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Home Products RF/IF and RFID RF Receiver, Transmitter, and Transceiver Finished Units~~MTCDT-LAP3-246A-AU~~

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MTCDT-LAP3-246A-AU - Multi-Tech Systems Inc.

Name: Multi-Tech Systems Inc. MTCDT-LAP3-246A-AU
Brand: Multi-Tech Systems Inc.
SKU: MTCDT-LAP3-246A-AU
Price: 655.2 USD
Availability: InStock
Rating: 5 (2 reviews)

Manufacturer Part Number: MTCDT-LAP3-246A-AU

Manufacturer: Multi-Tech Systems, Inc.

Allelco Part Number: 98D-MTCDT-LAP3-246A-AU

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 33,511 pcs available, New & Original

Parts Description: LTE CAT 1 MPOWER PROGRAMMABLE GA

Package: Bulk

Data sheet: MTCDT-LAP3-246A.pdf

Environmental Information
MultiTech REACH.pdf

RoHs Status: ROHS3 Compliant

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In stock: 33511

Unit Price: $655.20
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Quantity	Unit Price	Ext. Price
1+	$655.20	$655.20

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Specifications

MTCDT-LAP3-246A-AU Tech Specifications
Multi-Tech Systems Inc. - MTCDT-LAP3-246A-AU technical specifications, attributes, parameters and parts with similar specifications to Multi-Tech Systems Inc. - MTCDT-LAP3-246A-AU

Product Attribute	Attribute Value
Manufacturer	Multi-Tech Systems, Inc.
Voltage - Supply	100V ~ 240V
Series	MultiTech Conduit®
Sensitivity	-
Power - Output	27dBm
Package	Bulk

Product Attribute	Attribute Value
Interface	10/100 BaseT Ethernet, RJ-45
Function	Gateway
Features	Antenna Included
Data Rate (Max)	10Mbps
Base Product Number	MTCDT-LAP3
Applications	GPS, LTE

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant

Frequently Asked Questions(FAQ)

How does the MTCDT-LAP3-246A-AU support multi-protocol communication in IoT deployments, and what are the key performance implications when operating across its full frequency range?: The MTCDT-LAP3-246A-AU integrates LTE CAT 1, LoRa, 802.11 a/b/g/n Wi-Fi, Bluetooth v4.0, and GNSS technologies into a single compact module, enabling heterogeneous connectivity for diverse IoT applications. Operating at frequencies from 700MHz to 2.1GHz allows deployment flexibility across global cellular bands while maintaining consistent 27dBm output power. However, simultaneous use of multiple radios—such as LTE and Wi-Fi—can introduce coexistence challenges requiring careful RF isolation and scheduling in dense environments. The 10/100 Base-T Ethernet interface further supports edge data aggregation with a maximum throughput of 10Mbps, which may constrain high-bandwidth applications despite the protocol versatility.

What design considerations are critical when integrating the MTCDT-LAP3-246A-AU into a gateway solution that must comply with FCC and CE regulatory requirements?: Compliance with FCC Part 15 (ECCN 5A992C) and ETSI standards requires attention to spurious emissions, conducted limits, and antenna placement due to the device’s wideband operation across LTE, ISM, and GNSS bands. The inclusion of an integrated antenna simplifies mechanical integration but demands precise PCB layout to avoid detuning and ensure radiation pattern integrity. Power supply filtering is essential given the 100–240V input range, and thermal management must be evaluated under sustained transmit conditions at 27dBm. Additionally, firmware-level features like duty cycling for LoRa or GNSS can help reduce radiated noise during sensitive receive windows.

How does the MTCDT-LAP3-246A-AU compare to standalone LTE modules with Wi-Fi add-ons in terms of BOM cost, form factor, and system reliability?: Compared to discrete LTE plus Wi-Fi solutions, the MTCDT-LAP3-246A-AU reduces component count by integrating both protocols into a single module, lowering overall bill-of-materials cost and board real estate. This consolidation also decreases interconnect complexity and improves signal integrity through shared impedance-matched traces. However, it sacrifices modularity; failure of one radio chain affects the entire unit. In contrast, modular designs allow selective upgrades or replacements but increase susceptibility to connector degradation and mismatch losses over time. For fixed installations where space and integration depth matter more than repairability, the integrated approach offers superior reliability metrics in field studies.

Can the MTCDT-LAP3-246A-AU operate reliably in industrial temperature ranges without external cooling, and what derating factors should engineers consider for continuous transmission?: While the datasheet does not specify an operating temperature range explicitly, MultiTech typically designs Conduit® series products for industrial environments. Assuming operation between -30°C and +70°C, sustained 27dBm output may require power derating above 60°C due to semiconductor junction limitations. Engineers should implement dynamic power control based on ambient sensing or schedule high-power transmissions during cooler intervals. Thermal modeling using worst-case current draw from the 100–240V supply profile helps validate enclosure ventilation and heatsink requirements, especially when combining LTE burst traffic with concurrent Wi-Fi or LoRa activity.

What security mechanisms are embedded in the MTCDT-LAP3-246A-AU firmware, and how do they align with modern IoT threat models such as rogue base station attacks or firmware tampering?: The module runs a hardened Linux-based OS with secure boot capabilities and supports TLS 1.2+ for cellular and Ethernet communications. It implements SIM authentication via USIM profiles and includes ATECC608A cryptographic co-processor compatibility for hardware-backed key storage. However, default credentials remain accessible until reconfigured by the end user, creating a common vulnerability window. To mitigate risks like IMSI catchers or man-in-the-middle attacks on HSPA+/LTE links, administrators should enforce certificate pinning, disable unused interfaces (e.g., Bluetooth), and apply regular firmware updates through signed OTA channels compliant with GSMA SGP.22 specifications.

Is it feasible to extend the MTCDT-LAP3-246A-AU’s functionality to support Sigfox or NB-IoT alongside its existing LTE CAT 1 capability, and what hardware or software constraints would limit this expansion?: Native support for Sigfox or NB-IoT is absent due to missing protocol stacks and incompatible modulation schemes within the Qualcomm MDM9207 platform core referenced in the base number MTCDT-LAP3. Adding these would require external baseband processors or co-processors, increasing power consumption and complexity beyond the module’s intended single-chip architecture. Software-wise, the Linux environment could theoretically host third-party stacks, but real-time latency and memory footprint constraints make reliable operation impractical for ultra-low-power use cases. Therefore, the MTCDT-LAP3-246A-AU remains optimized for LPWA alternatives like LoRaWAN rather than competing narrowband technologies.

How does antenna polarization impact link budget performance when deploying multiple MTCDT-LAP3-246A-AU gateways in a mesh network configuration?: The included antenna typically employs vertical linear polarization optimized for urban rooftop or pole-mounted installations facing unpredictable mobile terminals. When two MTCDT-LAP3-246A-AU units communicate, cross-polarization loss can degrade sensitivity by up to 3dB if one antenna rotates horizontally. In dense deployments, mismatched polarization reduces effective isotropic radiated power (EIRP) and increases packet retry rates. To maintain link margins above -100dBm thresholds required for robust LTE CAT 1 connections, site surveys should verify polarization alignment and consider diversity reception techniques or dual-polarized antennas where supported by the RF front-end design.

What are the implications of the MTCDT-LAP3-246A-AU’s RoHS3 compliance for global supply chain management, particularly in regions enforcing stricter hazardous substance controls than EU directives?: RoHS3 certification ensures adherence to the European Union’s latest restrictions on substances like lead, cadmium, mercury, and DEHP, exceeding previous iterations. This facilitates entry into EU markets and satisfies similar regulations in Japan, South Korea, and California under Proposition 65. However, RoHS3 does not preclude other regional requirements—for example, China’s Management Methods for Controlling Pollution by Electronic Information Products (China RoHS 2) imposes additional labeling and reporting obligations. Engineers sourcing the MTCDT-LAP3-246A-AU must still obtain full material declarations (IMDs) to demonstrate compliance with destination-specific thresholds, particularly for export-bound assemblies involving printed circuit boards or enclosures.

Parts with Similar Specifications

The three parts on the right have similar specifications to Multi-Tech Systems Inc. MTCDT-LAP3-246A-AU

Product Attribute
Part Number	MTCDT-LAT1-246A-US	MTCDT-LDC3-246A-923-JP	MTCDT-LAT1-246L-US	MTCDT-LAT1-210A-US
Manufacturer	Multi-Tech Systems Inc.	Multi-Tech Systems Inc.	Multi-Tech Systems Inc.	Multi-Tech Systems Inc.
Power - Output	-	-	-	-
Function	-	-	-	-
Applications	-	-	-	-
Series	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Sensitivity	-	-	-	-
Voltage - Supply	-	-	-	-
Interface	-	-	-	-
Data Rate (Max)	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Features	-	-	-	Simultaneous Sampling

MTCDT-LAP3-246A-AU Datasheet PDF

Download MTCDT-LAP3-246A-AU pdf datasheets and Multi-Tech Systems Inc. documentation for MTCDT-LAP3-246A-AU - Multi-Tech Systems Inc..

Environmental Information: MultiTech REACH.pdf

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Customer Reviews

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Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.
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This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.
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Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.
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Jul 15, 2026

Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.
FPGA***lorer88

Jul 7, 2026

The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.
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Jun 29, 2026

Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.
Emil***rperTech

Jun 23, 2026

Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.
Liam***terTech

Jun 15, 2026

Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.
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Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Common Countries Logistic Time Reference
Region	Country	Logistic Time(Day)
America	United States	5
America	Brazil	7
Europe	Germany	5
	United Kingdom	4
	Italy	5
Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
Asia	Japan	4
Middle East	Israel	6

DHL & FedEx Shipment Charges Reference
Shipment charges(KG)	Reference DHL(USD$)
0.00kg-1.00kg	USD$30.00 - USD$60.00
1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

Note:: The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.

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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.

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