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HomeProductsIntegrated Circuits (ICs)MemoryPC28F640J3F75B TR
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PC28F640J3F75B TR - Micron Technology Inc.

Manufacturer Part Number
PC28F640J3F75B TR
Manufacturer
Micron Technology
Allelco Part Number
98D-PC28F640J3F75B TR
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
10,076 pcs available, New & Original
Parts Description
IC FLASH 64MBIT PAR 64EASYBGA
Package
64-EasyBGA (10x13)
Data sheet
PC28F640J3F75B .pdf

PCN Obsolescence/ EOL

EOL 05/Dec/2016.pdf
RoHs Status
ROHS3 Compliant
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In stock: 10076

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Specifications

PC28F640J3F75B TR Tech Specifications
Micron Technology Inc. - PC28F640J3F75B TR technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. - PC28F640J3F75B TR

Product Attribute Attribute Value
Manufacturer Micron Technology
Write Cycle Time - Word, Page 75ns
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (10x13)
Series StrataFlash™
Package / Case 64-TBGA
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 64Mbit
Memory Organization 8M x 8, 4M x 16
Memory Interface Parallel
Memory Format FLASH
Base Product Number PC28F640
Access Time 75 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Frequently Asked Questions(FAQ)

How does the PC28F640J3F75B TR compare to modern SPI NOR flash alternatives in terms of interface complexity and system integration effort for embedded applications?
The PC28F640J3F75B TR uses a parallel interface, which typically requires more PCB traces and GPIO pins compared to SPI-based solutions like the MT28EW128 series. While parallel interfaces offer lower latency due to wider data buses (e.g., 8-bit or 16-bit organization), they increase board layout complexity and component count. For systems where pin count or footprint is constrained, an SPI alternative may reduce BOM cost and simplify routing, albeit at the expense of higher access latency. Designers must weigh these trade-offs based on application timing requirements and available microcontroller peripherals.
What are the implications of using the PC28F640J3F75B TR in a design targeting automotive-grade temperature ranges versus industrial use?
The PC28F640J3F75B TR supports an operating temperature range of -40°C to +85°C, which aligns with industrial standards but falls short of AEC-Q100 Grade 2 requirements that extend up to +105°C. While it can be used in non-automotive industrial environments, designers aiming for automotive certification should consider higher-temperature-rated alternatives such as Micron’s MT28EW series with extended thermal specs. Using this part outside its specified range risks data retention failure or functional disruption during thermal cycling, especially in harsh environments.
Can the PC28F640J3F75B TR reliably execute code directly from flash without additional hardware support?
Yes, the PC28F640J3F75B TR supports XIP (execute-in-place) operation, enabling direct code execution from the flash memory via its parallel interface. However, successful implementation depends on proper voltage regulation within the 2.7V–3.6V supply window and adherence to timing constraints such as 75 ns access time. Additionally, system firmware must handle initial boot sequences correctly, including sector unlocking and erase operations if code is being updated dynamically. Failure to manage these aspects may lead to runtime errors or corruption during execution.
How does the 64Mbit capacity of the PC28F640J3F75B TR impact firmware storage strategies compared to larger-density StrataFlash devices?
At 64 Mbits (8 MB), the PC28F640J3F75B TR provides sufficient space for moderately complex firmware stacks, including bootloaders, RTOS kernels, and application logic. However, compared to 128 Mbit or higher-density parts like the MT28EW128 series, it offers less headroom for future feature expansion or over-the-air updates. Designers may need to implement aggressive code compression or modular partitioning to avoid exceeding capacity limits. This constraint also affects wear leveling strategies in NAND-based systems, though NOR flash inherently supports byte-level writes without such considerations.
What role does the EasyBGA package play in high-volume manufacturing and reliability for the PC28F640J3F75B TR?
The 64-ball EasyBGA (10x13 mm) package reduces overall device height and improves thermal dissipation compared to traditional TSOPs, making it suitable for compact, stacked-component designs. Its fine-pitch solder balls enhance mechanical stability under vibration—critical in mobile or industrial deployments—while simplifying automated assembly in pick-and-place workflows. However, rework is challenging due to ball grid geometry, so yield management during production must account for precise reflow profiles to prevent bridging or void formation.
In what scenarios would the PC28F640J3F75B TR outperform newer serial flash technologies despite having a parallel interface?
The PC28F640J3F75B TR may be preferred in legacy-compatible systems where existing MCUs lack dedicated QSPI or OctalSPI interfaces, or when interfacing with older FPGA-based platforms requiring wide bus widths. Its parallel architecture allows burst transfers at 75 ns cycle times, potentially delivering higher sustained throughput than serialized protocols running at equivalent clock speeds. This makes it advantageous in real-time control loops or graphics framebuffer applications where deterministic access latency outweighs pin efficiency concerns.
What precautions should be taken when integrating the PC28F640J3F75B TR into a mixed-signal PCB design?
Due to its parallel interface drawing multiple simultaneous signals, careful attention must be paid to signal integrity, particularly trace length matching and impedance control. Cross-talk between adjacent address and data lines can corrupt accesses if spacing or termination is inadequate. Power delivery networks must remain stable under transient loads, as voltage droop below 2.7V could cause write failures or data loss. Decoupling capacitors near VCC pins are essential, and ground plane segmentation should avoid introducing return path discontinuities.
Does the PC28F640J3F75B TR support partial page programming, and how does this affect system-level write cycles?
Yes, the PC28F640J3F75B TR allows byte-level programming within pages, offering flexibility beyond fixed-block erasure. This enables targeted updates without full-page rewrites, reducing wear in frequently modified regions. However, each program operation consumes limited endurance cycles (typically >100k), so frequent small writes must be buffered or coalesced to preserve longevity. Unlike NAND flash, NOR does not require bad block management, but firmware must still enforce alignment boundaries to maintain performance and reliability.

Parts with Similar Specifications

The three parts on the right have similar specifications to Micron Technology Inc. PC28F640J3F75B TR

Product Attribute PC28F640J3D75B TR PC28F640J3F75B PC28F640P30B85D TR PC28F640J3F75A
Part Number PC28F640J3D75B TR PC28F640J3F75B PC28F640P30B85D TR PC28F640J3F75A
Manufacturer Micron Technology Inc. Alliance Memory, Inc. Micron Technology Inc. Micron Technology Inc.
Voltage - Supply - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Memory Organization - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Type - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Access Time - - - -
Series - - - -
Memory Format - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Write Cycle Time - Word, Page - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Memory Size - - - -
Memory Interface - - - -
Technology - - - -

PC28F640J3F75B TR Datasheet PDF

Download PC28F640J3F75B TR pdf datasheets and Micron Technology Inc. documentation for PC28F640J3F75B TR - Micron Technology Inc..

Datasheets
Embedded Flash Memory.pdf
PCN Packaging
Label 12/Sep/2016.pdf Standard Pkg Label Chg 20/Feb/2019.pdf
PCN Obsolescence/ EOL
EOL 05/Dec/2016.pdf

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Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Note:
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PC28F640J3F75B TR Image

PC28F640J3F75B TR

Micron Technology Inc.
98D-PC28F640J3F75B TR

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