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HomeProductsIntegrated Circuits (ICs)MemoryPC48F4400P0VB0EA
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PC48F4400P0VB0EA - Micron Technology Inc.

Manufacturer Part Number
PC48F4400P0VB0EA
Manufacturer
Micron Technology
Allelco Part Number
32D-PC48F4400P0VB0EA
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
16,140 pcs available, New & Original
Parts Description
IC FLASH 512MBIT PAR 64EASYBGA
Package
64-EasyBGA (10x13)
Data sheet
PC48F4400P0VB0E.pdf
RoHs Status
ROHS3 Compliant
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Specifications

PC48F4400P0VB0EA Tech Specifications
Micron Technology Inc. - PC48F4400P0VB0EA technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. - PC48F4400P0VB0EA

Product Attribute Attribute Value
Manufacturer Micron Technology
Write Cycle Time - Word, Page 100ns
Voltage - Supply 1.7V ~ 2V
Technology FLASH - NOR
Supplier Device Package 64-EasyBGA (10x13)
Series Axcell™
Package / Case 64-LBGA
Package Tray
Operating Temperature -40°C ~ 85°C (TC)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 512Mbit
Memory Organization 32M x 16
Memory Interface Parallel
Memory Format FLASH
Clock Frequency 52 MHz
Base Product Number PC48F4400
Access Time 100 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B1A
HTSUS 8542.32.0071

Parts Introduction

PC48F4400P0VB0EA Image
PC48F4400P0VB0EA (1)

Manufacturer Part Number

PC48F4400P0VB0EA

Manufacturer

Micron Technology

Introduction

Flash memory product from Micron's Axcell™ series aimed at providing reliable, high-density non-volatile memory solutions.

Product Features and Performance

Non-Volatile FLASH memory

512Mbit memory size

32M x 16 memory organization

Parallel memory interface

Clock frequency of 52 MHz

100ns write cycle time for word or page programming

100ns access time

7V to 2V supply voltage range

Operating temperature from -40°C to 85°C

Surface mount 64-LBGA package

Product Advantages

High-density storage solution

Robust performance in extreme temperature conditions

Quality non-volatile storage ensuring data retention without power

Fast access and write times for efficient data handling

Key Technical Parameters

Memory Type: FLASH - NOR

Technology: FLASH - NOR

Memory Size: 512Mbit

Memory Organization: 32M x 16

Memory Interface: Parallel

Clock Frequency: 52 MHz

Write Cycle Time - Word, Page: 100ns

Access Time: 100 ns

Voltage - Supply: 1.7V ~ 2V

Operating Temperature: -40°C ~ 85°C (TC)

Quality and Safety Features

Designed for high-reliability systems

Extensively tested for performance across temperature ranges

Compatibility

Supports devices requiring parallel-interface FLASH memory

Application Areas

Embedded systems

Communications equipment

Industrial automation

Automotive electronics

Product Lifecycle

Obsolete status indicates production cessation

Alternative solutions or upgrades may be available

Key Reasons to Choose This Product

Micron Technology's reputation for quality and durable flash memory products

High-density flash storage capability in a compact form factor

Adaptable to harsh working environments with industrial-grade temperature specifications

Parallel interface for integration with a wide range of systems and applications

Ensures data preservation without continuous power supply due to non-volatile nature

Frequently Asked Questions(FAQ)

How does the PC48F4400P0VB0EA compare to other Axcell™ series flash memory components in terms of power efficiency and access speed for embedded system designs?
The PC48F4400P0VB0EA operates within a supply voltage range of 1.7V to 2V, which is lower than many traditional NOR flash devices that require 3.3V or higher, contributing to improved power efficiency in battery-powered applications. Its maximum clock frequency of 52 MHz and access time of 100 ns enable relatively fast read operations compared to older generations of parallel NOR flash. While some newer Axcell™ variants may support higher clock speeds or lower voltages, this model strikes a balance suitable for cost-sensitive designs where moderate performance and low voltage operation are prioritized over peak bandwidth.
What are the implications of the PC48F4400P0VB0EA’s 64-EasyBGA package on thermal management and PCB layout complexity in high-reliability systems?
The 64-ball EasyBGA (10x13 mm) package offers a compact footprint ideal for space-constrained applications but presents challenges in thermal dissipation due to its small size and limited exposed surface area. The lack of a traditional thermal pad requires careful attention to copper pour design and via stitching to ensure adequate heat transfer from the device to the ground plane. Additionally, the fine-pitch ball grid array demands precise PCB fabrication tolerances and accurate solder joint inspection during assembly to avoid reliability issues such as opens or microvoids, especially under thermal cycling conditions common in industrial environments.
Can the PC48F4400P0VB0EA be used reliably in automotive-grade temperature ranges, and what design precautions should be taken given its specified operating temperature?
Although the PC48F4400P0VB0EA is rated for -40°C to +85°C, which covers standard industrial temperatures, it is not qualified for full automotive AEC-Q100 compliance unless explicitly certified by Micron. Therefore, while acceptable for non-automotive control units or infotainment subsystems with reduced environmental stress, its use in primary safety-critical functions may require additional derating, extended testing, or qualification beyond datasheet parameters. Designers should verify application-specific reliability requirements and consider alternative parts with formal automotive grading if operating near junction temperature limits.
How does the memory organization of 32M x 16 bits affect programmability and erase granularity when integrating the PC48F4400P0VB0EA into a bootloader or firmware storage architecture?
With a 32M x 16-bit organization, the PC48F4400P0VB0EA provides 512 Mbit total capacity organized as sixteen 32-megabit blocks. This structure supports byte-level write access but typically allows only full-page or sector-based erasure, limiting flexibility in updating specific code sections without affecting adjacent data. For bootloader implementations requiring frequent small updates, this can lead to increased wear on certain regions of the memory. Designers must align programming boundaries with supported page sizes and implement wear-leveling logic if long-term endurance is critical, potentially reducing effective usable capacity.
In comparison to serial flash alternatives like SPI NAND, how does the parallel interface of the PC48F4400P0VB0EA influence system throughput and pin count trade-offs?
The parallel interface of the PC48F4400P0VB0EA enables burst read speeds up to 52 MHz with 16-bit data width, resulting in theoretical peak bandwidth exceeding 100 MB/s—significantly higher than typical SPI flash devices limited to tens of megabits per second. However, this advantage comes at the cost of increased pin count and board routing complexity. For applications demanding high-speed code execution directly from flash or large initial image loads, the parallel interface justifies the extra pins; however, for simpler MCUs or constrained I/O architectures, serial alternatives offer a more compact solution despite lower absolute performance.
What role does the Moisture Sensitivity Level (MSL) rating of 3 play in handling and storage of the PC48F4400P0VB0EA prior to reflow soldering?
The MSL 3 classification indicates that the PC48F4400P0VB0EA must be stored under dry conditions and consumed within 168 hours after humidification if exposed to ambient moisture above 60% RH. Failure to follow JEDEC J-STD-020 guidelines could result in popcorning during reflow, leading to catastrophic delamination or electrical failure. Therefore, proper bake-out procedures, humidity-controlled storage, and adherence to recommended floor life are essential to preserve package integrity, particularly in mass production environments where inventory turnover exceeds safe exposure windows.
Given its RoHS3 compliance and REACH unaffected status, what environmental regulations does the PC48F4400P0VB0EA satisfy, and are there any restrictions on export or end-of-life disposal?
The PC48F4400P0VB0EA meets RoHS3 Directive (EU) 2015/869, restricting hazardous substances including lead, mercury, cadmium, and four phthalates. It is also classified as REACH unaffected, meaning it contains no SVHCs (Substances of Very High Concern) above 0.1% weight threshold. These statuses facilitate global market entry, particularly in Europe and North America, and simplify compliance documentation for OEMs. No special handling is required for disposal under WEEE directives, though local regulations may impose additional requirements based on regional waste management frameworks.
How should the write cycle time of 100 ns impact system timing constraints when executing code directly from flash memory using the PC48F4400P0VB0EA?
The 100 ns write cycle time refers to the duration required for programming individual words or pages, but during normal read operations, access time remains 100 ns, allowing predictable instruction fetches. However, when writing data—such as during firmware updates—the host controller must account for latency before subsequent reads can occur. In real-time systems executing code post-write, this necessitates careful scheduling to avoid race conditions or timeout errors, especially if the CPU attempts immediate verification of newly written instructions without waiting for completion.
What considerations apply when selecting decoupling capacitors for the PC48F4400P0VB0EA to ensure stable operation across its 1.7V–2V supply range?
Due to the low supply voltage, noise margins are tighter, making robust decoupling critical. A minimum of one 0.1 µF ceramic capacitor placed as close as possible to each VCC pin is recommended, supplemented by bulk capacitance (e.g., 1–10 µF tantalum or MLCC) on the main power rail. Capacitors must have low ESL and ESR to effectively suppress high-frequency transients generated during flash erase/write cycles. Improper decoupling can cause voltage droop that leads to data corruption or reset events, particularly during block erase operations that draw higher instantaneous current.
Does the PC48F4400P0VB0EA support XIP (execute-in-place), and what are the performance implications versus loading code into RAM?
Yes, the PC48F4400P0VB0EA supports XIP operation, allowing the processor to execute instructions directly from flash without copying them to RAM. At 52 MHz clock and 100 ns access time, sustained read bandwidth approximates 52 Mbytes/sec in burst mode, sufficient for most embedded processors with moderate fetch rates. However, XIP performance may degrade slightly compared to RAM due to flash latency and potential wait states; designers should validate timing closure and consider caching strategies or prefetch buffers to maintain real-time deadlines in latency-sensitive applications.
How does the ECCN classification of 3A991B1A influence international trade and sourcing logistics for the PC48F4400P0VB0EA?
ECCN 3A991B1A classifies the PC48F4400P0VB0EA as a commercial item with moderate encryption concerns, primarily related to high-performance memory devices. This designation generally permits unrestricted export to most countries but may trigger additional screening or license requirements when shipped to embargoed destinations or end-users involved in military or surveillance activities. Sourcing teams should coordinate with legal and compliance departments to ensure proper classification and documentation, avoiding delays or penalties associated with misdeclared shipments.
What factors determine whether the PC48F4400P0VB0EA is suitable for replacing legacy NOR flash in a legacy system migration project?
Compatibility depends on multiple dimensions: voltage tolerance (must match system rails), package footprint (including ball pitch and height), signal timing (address/data strobe alignment), and command protocol (read/write/erase sequences). Even if electrical specs align, differences in block erase size or lock mechanism behavior may require software modifications. Designers should perform side-by-side prototyping with the existing and candidate parts, measuring actual access latencies, verifying boot code execution paths, and validating worst-case timing under process-voltage-temperature (PVT) corners to ensure seamless integration without functional regression.
How does the absence of ECC support in the PC48F4400P0VB0EA affect data integrity in mission-critical storage applications?
Unlike NAND flash often paired with error-correcting codes, the PC48F4400P0VB0EA does not incorporate built-in ECC, leaving raw bit error rate (RBER) management to system-level safeguards. While NOR flash generally exhibits lower RBER than NAND, cosmic rays or oxide degradation over time can still induce single-bit flips. In safety-certified systems (e.g., medical or aerospace), this necessitates external parity checks, scrubbing routines, or redundant storage schemes to meet SIL or DO-254 standards, increasing firmware complexity and memory overhead.
What is the expected endurance profile for the PC48F4400P0VB0EA, and how should it inform wear-leveling strategies in data logging applications?
While the datasheet specifies typical block erase/write cycles of 10,000 to 100,000 cycles depending on block type, actual endurance varies with oxide thickness, programming voltage, and environmental stress. For continuous data logging where small writes occur frequently across limited address space, naive write patterns can exhaust specific sectors prematurely. Implementing dynamic wear-leveling algorithms that distribute writes evenly across available blocks extends overall lifespan, albeit at the cost of added firmware complexity and minor RAM usage for mapping metadata.
How do the HTSUS code 8542.32.0071 and ECCN 3A991B1A collectively inform customs valuation and duty calculations when importing the PC48F4400P0VB0EA into the United States?
HTSUS 8542.32.0071 categorizes the part as a solid-state non-volatile memory device, typically subject to general U.S. duty rates (often duty-free under USMCA or GSP programs for eligible origins). Combined with ECCN 3A991B1A, this confirms its commercial status without dual-use restrictions, simplifying import compliance. Exporters and importers should retain manufacturer certifications and packing lists showing correct HTS classification to avoid audits or liquidated damages during customs clearance, especially if claiming preferential tariff treatment.
When interfacing the PC48F4400P0VB0EA with a microcontroller lacking native parallel flash support, what hardware and software adaptations are necessary?
The microcontroller must provide address latching via ALE or equivalent strobe, data bus multiplexing if using fewer GPIOs, and chip select signals for bank selection. Firmware requires precise timing control to meet setup/hold requirements during read/write cycles, often implemented via bit-banging or DMA-assisted transfers. Alternatively, FPGA-based glue logic can emulate the parallel interface, trading software overhead for hardware determinism. Careful characterization of propagation delays and signal integrity is essential to prevent metastability or data corruption at boundary crossings.
How does the base product number PC48F4400 relate to other variants like PC48F4400P0VB0EA, and what distinguishes this specific part in terms of configuration options?
The base product number PC48F4400 identifies a family of 512Mbit parallel NOR flashes differing primarily in packaging, speed grade, voltage option, and possibly density variants. The suffix P0VB0EA denotes specific characteristics: P0 indicates a standard performance grade (52 MHz), V corresponds to a 1.7V–2V supply range, B0 likely signifies a revision level, and EA denotes the 64-EasyBGA package with 10x13 mm body. Other suffixes may exist for automotive grades, wider temperature ranges, or different speed bins, so designers must consult full ordering codes rather than assuming interchangeability without cross-referencing Micron’s product brief.
What steps should be taken to validate signal integrity when routing the PC48F4400P0VB0EA in a multi-layer PCB with mixed-signal content?
High-speed parallel interfaces demand controlled impedance traces (typically 50 Ω single-ended or 100 Ω differential pairs for clock lines), matched lengths to minimize skew (<50 ps between address/data lines), and careful separation from noisy aggressors like switching regulators or digital clocks. Termination may be unnecessary for short runs but should be evaluated using IBIS models under worst-case PVT conditions. Pre-layout simulation with S-parameter extraction followed by post-manufacturing TDR analysis ensures compliance with timing budgets, reducing risk of intermittent failures due to reflections or crosstalk-induced glitches.

Parts with Similar Specifications

The three parts on the right have similar specifications to Micron Technology Inc. PC48F4400P0VB0EA

Product Attribute PC48F4400P0VB0EH PC48F4400P0VB0EF PC48F4400P0VB0E4 PC48F4400P0VB02E
Part Number PC48F4400P0VB0EH PC48F4400P0VB0EF PC48F4400P0VB0E4 PC48F4400P0VB02E
Manufacturer Micron Technology Inc. Alliance Memory, Inc. Micron Technology Inc. Micron Technology Inc.
Base Product Number - DAC34H84 MAX500 ADS62P42
Mounting Type - Surface Mount Through Hole Surface Mount
Memory Interface - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Technology - - - -
Memory Organization - - - -
Access Time - - - -
Voltage - Supply - - - -
Write Cycle Time - Word, Page - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Memory Type - - - -
Memory Size - - - -
Clock Frequency - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Series - - - -
Memory Format - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)

PC48F4400P0VB0EA Datasheet PDF

Download PC48F4400P0VB0EA pdf datasheets and Micron Technology Inc. documentation for PC48F4400P0VB0EA - Micron Technology Inc..

Datasheets
P30-65nm Parallel.pdf
PCN Assembly/Origin
Tray Pkg Label Chgs 8/Oct/2020.pdf
PCN Packaging
Standard Pkg Label Chg 20/Feb/2019.pdf

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Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

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    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
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    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
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    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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2.00kg-3.00kg USD$50.00 - USD$100.00
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PC48F4400P0VB0EA Image

PC48F4400P0VB0EA

Micron Technology Inc.
32D-PC48F4400P0VB0EA

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