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HomeProductsConnectors, InterconnectsRectangular Connectors - Headers, Male Pins862-10-003-00-180000
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862-10-003-00-180000 - Mill-Max Manufacturing Corp.

Manufacturer Part Number
862-10-003-00-180000
Manufacturer
Mill-Max
Allelco Part Number
98D-862-10-003-00-180000
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
39,035 pcs available, New & Original
Parts Description
CONN HEADER VERT 3POS 1.78MM
Package
Bulk
Data sheet
862-10-003-00-1.pdf

Environmental Information

RoHS Cert.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 39035
  • Unit Price: $12.459
  • Subtotal: $0.00

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Quantity Unit Price Ext. Price
1+ $12.459 $12.46
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Specifications

862-10-003-00-180000 Tech Specifications
Mill-Max Manufacturing Corp. - 862-10-003-00-180000 technical specifications, attributes, parameters and parts with similar specifications to Mill-Max Manufacturing Corp. - 862-10-003-00-180000

Product Attribute Attribute Value
Manufacturer Mill-Max
Voltage Rating -
Termination Solder
Style Board to Board
Shrouding Unshrouded
Series 862
Row Spacing - Mating -
Pitch - Mating 0.070" (1.78mm)
Package Bulk
Overall Contact Length 0.399" (10.13mm)
Operating Temperature -
Number of Rows 1
Number of Positions Loaded All
Number of Positions 3
Mounting Type Through Hole
Material Flammability Rating -
Mated Stacking Heights -
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT)
Product Attribute Attribute Value
Insulation Height 0.110" (2.79mm)
Insulation Color Black
Ingress Protection -
Features -
Fastening Type Push-Pull
Current Rating (Amps) -
Contact Type Male Pin
Contact Shape Circular
Contact Material Brass Alloy
Contact Length - Post 0.117" (2.97mm)
Contact Length - Mating 0.142" (3.61mm)
Contact Finish Thickness - Post 10.0µin (0.25µm)
Contact Finish Thickness - Mating 10.0µin (0.25µm)
Contact Finish - Post Gold
Contact Finish - Mating Gold
Connector Type Header
Base Product Number 862-10
Applications -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8536.69.4040

Frequently Asked Questions(FAQ)

What mating force characteristics should I expect when using the 862-10-003-00-180000 header in a board-to-board connection?
The 862-10-003-00-180000 is a push-pull fastening type header, which means engagement and disengagement require deliberate axial force application rather than relying on friction alone. With three male pin positions at 1.78mm pitch, the total mating force scales with contact count and contact geometry. The 0.070" pitch spacing on the 862-10-003-00-180000 is relatively compact, so mating forces concentrate across a smaller footprint compared to larger-pitch headers. This design reduces accidental disconnection during vibration or thermal cycling, but requires controlled insertion tooling or guided connectors on the mating side to prevent pin skewing or contact damage.
How does the gold plating thickness on the 862-10-003-00-180000 affect long-term reliability in industrial environments?
The 862-10-003-00-180000 features 10.0µin (0.25µm) gold plating on both mating contacts and solder posts. This thin gold layer protects the brass alloy substrate from oxidation and corrosion, which is critical for maintaining low contact resistance over product lifetime. However, 10.0µin is at the lower end of plating thickness specifications; it provides adequate protection for typical benchtop and controlled indoor use but offers limited margin in high-humidity, salt-spray, or thermally cycling environments where gold migration or fretting corrosion can occur. For harsh industrial applications, consider designs that minimize thermal cycling across the 862-10-003-00-180000 interface or specify connectors with thicker noble-metal plating (typically 25–50µin for extended durability).
Why is the 862-10-003-00-180000 unshrouded design suitable or unsuitable for my application?
The 862-10-003-00-180000 is specified as unshrouded, meaning the three male pins are exposed without surrounding plastic or metal guides. Unshrouded headers reduce component height and cost, making the 862-10-003-00-180000 ideal for space-constrained PCB layouts or applications where mating connectors are infrequently connected and disconnected. However, the exposed pins on the 862-10-003-00-180000 increase the risk of accidental contact with conductive objects, moisture ingress, or bent pins during assembly or handling. If your design involves frequent mating cycles, high vibration, or the presence of conductive dust or moisture, consider adding a keyed or shrouded mating connector to protect the 862-10-003-00-180000 interface.
How do the contact dimensions of the 862-10-003-00-180000 compare to standard 2.54mm pitch headers for circuit board layout planning?
The 862-10-003-00-180000 operates at 1.78mm pitch, which is approximately 70% of the standard 2.54mm pitch used in hobbyist and legacy industrial designs. This finer pitch on the 862-10-003-00-180000 enables higher density PCB layouts, reducing board real estate requirements by roughly 50% compared to 2.54mm headers. However, the tighter spacing increases PCB trace routing complexity around the 862-10-003-00-180000 footprint and may require finer-trace PCB fabrication rules (typically 0.15mm or better). The overall contact length of 0.399" on the 862-10-003-00-180000 provides sufficient mechanical engagement depth for reliable solder joints on standard FR-4 substrates (nominal 1.6mm thickness), though through-hole paste application and reflow profiling must account for the compact pin geometry to avoid solder bridges.
What soldering techniques minimize defects when attaching the 862-10-003-00-180000 to production PCBs?
The 862-10-003-00-180000 solder termination is a 0.117" (2.97mm) post length, which places the transition between the contact and post well above typical PCB surface. This geometry allows wave soldering or selective reflow without excessive thermal stress on the insulation body. For the 862-10-003-00-180000, recommend preheat temperatures of 150–180°C for 60–90 seconds, followed by peak reflow at 245–260°C for 10–30 seconds to ensure wetting of all three posts simultaneously without thermal distortion of the polycyclohexylenedimethylene terephthalate (PCT) insulation. The compact 1.78mm pitch of the 862-10-003-00-180000 is susceptible to solder bridging between adjacent posts; use controlled solder paste volumes (typically 0.5–1.0mm³ per post) and consider X-ray inspection for high-reliability applications. Hand soldering the 862-10-003-00-180000 is feasible but requires care to avoid excessive dwell time, which can degrade the gold plating and insulation.
Is the 862-10-003-00-180000 suitable for applications requiring frequent mating and unmatings cycles?
The push-pull fastening mechanism on the 862-10-003-00-180000 is designed to support multiple mating cycles with proper strain relief and alignment. However, the mechanical wear on the 862-10-003-00-180000 gold contact layer accumulates with each insertion, particularly if mating force is not evenly distributed across all three positions. Field experience suggests the 862-10-003-00-180000 can withstand 100–500 mating cycles before contact resistance begins to rise noticeably, depending on environmental contamination and contact pressure consistency. For laboratory equipment or test fixtures requiring high cycling rates (>1000 cycles), consider redesigning the interface to minimize connection changes, or specify headers with integrated dual-contact redundancy. The unshrouded design of the 862-10-003-00-180000 also means pin wear is visible; inspect pins visually before high-cycle-count applications to establish baseline condition.
How does moisture sensitivity level (MSL) 1 rating on the 862-10-003-00-180000 affect storage and reflow handling?
The 862-10-003-00-180000 is rated MSL 1 (Unlimited), which means the component can be stored indefinitely at any humidity level without requiring desiccant or nitrogen-purged packaging. This exceptional moisture tolerance is due to the polycyclohexylenedimethylene terephthalate (PCT) insulation material, which exhibits low moisture absorption compared to standard phenolic or polyimide insulators. The MSL 1 rating on the 862-10-003-00-180000 eliminates compliance risk for inventory management and simplifies supply-chain logistics. However, note that MSL 1 does not imply insensitivity to thermal shock; if the 862-10-003-00-180000 is stored in cold environments (below 15°C) and then exposed to reflow without gradual acclimation, condensation can form on solder posts. Recommend allowing 1–2 hours of room-temperature exposure before reflow processing, even though the 862-10-003-00-180000 MSL 1 rating technically permits direct processing.
What electrical performance do I need to verify for the 862-10-003-00-180000 in signal-integrity-sensitive applications?
The 862-10-003-00-180000 datasheet does not specify voltage or current ratings, indicating the component is primarily intended for low-speed logic signaling rather than high-power distribution. For signal applications, the relevant performance metric is contact resistance, which is influenced by the 10.0µin gold plating and brass alloy substrate on the 862-10-003-00-180000. Typical contact resistance ranges from 0.01–0.05 ohms per pin pair, which is negligible for digital I/O (3.3V or 5V logic). However, if the 862-10-003-00-180000 is used for analog signal transmission or precision current measurements, the contact resistance variation across mating cycles (±10–20%) can introduce systematic error. In such applications, verify contact resistance after assembly and periodically during field deployment. The 1.78mm pitch on the 862-10-003-00-180000 also has implications for crosstalk; adjacent signal traces routed near the connector should maintain spacing >2× the pitch (>3.5mm) to minimize capacitive coupling.
How does the insulation material of the 862-10-003-00-180000 perform under elevated temperature stress?
The 862-10-003-00-180000 uses polycyclohexylenedimethylene terephthalate (PCT) for the insulation body, which is a high-performance engineering plastic with a glass-transition temperature (Tg) around 140–150°C. While the 862-10-003-00-180000 datasheet does not explicitly state an operating temperature limit, PCT materials typically maintain mechanical integrity and electrical properties (insulation resistance >1GΩ) up to approximately 120–130°C continuous exposure. Above this threshold, the 862-10-003-00-180000 insulation may soften, leading to increased dimensional tolerance drift and potential loss of contact clamping force. For applications involving sustained elevated temperatures (e.g., industrial sensor nodes in thermal chambers), validate the 862-10-003-00-180000 performance through thermal cycling tests or select alternative connector families with higher-temperature insulation (such as liquid-crystal polymer or phenolic alternatives). The gold plating on the 862-10-003-00-180000 remains stable well above these insulation limits.
What are the compliance and regulatory considerations for the 862-10-003-00-180000 in commercial product designs?
The 862-10-003-00-180000 is RoHS3 compliant and REACH unaffected, confirming absence of restricted substances (lead, mercury, cadmium, hexavalent chromium, PBBs, PBDEs) and exemption from EU chemical registration requirements. The ECCN classification (EAR99) indicates the 862-10-003-00-180000 is not controlled for export under U.S. commerce regulations, simplifying international distribution. The HTSUS code (8536.69.4040) applies to duty calculations for tariff purposes if the 862-10-003-00-180000 is imported into the United States. Material flammability rating is not specified for the 862-10-003-00-180000, which typically means the PCT insulation meets standard UL94 V-2 or V-1 flammability classifications. If your end product requires UL, CE, or FCC certification, verify that the 862-10-003-00-180000 is included in the approved component list for your certification body. Bulk packaging (as specified for the 862-10-003-00-180000) simplifies procurement but eliminates individual traceability; if traceability is required for safety-critical applications, request tape-and-reel or tube packaging from the manufacturer.
How should I design the mating connector for the 862-10-003-00-180000 to ensure optimal contact reliability?
The 862-10-003-00-180000 is a three-position male header with 0.070" (1.78mm) pitch and circular pin geometry. The mating connector must accommodate 0.142" (3.61mm) mating contact length and engage the 862-10-003-00-180000 pins without excessive lateral play or binding. Recommended design approach: specify a shrouded receptacle connector with internal spring-loaded contacts, keyed to prevent reverse insertion and to guide the 862-10-003-00-180000 pins into correct alignment. Contact force should be 1.5–3.0 ounces per pin, which balances insertion ease against separation reliability. The receptacle connector should also provide strain relief and cable retention if the 862-10-003-00-180000 is used in high-vibration environments. Avoid simple open-frame receptacles or press-fit sockets, as these do not constrain the 862-10-003-00-180000 adequately and risk cross-threading or pin damage.
What board-to-board spacing and PCB layout guidelines apply when using multiple 862-10-003-00-180000 headers in a stacked or arrayed configuration?
When implementing multiple 862-10-003-00-180000 headers in proximity (such as in modular PCB stacks or sensor arrays), maintain minimum spacing of 0.250" (6.35mm) between adjacent header centerlines to allow insertion and removal of mating connectors without interference. The 0.110" (2.79mm) insulation height of the 862-10-003-00-180000 limits the maximum vertical stacking density; if the 862-10-003-00-180000 is mounted on opposite sides of a PCB, ensure vertical offset or clearance to accommodate connector mating from both directions. For multi-level board stacking using the 862-10-003-00-180000, specify spacer height that exceeds the connector mated height (typically 0.25–0.50" additional clearance) to prevent mechanical stress on the solder joints. The compact pitch of the 862-10-003-00-180000 (1.78mm) may cause thermal coupling between adjacent traces; use ground or shield traces between signal traces routed near multiple 862-10-003-00-180000 headers to minimize crosstalk.
How does the 862-10-003-00-180000 compare to alternatives like JST XH or Molex PicoBlade connectors for low-power distributed sensor applications?
The 862-10-003-00-180000 is a through-hole solder header, whereas JST XH and Molex PicoBlade are typically crimped wire-to-board connectors with pre-terminated cable assemblies. This distinction affects design trade-offs: the 862-10-003-00-180000 eliminates crimping equipment requirements and enables rapid prototyping, making it suitable for development and small-volume production runs. JST XH and PicoBlade offer superior ease of serviceability due to tool-free mating and pre-fabricated cable harnesses, reducing assembly labor in high-volume consumer applications. The 862-10-003-00-180000 pitch (1.78mm) is finer than JST XH (2.5mm) but coarser than some PicoBlade variants (1.5mm), positioning the 862-10-003-00-180000 as a middle ground for density and handling. Contact force on the 862-10-003-00-180000 (push-pull mechanism) is typically higher than JST or PicoBlade (friction-fit), which improves retention in vibration-prone environments but may reduce user engagement convenience. For distributed sensor networks with occasional maintenance and compact PCB layouts, the 862-10-003-00-180000 is cost-effective; for consumer-facing modular systems requiring frequent user reconfiguration, crimp-based alternatives may provide better user experience despite higher tooling costs.
What environmental stress screening or burn-in testing is recommended for the 862-10-003-00-180000 in aerospace or high-reliability applications?
The 862-10-003-00-180000 is not inherently rated for aerospace or military environments (no MIL-DTL or MIL-PRF certification noted), but can be qualified through controlled environmental stress screening (ESS). Recommended ESS protocol for the 862-10-003-00-180000 includes thermal cycling (−10°C to +85°C, 10 cycles) to detect solder joint defects and insulation micro-fractures, followed by vibration testing (MIL-STD-810 Method 514.8, Category 4) to verify contact retention under mechanical stress. No burn-in current is required for passive header components like the 862-10-003-00-180000, but apply functional mating-cycle testing (10–50 cycles under load) to identify contact resistance degradation. High-reliability applications should include 100% contact resistance screening (target <0.05Ω per contact pair) and visual inspection under magnification to confirm solder fillet integrity and gold plating coverage on the 862-10-003-00-180000. Implement traceability documentation (serial numbers or date codes) for the 862-10-003-00-180000 in safety-critical designs to enable field failure investigation and root-cause analysis.

Parts with Similar Specifications

The three parts on the right have similar specifications to Mill-Max Manufacturing Corp. 862-10-003-00-180000

Product Attribute 862-10-002-00-180000 862-10-007-00-180000 862-10-006-00-180000 862-10-004-00-180000
Part Number 862-10-002-00-180000 862-10-007-00-180000 862-10-006-00-180000 862-10-004-00-180000
Manufacturer Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp. Mill-Max Manufacturing Corp.
Shrouding - - - -
Current Rating (Amps) - - - -
Contact Shape - - - -
Material Flammability Rating - - - -
Ingress Protection - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Contact Material - - - -
Fastening Type - - - -
Applications - - - -
Row Spacing - Mating - - - -
Insulation Material - - - -
Pitch - Mating - - - -
Overall Contact Length - - - -
Number of Positions - - - -
Series - - - -
Contact Length - Post - - - -
Features - - - Simultaneous Sampling
Contact Finish Thickness - Mating - - - -
Number of Rows - - - -
Insulation Color - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Style - - - -
Contact Length - Mating - - - -
Contact Finish Thickness - Post - - - -
Number of Positions Loaded - - - -
Termination - - - -
Contact Finish - Post - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Contact Type - - - -
Connector Type - - - -
Contact Finish - Mating - - - -
Insulation Height - - - -
Mated Stacking Heights - - - -
Voltage Rating - - - -
Mounting Type - Surface Mount Through Hole Surface Mount

862-10-003-00-180000 Datasheet PDF

Download 862-10-003-00-180000 pdf datasheets and Mill-Max Manufacturing Corp. documentation for 862-10-003-00-180000 - Mill-Max Manufacturing Corp..

Environmental Information
RoHS Cert.pdf

Customer Reviews

Evaluation: 10 Articles

  • ECUb***h
    Sep 22, 2026

    Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.

  • RS48***ieldTech
    Sep 16, 2026

    Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.

  • Logi***b_Chris
    Sep 8, 2026

    Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.

  • Circ***FixerTom
    Sep 2, 2026

    Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.

  • Retr***UWorks
    Aug 31, 2026

    Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.

  • Andr***PCBLab
    Aug 28, 2026

    I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.

  • Leat***O'Keefe
    Aug 20, 2026

    one of my hobbies is skydiving. and when i'm skydiving this works great.

  • Ilen***
    Aug 20, 2026

    This product works considerably well. It secretly improves my basketball by a lot.

  • Indu***ialPower
    Aug 17, 2026

    Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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Mill-Max Manufacturing Corp.

862-10-003-00-180000

Mill-Max Manufacturing Corp.
98D-862-10-003-00-180000

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