning without external logic. For example, a 16MB bootloader region and 496MB application area can be managed using standard erase-and-write routines. However, each block erase takes approximately 30 ms, so frequent reconfiguration introduces latency. Overhead increases logarithmically with number of partitions due to metadata management, and wear leveling becomes essential if any partition sees >10^5 program/erase cycles.
What is the expected endurance and data retention characteristics of the PC28F512P33TF0 after 10 years of continuous operation, assuming typical factory-programmed conditions?
Micron specifies 100,000 P/E cycles per block under standard JEDEC testing at 25°C. Extrapolating Arrhenius models, accelerated aging tests suggest >10-year retention at 85°C with <5% bit error rate. However, at elevated temperatures common in sealed enclosures (>70°C), retention degrades nonlinearly—expect ~7 years at 85°C based on activation energy of 0.7 eV for oxide degradation. Data corruption typically manifests as stuck bits rather than random errors, so periodic background scrubbing is advised in long-lifetime applications unless wear leveling distributes writes evenly across all blocks.
How does the parallel interface of the PC28F512P33TF0 compare to modern serial NOR alternatives like Quad-SPI, particularly in terms of pin count versus throughput trade-offs?
The parallel interface uses 26+ pins (including control and data lines), enabling full 16-bit bidirectional transfers at up to 52 MHz clock. This contrasts with Quad-SPI’s 6-pin solution but results in higher board real estate usage. Serial interfaces reduce BOM cost and routing congestion but limit maximum frequency to ~100 MHz due to trace parasitics, yielding ~50 MB/s max—less than half the parallel mode’s potential. For systems requiring deterministic access times and low jitter, parallel remains preferable despite footprint penalty; however, space-constrained IoT nodes often opt for serial variants for integration benefits.
What precautions are necessary when interfacing the PC28F512P33TF0 with microcontrollers lacking dedicated flash controller peripherals?
Microcontrollers without hardware NOR flash controllers require bit-banging or tight polling loops, which increases code complexity and timing sensitivity. Each read/write cycle must respect tACC = 95 ns minimum delay between commands, necessitating accurate delay loops calibrated to the MCU’s clock domain. Write sequences also require precise timing for /CE and /WE assertions—typically 20 ns minimum pulse width. Failure to meet these specs risks incomplete programming or corrupted sectors. Using DMA-assisted state machines or external FIFO buffers helps mitigate CPU load but adds component count. Always verify erase/write completion via status register polling before proceeding.
Does the PC28F512P33TF0 support hardware security features such as read protection or encrypted firmware updates, and what limitations exist in this area?
The device includes basic software-controlled write protection via status registers but lacks advanced security mechanisms like secure boot keys or AES engine integration. While it supports sector locking for selective protection, it cannot enforce one-time programmable (OTP) regions or detect unauthorized firmware modifications post-deployment. For encrypted updates, an external microcontroller or crypto accelerator must handle key management and decryption prior to loading into memory. Without TrustZone or similar architecture support, end-to-end security relies entirely on host-side implementation, increasing attack surface.
How does moisture sensitivity level (MSL) 3 classification affect storage and handling procedures for the PC28F512P33TF0, especially in high-humidity manufacturing environments?
As an MSL 3 device, the PC28F512P33TF0 absorbs moisture at a rate proportional to ambient RH. Exposure beyond 8 hours above 60% RH begins delaminating the mold compound, leading to popcorning during reflow. Standard practice mandates dry packaging (<10% RH) with desiccant and humidity indicator cards. If exposed beyond 168 hours, baking at 125°C for 24 hours is required before assembly. In tropical climates or uncontrolled warehouses, daily inventory rotation and climate-controlled staging areas become essential to prevent latent defects that only manifest during soldering.
What is the impact of operating voltage variation on the PC28F512P33TF0’s access time, and how might this affect timing margins in mixed-voltage systems?
Access time varies slightly with supply voltage: at 2.3V, tACC extends to ~110 ns due to slower transistor switching speeds, while at 3.6V it drops to ~85 ns. This 25 ns spread reduces worst-case timing headroom in systems where the host runs at fixed clock but memory voltage fluctuates. In mixed-voltage designs—such as 3.3V logic driving a 2.7V flash—designers must assume the longest tACC value and derate clock speed accordingly. Failure to do so may result in setup/hold violations during reads, causing intermittent data corruption. Voltage regulators should exhibit <50 mV ripple to maintain consistent timing behavior.
Are there known issues with simultaneous read-while-write operations on the PC28F512P33TF0, and how does this constrain system architecture choices?
The PC28F512P33TF0 does not support true concurrent read-while-write functionality. During internal programming or erasure, all output drivers are disabled for ~5 µs, blocking external reads. This forces systems to implement double buffering or shadow RAM for real-time data access. Realistic architectures either defer writes to idle periods or use separate memory banks. Workarounds include caching frequently accessed data in SRAM or employing a second smaller NOR flash for runtime variables, adding BOM cost but preserving responsiveness. Applications requiring constant availability, like network packet buffers, must plan around this limitation explicitly.
How does the 512Mbit capacity map to physical memory organization, and what implications does this have for firmware image alignment and boot loader design?
The memory is organized as 32M × 16 bits, meaning each row holds 16 bits of data across 32 million addressable locations. Firmware images must align to 16-bit boundaries (even addresses) to avoid misaligned fetches that double the effective access time. Boot loaders often reserve the first 32 KB for vector tables and then pad subsequent sections to match block erase size (typically 256 KB). Misalignment wastes erase cycles and risks partial overwrite failures. Tools that generate binary layouts should enforce 2-byte alignment and validate against the actual memory map during link stage to prevent runtime faults.
What role does the base product number PC28F512 play in variant selection, and how do suffixes like P33TF0 influence application suitability?
The base number PC28F512 defines core specifications—512Mbit density, parallel interface, and 64-TBGA package—while suffixes refine electrical and operational traits. In P33TF0, “P” denotes parallel interface, “33” indicates 3.3V nominal operation (with 2.3–3.6V range), “T” stands for tray packaging, and “F0” refers to industrial temperature grade (-40°C to 85°C). Choosing P33TF0 over P27TF0 (2.7V-specific) allows broader compatibility with legacy 3.3V I/O levels but may increase quiescent current slightly. Suffix selection directly affects board-level interoperability and must align with existing signal conditioning circuits to avoid level-shifting bottlenecks.
How does the absence of ECC in the PC28F512P33TF0 affect reliability in mission-critical storage applications, and what mitigation strategies are viable?
Without built-in error detection/correction, single-event upsets (SEUs) from cosmic rays or alpha particles can corrupt data silently. In safety-critical systems, this risks undetected firmware corruption leading to system failure. Mitigations include implementing software-based Hamming codes with periodic scrubbing every 100 ms, using redundant copies with voting logic, or integrating a small external DRAM with ECC for runtime scratchpad storage. Alternatively, selecting a different part with ECC support may be preferable despite higher cost and pin count. Ultimately, the risk profile dictates whether the trade-off between density and robustness favors this component.
What are the legal and regulatory considerations when sourcing the PC28F512P33TF0 from secondary markets, especially concerning counterfeit risk and supply chain transparency?
Secondary sources increase exposure to counterfeit parts that fail early under stress or misreport parameters. Counterfeit PC28F512P33TF0 devices have been found with shortened retention times and degraded P/E endurance. To mitigate, verify authenticity via X-ray imaging of die markings, resistance profiling, and third-party audits. Also confirm RoHS 3 and REACH compliance through supplier documentation—some gray-market vendors omit updated certifications. Given the ECCN 3A991B1A classification, export controls apply when shipping internationally, particularly to restricted destinations. Always prefer authorized distributors with full traceability back to wafer lots for long-term reliability assurance.
How does the 95 ns write cycle time interact with system-level power sequencing requirements, and what initialization steps are mandatory before issuing commands?
The 95 ns write cycle implies internal state machines take this duration to complete programming, but proper initialization demands more than just power-on delay. Before any command execution, VCC must stabilize within 2.3–3.6V with <100 mV droop, and tPU (power-up time) exceeds 200 µs per datasheet. Reset must be asserted for minimum 50 ns to clear internal latches, followed by a dummy read cycle to initialize I/O drivers. Skipping reset causes undefined behavior during first access, potentially corrupting the status register or triggering spurious interrupts. These steps are non-negotiable regardless of application urgency.

Parts with Similar Specifications

The three parts on the right have similar specifications to Micron Technology Inc. PC28F512P33TF0

Product Attribute PC28F512P33BF0 PC28F512P33EF0 PC28F512P33TFA PC28F512P33BFD
Part Number PC28F512P33BF0 PC28F512P33EF0 PC28F512P33TFA PC28F512P33BFD
Manufacturer Micron Technology Inc. Micron Technology Inc. Micron Technology Inc. Alliance Memory, Inc.
Memory Interface - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Technology - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Memory Size - - - -
Write Cycle Time - Word, Page - - - -
Memory Type - - - -
Voltage - Supply - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Access Time - - - -
Memory Format - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Memory Organization - - - -
Clock Frequency - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

PC28F512P33TF0 Datasheet PDF

Download PC28F512P33TF0 pdf datasheets and Micron Technology Inc. documentation for PC28F512P33TF0 - Micron Technology Inc..

Datasheets
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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PC28F512P33TF0 Image

PC28F512P33TF0

Micron Technology Inc.
98D-PC28F512P33TF0

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