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HomeProductsIntegrated Circuits (ICs)MemoryPC28F640J3D75E
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PC28F640J3D75E - Micron Technology Inc.

Manufacturer Part Number
PC28F640J3D75E
Manufacturer
Micron Technology
Allelco Part Number
98D-PC28F640J3D75E
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,089 pcs available, New & Original
Parts Description
IC FLASH 64MBIT PAR 64EASYBGA
Package
64-EasyBGA (10x13)
Data sheet
PC28F640J3D75E.pdf
RoHs Status
ROHS3 Compliant
Compare
Our certification
In stock: 8089
  • Unit Price: $8.485
  • Subtotal: $0.00

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Add to Cart and Submit RFQ now, we'll contact you immediately.

Quantity Unit Price Ext. Price
1+ $8.485 $8.49
200+ $3.387 $677.40
500+ $3.273 $1,636.50
864+ $3.217 $2,779.49
The above prices does not include taxes and freight rates, which will be calculated on the order pages.

Specifications

PC28F640J3D75E Tech Specifications
Micron Technology Inc. - PC28F640J3D75E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. - PC28F640J3D75E

Product Attribute Attribute Value
Manufacturer Micron Technology
Write Cycle Time - Word, Page 75ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (10x13)
Series StrataFlash™
Package / Case 64-TBGA
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 64Mbit
Memory Organization 8M x 8, 4M x 16
Memory Interface Parallel
Memory Format FLASH
Base Product Number PC28F640
Access Time 75 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the PC28F640J3D75E NOR Flash memory device that influence its suitability for embedded system applications?
The PC28F640J3D75E operates within a supply voltage range of 2.7V to 3.6V, enabling compatibility with low-power embedded systems while maintaining robust performance. Its access time of 75 ns ensures deterministic read operations suitable for real-time control applications. With a write cycle time of 75 ns per word or page, this device supports efficient code execution and data storage without requiring extensive wait states. These parameters collectively allow reliable operation in industrial environments where timing predictability and power efficiency are critical design constraints.
How does the memory organization of the PC28F640J3D75E affect system-level memory mapping in microcontroller-based designs?
The PC28F640J3D75E offers two memory organization options—8M x 8 and 4M x 16—providing flexibility in addressing schemes based on processor bus width requirements. For an 8-bit microcontroller, the 8M x 8 configuration allows direct byte-wise access to the entire 64 Mbit address space. Alternatively, the 4M x 16 mode enables interfacing with 16-bit processors without additional logic, effectively halving the number of address lines needed. This dual organization supports diverse SoC architectures while preserving full utilization of the StrataFlash™ density.
In what scenarios would the PC28F640J3D75E be preferred over alternative NOR Flash solutions with similar capacity?
The PC28F640J3D75E is particularly advantageous when balancing code execution speed and storage density in cost-sensitive industrial automation or consumer electronics. Compared to larger-capacity NOR devices, it avoids unnecessary pin count and package complexity while still supporting x16 parallel interfaces. Its 75 ns access time outperforms many older generation NOR chips, making it preferable for applications requiring fast boot sequences without relying on external caching mechanisms. Additionally, its RoHS3 compliance and standard 64-EasyBGA packaging simplify compliance and assembly in high-volume production.
What thermal and environmental considerations should engineers evaluate when deploying the PC28F640J3D75E in outdoor or automotive systems?
Although the PC28F640J3D75E is rated for -40°C to 85°C (TA), engineers must consider junction temperature rise due to self-heating during erase/write cycles. While the component itself does not require heatsinking, prolonged high-write activity near the upper temperature limit may accelerate wear-out mechanisms. In harsh environments, proper PCB layout with adequate copper pour and thermal vias beneath the 64-EasyBGA package helps dissipate heat. Furthermore, moisture sensitivity level (MSL) 3 compliance necessitates dry-packaging prior to reflow soldering to prevent popcorning during assembly.
Can the PC28F640J3D75E support in-system programming (ISP) without removing it from the board?
Yes, as a standard NOR Flash device, the PC28F640J3D75E supports in-system programming via its parallel interface, allowing firmware updates without physical removal. However, successful ISP depends on implementing correct voltage sequencing during erase/write cycles and ensuring stable VCC within the 2.7–3.6V window. Engineers must also account for potential signal integrity issues over long traces when using high-speed programming clocks. The device’s StrataFlash™ architecture includes built-in block protection features that require careful handling to avoid accidental lockout during field updates.
How does the power consumption profile of the PC28F640J3D75E compare to modern serial Flash alternatives for battery-powered edge devices?
While the PC28F640J3D75E consumes more active current than serial Flash parts like SPI NOR memories due to its parallel interface and higher standby leakage, it offers significantly faster random access times. In low-power edge applications where wake-up latency is critical, the reduced wait states offset incremental current draw. Nevertheless, for ultra-low-power systems running continuously with minimal CPU intervention, serial interfaces generally yield better energy efficiency per bit accessed. The choice hinges on whether system performance or power budget dominates design priorities.
What impact does the 75 ns write cycle time have on firmware update reliability in mission-critical embedded systems using the PC28F640J3D75E?
A 75 ns write cycle time implies relatively slow programming speeds compared to NAND flash or modern serial memories, which can affect firmware update throughput. However, this parameter reflects word/page-level write latency rather than sustained bandwidth. In safety-critical systems, the slower but deterministic nature of NOR writes reduces risks associated with asynchronous corruption during power loss. Engineers often implement wear-leveling algorithms or reserve dedicated blocks for frequent updates to mitigate endurance concerns, leveraging the device’s byte-addressable architecture for fine-grained management.
Is the PC28F640J3D75E compatible with legacy x8 microcontrollers that lack native x16 support?
Yes, the PC28F640J3D75E can interface with 8-bit microcontrollers by utilizing only the lower byte of the x16 bus during reads and writes. The upper byte remains unconnected or tied to ground, effectively operating in split-bus mode. This approach sacrifices half the memory bandwidth but preserves full addressability of the 64 Mbit space. Careful attention must be paid to timing margins, as multiplexed addressing may require tighter setup/hold windows. Such configurations are common in retrofitted or legacy system upgrades where processor replacement isn’t feasible.

Parts with Similar Specifications

The three parts on the right have similar specifications to Micron Technology Inc. PC28F640J3D75E

Product Attribute PC28F640J3D75B TR PC28F640J3D75A PC28F640J3F75B PC28F640J3F75A
Part Number PC28F640J3D75B TR PC28F640J3D75A PC28F640J3F75B PC28F640J3F75A
Manufacturer Micron Technology Inc. Micron Technology Inc. Alliance Memory, Inc. Micron Technology Inc.
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Memory Size - - - -
Write Cycle Time - Word, Page - - - -
Technology - - - -
Memory Format - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Memory Interface - - - -
Memory Organization - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Access Time - - - -
Memory Type - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Series - - - -
Voltage - Supply - - - -

PC28F640J3D75E Datasheet PDF

Download PC28F640J3D75E pdf datasheets and Micron Technology Inc. documentation for PC28F640J3D75E - Micron Technology Inc..

Datasheets
J3vD Embedded Flash Memory.pdf
PCN Assembly/Origin
Tray Pkg Label Chgs 8/Oct/2020.pdf
PCN Packaging
Standard Pkg Label Chg 20/Feb/2019.pdf

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  • Retr***UWorks
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    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
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    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
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    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.
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Payment Support

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Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
PC28F640J3D75E Image

PC28F640J3D75E

Micron Technology Inc.
98D-PC28F640J3D75E

Want a better price? Add to Cart and Submit RFQ now, we'll contact you immediately.

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