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HomeProductsIntegrated Circuits (ICs)MemoryPC28F640J3D75A
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PC28F640J3D75A - Micron Technology Inc.

Manufacturer Part Number
PC28F640J3D75A
Manufacturer
Micron Technology
Allelco Part Number
32D-PC28F640J3D75A
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
14,020 pcs available, New & Original
Parts Description
IC FLASH 64MBIT PAR 64EASYBGA
Package
64-EasyBGA (10x13)
Data sheet
PC28F640J3D75A.pdf
RoHs Status
ROHS3 Compliant
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In stock: 14020

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Specifications

PC28F640J3D75A Tech Specifications
Micron Technology Inc. - PC28F640J3D75A technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. - PC28F640J3D75A

Product Attribute Attribute Value
Manufacturer Micron Technology
Write Cycle Time - Word, Page 75ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (10x13)
Series StrataFlash™
Package / Case 64-TBGA
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 64Mbit
Memory Organization 8M x 8, 4M x 16
Memory Interface Parallel
Memory Format FLASH
Base Product Number PC28F640
Access Time 75 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Parts Introduction

PC28F640J3D75A Image
PC28F640J3D75A (1)

Manufacturer Part Number

PC28F640J3D75A

Manufacturer

micron-technology

Introduction

The PC28F640J3D75A is a 64Mbit FLASH memory chip offering reliable, high-speed storage solutions for diverse applications.

Product Features and Performance

FLASH NOR Technology

Non-Volatile Memory Type

64Mbit Memory Size with an organization of 8M x 8, 4M x 16

Parallel Memory Interface

Write Cycle Time Word, Page: 75ns

Access Time: 75 ns

Operating within 2.7V ~ 3.6V supply voltage

Operating Temperature range from -40°C ~ 85°C

Surface Mount Mounting Type

Housed in a 64-TBGA package with a 64-EasyBGA (10x13) device package

Product Advantages

High-density data storage solution

Fast write and access times facilitate quick data retrieval and storage

Wide operating temperature range enhances reliability under varied environmental conditions

Flexible voltage range supports diverse system requirements

Key Technical Parameters

64Mbit Memory Size

Parallel Interface

75ns Access and Write Cycle Time

7V ~ 3.6V Supply Voltage

-40°C ~ 85°C Operating Temperature

Quality and Safety Features

Manufactured by micron-technology, known for high-quality standards

Obsolete status ensures rigorous testing and reliability of remaining stocks

Compatibility

Compatible with systems requiring parallel interface Non-Volatile FLASH memory

Application Areas

Embedded systems

Industrial applications

Communication devices

Consumer electronics

Product Lifecycle

The product status marked as Obsolete indicates that it is no longer in production

Replacement or upgrade options should be considered for new designs

Several Key Reasons to Choose This Product

Offers ample storage capacity with 64Mbit size for sophisticated applications

Ensures high-speed data transactions with 75ns write and access cycles

Supports a broad range of operating conditions, making it suitable for diverse applications

Reliable product from a reputable manufacturer, ensuring quality and durability

Due to its Obsolete status, it presents a valuable option for maintaining or repairing existing systems where this specific model is required

Frequently Asked Questions(FAQ)

How does the PC28F640J3D75A compare to other StrataFlash™ NOR flash memory ICs in terms of access time and supply voltage requirements when used in embedded systems requiring fast code execution?
The PC28F640J3D75A offers a 75 ns access time, which enables relatively quick read operations suitable for time-sensitive embedded applications. This performance level is consistent with other members of Micron’s StrataFlash™ family that target mid-range performance segments. While some newer StrataFlash variants may achieve lower latencies through advanced process scaling or interface optimizations, the J3D75A maintains compatibility with legacy system designs where timing margins are constrained by peripheral components rather than memory speed. Its voltage range of 2.7V to 3.6V provides flexibility across industrial-grade power rails but may require careful regulation in battery-powered systems where efficiency is critical.
What are the implications of using the PC28F640J3D75A in an automotive-grade application given its specified operating temperature range and package reliability characteristics?
Although the PC28F640J3D75A supports an industrial temperature range from -40°C to +85°C, this does not automatically qualify it for automotive AEC-Q100 certification. Automotive environments often require extended temperature operation up to +125°C and rigorous qualification testing including thermal cycling, humidity resistance, and functional validation under fault conditions. The 64-EasyBGA (10x13) package offers good solder joint reliability due to its small form factor and fine pitch, but long-term exposure to vibration or thermal stress beyond the rated range could impact mechanical integrity. Designers considering automotive use should verify part availability in qualified grades and assess whether additional environmental hardening is necessary.
Can the PC28F640J3D75A be used in parallel configuration to increase data throughput, and what design considerations apply to address bus width and timing alignment?
Yes, the PC28F640J3D75A supports multiple memory organizations including 8M x 8 and 4M x 16, enabling flexible parallel configurations such as dual-8-bit mode for 16-bit data buses. However, achieving synchronized operation requires matching propagation delays across devices—each unit has a 75 ns access time, so marginal variations between parts can accumulate in wider configurations. System-level timing budgets must account for address decoding overhead, setup/hold windows, and potential skew introduced by PCB trace length differences. Additionally, write protection circuitry and block erase sequencing become more complex when managing multiple die simultaneously, increasing firmware complexity and risk of partial programming errors.
What is the expected endurance profile for the PC28F640J3D75A, and how does this influence wear-leveling strategies in file storage applications?
As a standard commercial-grade NOR flash, the PC28F640J3D75A typically provides approximately 100,000 program/erase cycles per block, though exact figures depend on process node and usage patterns. Unlike modern NAND-based storage solutions optimized for high endurance, this device is better suited for code storage or infrequent data logging rather than frequent writes. In applications requiring longer lifetime, implementers should employ aggressive wear-leveling algorithms that distribute erase cycles evenly across all blocks and minimize over-provisioning. Given its parallel interface and fixed block sizes (commonly 64KB), the controller logic must carefully manage erase boundaries and avoid accidental overwriting of critical boot code regions.
How does the moisture sensitivity level (MSL) rating of 3 for the PC28F640J3D75A affect assembly processes, especially when using lead-free soldering profiles?
With an MSL rating of 3 and floor life of 168 hours at ≤30°C / ≤80% RH, the PC28F640J3D75A demands proper handling during reflow soldering to prevent popcorn cracking. Manufacturers must bake parts if stored beyond the shelf life or exposed to elevated humidity before assembly. Lead-free reflow profiles with peak temperatures exceeding 240°C for extended durations increase risk of moisture ingress damage unless controlled via nitrogen atmosphere or vacuum baking. Printed circuit board pad finishes should also be selected to ensure reliable wetting during high-temperature exposure, particularly important given the fine-pitch nature of the 64-EasyBGA package.
Is the PC28F640J3D75A compatible with byte-addressable operations, and what limitations arise from its NOR flash architecture in real-time systems?
The PC28F640J3D75A supports byte-level addressing within individual word lines, allowing selective updates without erasing entire sectors. However, true random byte programming incurs significant latency penalties because NOR flash requires full-chip or sector-wide erase before any modification. Real-time systems sensitive to worst-case execution times cannot rely solely on this device for dynamic data storage; instead, it remains optimal for static code or configuration data. Interrupt latency analysis must include erase/write cycle durations, which can span milliseconds depending on block size, making deterministic response challenging without external buffering or hybrid architectures combining volatile RAM with NOR flash.
What are the key differences between the PC28F640J3D75A and similar-density NOR flash parts regarding power consumption during active versus standby modes?
The PC28F640J3D75A consumes typical current in the tens of milliamps during active reads at 3V supply, reflecting conventional NOR flash behavior. Standby current is generally below 1 µA, comparable to other StrataFlash™ devices in the same voltage class. However, newer generations may offer deep-sleep states or partial array self-refresh features unavailable in older designs like this one. When comparing alternatives, designers should evaluate not just active power but also leakage paths during system idle periods, as cumulative energy loss over years can outweigh initial speed advantages. For low-power applications, pairing this component with efficient DC-DC regulators and smart wake-up logic becomes essential.
How does the parallel interface of the PC28F640J3D75A impact PCB routing complexity compared to serial NOR options like SPI-based memories?
The 64-pin EasyBGA package exposes a wide parallel bus (typically 8 or 16 data lines plus control signals), necessitating careful signal integrity planning including matched trace lengths, impedance control, and crosstalk mitigation. Routing density constraints in high-layer-count boards may force interleaving of power planes or ground stitching, increasing EMI susceptibility. In contrast, serial interfaces reduce pin count and simplify layout but limit bandwidth—critical trade-off when selecting between PC28F640J3D75A and SPI alternatives. For systems already utilizing parallel flash for firmware storage, maintaining compatibility with legacy code while migrating to serial peripherals requires bridge logic or dual-bank switching strategies.
What role does the base product number PC28F640 play in identifying derivative variants, and how might future revisions affect software portability?
The PC28F640 base indicates a shared die architecture across multiple packaging and speed grades (e.g., J3D75A vs. K3E600). Derivatives may differ in access time, voltage tolerance, or temperature range, potentially altering initialization sequences in bootloaders or RTOS drivers. Software designed for one variant must validate timing assumptions against actual part characteristics—especially when substituting faster or slower siblings. Maintaining abstraction layers that isolate hardware dependencies improves portability, though absolute worst-case timing margins should always accommodate the slowest expected part in production lots.
Are there any known errata or silicon anomalies associated with the PC28F640J3D75A that could affect reliability in mission-critical applications?
While specific errata are not publicly disclosed here, historical issues with early StrataFlash generations included rare cases of bitline coupling noise causing read errors under certain address patterns. Modern production units benefit from improved manufacturing controls, but designers should incorporate ECC or checksum verification for critical data paths. Additionally, single-event upsets (SEUs) remain a concern in radiation-prone environments, though the 75 ns access time and standard CMOS process do not inherently mitigate such effects. Implementing periodic background scrubbing routines or using hardened libraries reduces risk without sacrificing real-time performance.
How does the 64-EasyBGA (10x13) package influence thermal performance and soldering yield during mass production?
The compact 64-ball grid array minimizes footprint but concentrates heat dissipation into a small area, potentially raising junction temperatures under sustained read/write loads. Thermal vias beneath the package improve heat transfer to internal layers, yet airflow management remains important in dense assemblies. From a manufacturing standpoint, the fine pitch (~0.8 mm ball diameter) demands precise stencil printing and alignment tolerances to avoid bridging or insufficient solder joints. Automated optical inspection (AOI) and X-ray verification become critical for quality assurance, especially when integrating into automated pick-and-place workflows targeting high-volume production volumes.
What considerations apply when integrating the PC28F640J3D75A with microcontrollers lacking dedicated NOR flash controllers?
Many MCUs support generic parallel memory interfaces, but require manual management of chip selects, read strobes, and wait states. The 75 ns access time implies tight timing constraints: address valid before RE#, data stable after OE# assertion, with sufficient hold times relative to clock edges. Firmware must poll status registers during erase/program cycles, introducing non-determinism unless interrupted appropriately. Alternatively, using FPGA-based glue logic to abstract timing details can ease development burden but adds cost and power overhead compared to integrated solutions.

Parts with Similar Specifications

The three parts on the right have similar specifications to Micron Technology Inc. PC28F640J3D75A

Product Attribute PC28F640J3D75E PC28F640J3D75B TR PC28F640J3F75A PC28F640J3F75A
Part Number PC28F640J3D75E PC28F640J3D75B TR PC28F640J3F75A PC28F640J3F75A
Manufacturer Micron Technology Inc. Micron Technology Inc. Alliance Memory, Inc. Micron Technology Inc.
Memory Format - - - -
Memory Size - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Memory Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Technology - - - -
Memory Interface - - - -
Write Cycle Time - Word, Page - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Organization - - - -
Access Time - - - -
Voltage - Supply - - - -
Series - - - -

PC28F640J3D75A Datasheet PDF

Download PC28F640J3D75A pdf datasheets and Micron Technology Inc. documentation for PC28F640J3D75A - Micron Technology Inc..

Datasheets
J3vD Embedded Flash Memory.pdf
PCN Assembly/Origin
Tray Pkg Label Chgs 8/Oct/2020.pdf
PCN Packaging
Standard Pkg Label Chg 20/Feb/2019.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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PC28F640J3D75A Image

PC28F640J3D75A

Micron Technology Inc.
32D-PC28F640J3D75A

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