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HomeProductsIntegrated Circuits (ICs)Specialized ICsMTFC2GMTEA-0F
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MTFC2GMTEA-0F - Micron Technology

Manufacturer Part Number
MTFC2GMTEA-0F
Manufacturer
Micron Technology
Allelco Part Number
32D-MTFC2GMTEA-0F
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
8,270 pcs available, New & Original
Parts Description
DAC91001
Data sheet
-
Category
Integrated Circuits (ICs) > Specialized ICs
RoHs Status
Our certification
In stock: 8270

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Specifications

MTFC2GMTEA-0F Tech Specifications
Micron Technology - MTFC2GMTEA-0F technical specifications, attributes, parameters and parts with similar specifications to Micron Technology - MTFC2GMTEA-0F

Product Attribute Attribute Value
Part Number MTFC2GMTEA-0F
Package DAC91001
Description DAC91001
Stock Condition Get 8270 pcs available quantity at Allelco
Payment PayPal / TT / Credit Card / Western Union
Allelco Certifications ESD / ISO 9001 / ISO 13485 / ISO 28000
Product Attribute Attribute Value
Manufacturer Micron Technology
RoHs Status -
Warranty 100% Perfect Functions
Transport port Hong Kong
Shipping by DHL / FedEx / UPS / TNT / SF Express
RFQ Email info@allelco.com

Frequently Asked Questions(FAQ)

How does the operating temperature range of the MTFC2GMTEA-0F impact its reliability in industrial applications compared to consumer-grade storage solutions?
The MTFC2GMTEA-0F is specified for operation across a commercial temperature range, which aligns with standard industrial environments but may limit deployment in extreme conditions requiring extended temperature tolerance. Unlike automotive or military-grade NAND flash, this component does not guarantee functionality at full -40°C to +85°C boundaries under sustained write operations. For designs requiring long-term stability in high-heat or thermally fluctuating settings, additional thermal management or environmental derating may be necessary.
What are the implications of using the MTFC2GMTEA-0F in a system with frequent power cycling, and how does its endurance compare to SLC-based alternatives?
The MTFC2GMTEA-0F utilizes MLC (Multi-Level Cell) NAND architecture, which offers higher density but typically lower write/erase cycle endurance than Single-Level Cell (SLC) devices—often around 3,000 to 10,000 P/E cycles depending on controller implementation. In systems with frequent power interruptions or aggressive logging workloads, this could accelerate wear and reduce lifespan. SLC alternatives generally sustain over 100,000 P/E cycles, making them more suitable for write-intensive scenarios, though at the cost of capacity and unit economics.
Can the MTFC2GMTEA-0F be used as boot media in embedded Linux systems, and what interface considerations should be evaluated?
Yes, the MTFC2GMTEA-0F supports standard eMMC 5.1 protocols and can function as primary boot storage in embedded Linux platforms. However, successful integration depends on proper initialization sequence handling by the SoC and correct configuration of the HS400 Enhanced Strobe mode if supported. Timing constraints during initialization must be met, and signal integrity on the BGA-to-controller trace becomes critical due to high-speed data rates. Failure to meet these conditions may result in boot failures or degraded performance.
What is the typical read latency for random 4KB accesses using the MTFC2GMTEA-0F, and how does it affect real-time system responsiveness?
While exact random access times vary based on internal page size and controller efficiency, typical random reads for an MLC-based eMMC like the MTFC2GMTEA-0F range from 1.5 ms to 3 ms per 4KB block. This introduces noticeable delay in time-sensitive applications such as real-time control loops or audio buffering. Systems requiring sub-millisecond access should consider NOR flash or DRAM caching strategies instead of relying solely on this component’s native performance.
How does garbage collection overhead affect sustained write performance when using the MTFC2GMTEA-0F in a heavily fragmented file system?
Garbage collection becomes increasingly active as free blocks deplete, especially with small-block writes common in journaling filesystems. During background compaction, the MTFC2GMTEA-0F may exhibit bursty write speeds, dropping below 10 MB/s in worst-case scenarios. Without wear-leveling optimization or over-provisioning beyond the default 7–10%, sustained throughput can degrade significantly over time. Designers should anticipate performance dips during periods of high fragmentation and allocate sufficient spare area to mitigate this effect.
Is it safe to use the MTFC2GMTEA-0F without hardware-based bad block management, and what risks might arise?
No, the MTFC2GMTEA-0F relies on firmware-level bad block management through its integrated controller. Relying solely on software detection is insufficient because initial factory-marked and runtime-detected blocks require transparent remapping. Without proper support from the host driver or filesystem (e.g., UBI/UBIFS in Linux), data corruption or silent failures may occur. Always ensure the system stack includes robust error correction and dynamic remapping capabilities.
What level of ECC (error correction) does the MTFC2GMTEA-0F support, and how does it influence data integrity in noisy environments?
The MTFC2GMTEA-0F implements advanced LDPC (Low-Density Parity-Check) error correction capable of handling multiple bit errors per 1KB sector—typically correcting up to several hundred bits depending on wear level and retention state. This enhances reliability in electrically noisy environments or after prolonged data retention. However, uncorrectable errors still trigger retries or remap operations; excessive ECC failures indicate nearing end-of-life and necessitate replacement.
How should thermal design considerations influence PCB layout when mounting the MTFC2GMTEA-0F?
Although the MTFC2GMTEA-0F lacks an explicit junction temperature rating, its BGA package generates heat during sustained writes due to internal controller activity. To avoid localized hot spots and maintain consistent performance, provide adequate copper pours beneath the package, especially near ground planes, and ensure thermal vias connect to inner layer heatsinks. Avoid placing nearby components that absorb ambient heat, which could indirectly raise die temperature and increase latency.
Can the MTFC2GMTEA-0F interoperate with non-Micron controllers, and what compatibility factors must be verified?
Interoperability requires adherence to JEDEC eMMC 5.1 standards, but vendor-specific command sets and initialization sequences may differ. Micron often implements proprietary optimizations for wear leveling and garbage collection. When replacing with third-party controllers, verify support for HS400 signaling, reliable RPMB (Replay Protected Memory Block) access, and proper handling of secure erase commands. Misalignment here can lead to unstable operation or loss of security features.
What is the expected lifespan of the MTFC2GMTEA-0F under continuous write loads of 50 MB/s, and how does usage pattern affect longevity?
At 50 MB/s sustained writes, assuming a conservative 5,000 P/E cycles and 2GB/day total written data, the MTFC2GMTEA-0F would reach its endurance limit in approximately 1.5 years. However, real-world lifespan varies significantly with block size distribution: large sequential writes extend life far better than random small writes due to reduced erase overhead. Implementing wear-leveling-aware application design and enabling over-provisioning improves longevity beyond theoretical minimums.
How does the MTFC2GMTEA-0F compare to QLC-based eMMC alternatives in terms of power consumption during active writes?
Compared to QLC (Quad-Level Cell) eMMC devices, the MTFC2GMTEA-0F generally consumes less power during write operations because it uses fewer voltage levels per cell, reducing programming complexity and current draw. QLC requires more precise timing and higher voltages, increasing energy per write. Thus, in battery-powered or low-power embedded systems prioritizing endurance and efficiency, the MTFC2GMTEA-0F presents a favorable trade-off versus denser but less efficient QLC solutions.
Are there any known errata or silicon revisions associated with the MTFC2GMTEA-0F that could impact system stability?
While specific errata are not publicly detailed without part-specific documentation, Micron routinely releases revision notes addressing issues such as initialization failures at cold temperatures or incorrect response to certain diagnostic commands. Designers should consult the latest Errata Sheet accompanying the part and apply recommended workarounds—such as delaying first access after power-up or avoiding specific command sequences during boot—to ensure robust operation across all production units.

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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Region Country Logistic Time(Day)
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Brazil 7
Europe Germany 5
United Kingdom 4
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New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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Micron Technology

MTFC2GMTEA-0F

Micron Technology
32D-MTFC2GMTEA-0F

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