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HomeProductsCapacitorsAluminum Electrolytic CapacitorsUUE1V102MNS6ZD
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UUE1V102MNS6ZD - Nichicon

Manufacturer Part Number
UUE1V102MNS6ZD
Manufacturer
Nichicon
Allelco Part Number
98D-UUE1V102MNS6ZD
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
305,824 pcs available, New & Original
Parts Description
CAP ALUM 1000UF 20% 35V SMD
Package
Radial, Can - SMD
Data sheet
UUE1V102MNS6ZD.pdf

PCN Obsolescence/ EOL

Mult Devs 25/Mar/2020.pdf

HTML Datasheet

UUE Series.pdf
RoHs Status
 
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Specifications

UUE1V102MNS6ZD Tech Specifications
Nichicon - UUE1V102MNS6ZD technical specifications, attributes, parameters and parts with similar specifications to Nichicon - UUE1V102MNS6ZD

Product Attribute Attribute Value
Manufacturer Nichicon
Voltage - Rated 35 V
Tolerance ±20%
Surface Mount Land Size 0.752" L x 0.752" W (19.10mm x 19.10mm)
Size / Dimension 0.709" Dia (18.00mm)
Series UUE
Ripple Current @ Low Frequency 1.036 A @ 120 Hz
Ripple Current @ High Frequency 1.4 A @ 100 kHz
Ratings -
Polarization Polar
Product Attribute Attribute Value
Package / Case Radial, Can - SMD
Package Tray
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount
Lifetime @ Temp. 5000 Hrs @ 105°C
Lead Spacing -
Height - Seated (Max) 0.886" (22.50mm)
ESR (Equivalent Series Resistance) -
Capacitance 1000 µF
Applications Automotive

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8532.22.0020

Frequently Asked Questions(FAQ)

What thermal management considerations apply when selecting the UUE1V102MNS6ZD for high-ripple-current applications?
The UUE1V102MNS6ZD is rated for 1.036A ripple current at 120Hz, which dissipates approximately 1.08W under continuous operation at rated ripple. With a 5000-hour lifetime at 105°C, thermal derating becomes critical in designs where ambient temperature exceeds 65°C or where the capacitor experiences sustained ripple current without adequate PCB thermal relief. The D18×22.5mm form factor limits convective cooling surface area; designs relying on the UUE1V102MNS6ZD in high-frequency switching supplies should incorporate copper pour around the pad, avoid routing heat-generating traces beneath the capacitor body, and verify that estimated junction temperature remains 20–30°C below the rated 105°C operating limit to extend service life beyond the 5000-hour specification.
How does the ±20% capacitance tolerance of the UUE1V102MNS6ZD affect DC bus stability and filter stage tuning?
The UUE1V102MNS6ZD carries ±20% tolerance, meaning actual capacitance may range from 800µF to 1200µF. In output filter networks where DC bus voltage ripple is tightly controlled, this variation can shift the effective time constant by ±20%, altering low-frequency attenuation characteristics. For designs requiring predictable damping or Q-factor in LC filters, the UUE1V102MNS6ZD should be paired with tighter-tolerance film capacitors (typically ±5% or better) in parallel, or alternative leaded aluminum electrolytic capacitors with ±10% tolerance should be considered. When the UUE1V102MNS6ZD is used as the primary bulk capacitor, system-level feedback loops should accommodate the capacitance spread to prevent instability across the manufacturing tolerance band.
Can the UUE1V102MNS6ZD be used in applications operating continuously at 105°C, or does the 5000-hour lifetime impose practical limits?
The UUE1V102MNS6ZD is rated for 5000 hours at 105°C maximum junction temperature. At 105°C continuous operation—without transient relief—the device reaches end-of-life in approximately 208 days. This specification is suitable only for intermittent duty cycles or designs where the UUE1V102MNS6ZD operates at 105°C for less than 20% of total mission time. For applications requiring extended service intervals (e.g., 1–5 years continuous runtime), designs should either derate the UUE1V102MNS6ZD to operate below 85°C (estimated 25,000-hour lifetime through Arrhenius acceleration) or specify alternative high-temperature electrolytics with longer rated lifetimes. Thermal simulation accounting for ripple current dissipation is necessary to confirm that actual UUE1V102MNS6ZD junction temperature remains substantially below the rated maximum.
What is the practical equivalent series resistance (ESR) of the UUE1V102MNS6ZD, and how does it influence transient response in switching converters?
Nichicon's datasheet does not publish explicit ESR values for the UUE1V102MNS6ZD in the standard specification. Typical ESR for 1000µF aluminum electrolytic capacitors in the D18×22.5mm SMD package ranges from 35–65mΩ at 1kHz and room temperature, with ESR increasing substantially at low temperatures and high frequencies. In buck or boost converter designs, the UUE1V102MNS6ZD contributes to output voltage overshoot during load step transients; measured ESR typically accounts for 30–50% of total voltage deviation before feedback correction. For noise-sensitive applications, the UUE1V102MNS6ZD should be paralleled with low-ESR ceramic capacitors (10–47µF, X7R/X5R) placed within 5mm of the load to mitigate transient peaks. Direct measurement or conservative ESR estimation (50mΩ assumed) is recommended before finalizing converter compensation networks that include the UUE1V102MNS6ZD.
How does the UUE1V102MNS6ZD compare to film or ceramic alternatives for the same 1000µF, 35V slot on a PCB?
The UUE1V102MNS6ZD occupies D18×22.5mm (approximately 22.5mm height), providing 1000µF in a compact SMD footprint. Polypropylene film capacitors rated for equivalent 1000µF and 35V would require significantly larger package geometries (typically 40×50mm or larger), making the UUE1V102MNS6ZD preferable for space-constrained designs. Ceramic alternatives (X7R, rated 35V) would need to be paralleled; a 1000µF equivalent stack using 100µF/35V ceramic capacitors requires ten devices, occupying substantially more board area and introducing parasitic inductance from interconnects. The UUE1V102MNS6ZD's cost advantage over film is typically 40–60%; however, aluminum electrolytics like the UUE1V102MNS6ZD exhibit higher ESR and temperature-dependent capacitance drift compared to film. For noise performance and temperature stability, the UUE1V102MNS6ZD is most cost-effective when paired with ceramic bulk capacitance rather than used as a standalone filter element.
Is the UUE1V102MNS6ZD suitable for audio or precision analog filtering applications?
The UUE1V102MNS6ZD is not recommended as a primary filter element for audio or precision instrumentation circuits. Aluminum electrolytics exhibit nonlinear impedance across the audio frequency range (20Hz–20kHz), with impedance magnitude remaining high at subsonic frequencies where the UUE1V102MNS6ZD would provide minimal attenuation. At ripple current frequencies near 120Hz, impedance of the UUE1V102MNS6ZD may be elevated due to ESR-dominated response, compounding 120Hz hum visibility in sensitive applications. Additionally, the ±20% tolerance of the UUE1V102MNS6ZD creates unpredictable phase response in passive filters. For audio power supplies, the UUE1V102MNS6ZD can serve as secondary bulk energy storage (after a larger, lower-impedance film capacitor), but primary ripple attenuation should employ low-ESR film or polycarbonate capacitors rated for the same voltage class.
What is the lead-free solder process compatibility window for the UUE1V102MNS6ZD?
The UUE1V102MNS6ZD is marked RoHS-compliant and is designed for lead-free manufacturing (typically SAC305 solder). Standard reflow profiles expose the UUE1V102MNS6ZD to peak temperatures near 250°C for 10–30 seconds; this transient thermal stress does not degrade the capacitor's electrical performance when profile limits are respected (JESD22-A113D peak temperature ≤260°C). However, repeated thermal cycling or hand-soldering (which may exceed 300°C locally) can degrade solder joint reliability at the UUE1V102MNS6ZD leads, particularly if rework cycles are performed. Wave soldering is not recommended for the UUE1V102MNS6ZD due to extended dwell time and moisture ingress risk through the can vent. Controlled atmosphere reflow and nitrogen-backfill are optional but reduce oxidation risk for the UUE1V102MNS6ZD during high-volume production.
How should design-in accommodation for the UUE1V102MNS6ZD account for capacitance degradation over thermal stress and extended life?
The UUE1V102MNS6ZD will lose approximately 5–10% of nominal capacitance during the first 1000 hours of operation at rated conditions (105°C), followed by slower degradation. Over the full 5000-hour rated lifetime, total capacitance loss typically reaches 15–20%. Designs that depend on precise capacitance values should add 25–30% capacitance margin when selecting the UUE1V102MNS6ZD; for example, if 850µF is the minimum required DC-link energy, specify a pair of UUE1V102MNS6ZD units to achieve 2000µF initially, which will degrade to approximately 1600–1700µF after 5000 hours. ESR typically increases 2–3× over the same period, further degrading transient response and ripple performance. For designs targeting 10+ year service life, capacitive derating curves published by Nichicon should be consulted, and the UUE1V102MNS6ZD should be operated at reduced ripple current (70–80% of rating) to extend effective lifetime beyond the 5000-hour specification.
What mounting and rework precautions apply specifically to the UUE1V102MNS6ZD SMD package?
The UUE1V102MNS6ZD uses a radial SMD termination style with two solder pads spaced approximately 2.54mm apart. During automated pick-and-place, the UUE1V102MNS6ZD should be oriented consistently to avoid tombstoning under rapid heating; pad size (typically 1.2×2.0mm) should accommodate ±0.1mm placement tolerance. Rework of the UUE1V102MNS6ZD requires hot-air reflow at 250°C or above; soldering iron rework risks PCB laminate lift and thermal shock to internal foil elements. After rework, the UUE1V102MNS6ZD should be allowed to cool naturally to room temperature before power application, as thermal transients while pressurized electrolyte is present can increase internal impedance. The UUE1V102MNS6ZD's D18 diameter creates a relatively large thermal mass; surrounding copper pour should be sized to dissipate reflow heat gradually and prevent localized temperature spikes above 260°C.
Can multiple UUE1V102MNS6ZD capacitors be paralleled to achieve lower ESR and higher ripple current rating?
Paralleling multiple UUE1V102MNS6ZD units reduces effective ESR and allows ripple current to be distributed across devices. Two UUE1V102MNS6ZD in parallel will achieve approximately half the ESR of a single device and support combined ripple current near 2A@120Hz (exceeding either individual UUE1V102MNS6ZD's 1.036A rating). However, paralleling introduces interconnect inductance; lead lengths must be minimized and return paths routed symmetrically to avoid circulating currents and ESR cancellation failure. At 120Hz ripple frequencies, parasitic inductance of the UUE1V102MNS6ZD lead frame and PCB traces typically ranges from 0.5–2nH, creating impedance that increases effective parallel ESR. For optimal benefit, multiple UUE1V102MNS6ZD units should be placed within 3mm of each other, with common return vias positioned at the geometric center of the pad cluster. Paralleling is most effective when the UUE1V102MNS6ZD devices are on the same layer; stacking capacitors on different PCB layers reduces ESR benefit due to vertical interconnect inductance.
What moisture absorption and humidity protection measures should be implemented for the UUE1V102MNS6ZD in tropical or high-humidity environments?
The UUE1V102MNS6ZD aluminum case is sealed but not hermetic; the vent valve (designed to relieve internal pressure) allows slow moisture ingress over months of exposure to high humidity (>80% RH). In tropical climates, unconformal-coated boards containing the UUE1V102MNS6ZD should be stored in dry-packs (silica gel desiccant) and deployed with protective conformal coatings (acrylic or urethane, IPC-A-610 Class 2) applied over populated boards. If the UUE1V102MNS6ZD is exposed to 90%+ RH for extended periods before solder reflow, baking at 60–80°C for 8 hours is recommended to drive off absorbed moisture and prevent popcorning during thermal cycling. In operational service, thermal cycling of boards containing the UUE1V102MNS6ZD from freezing (–55°C) to elevated temperature (>60°C) can generate condensation if internal venting of the UUE1V102MNS6ZD case or surrounding traces occurs; potting or conformal coating mitigates this risk.
How does ripple current frequency and waveform shape affect the thermal performance of the UUE1V102MNS6ZD?
The UUE1V102MNS6ZD ripple current specification is given at 120Hz, a standard low-frequency reference. In practical switching converters, ripple current spectrum is broadband, with energy concentrated near the switching frequency (typically 50kHz–1MHz) and harmonics. At higher frequencies, skin-effect resistance of the aluminum foil and lead frame increases the effective ESR of the UUE1V102MNS6ZD, raising power dissipation compared to a simple calculation assuming constant ESR. For example, ripple current at 500kHz may generate 2–3× higher dissipation than the same RMS current at 120Hz. Trapezoidal or non-sinusoidal ripple waveforms common in PWM switching supplies increase crest factor and push peak current above the RMS value; the UUE1V102MNS6ZD thermal limit may be reached at lower average ripple current than the 1.036A@120Hz datasheet rating suggests. Thermal models for the UUE1V102MNS6ZD should incorporate frequency-dependent ESR (typically available from Nichicon's SPICE models) and account for ripple waveform shape to avoid over-specifying thermal margin.
What is the typical leakage current of the UUE1V102MNS6ZD at rated voltage, and how does leakage affect DC bus hold-up time in backup power circuits?
Leakage current for aluminum electrolytics like the UUE1V102MNS6ZD is typically 0.01CV mA at room temperature (where C is capacitance in µF and V is rated voltage in volts). For the UUE1V102MNS6ZD at 35V rated, estimated leakage is approximately 0.01 × 1000 × 35 = 350µA under ideal conditions. At elevated temperature (85°C), leakage can increase 3–5×, reaching 1–1.75mA. In backup power applications where the UUE1V102MNS6ZD provides hold-up time after AC failure, this leakage current directly reduces available stored energy. A UUE1V102MNS6ZD pre-charged to 30V will discharge to 15V (50% voltage) in approximately 12–20 hours at room temperature if no load is connected; at 85°C, discharge time drops to 2–3 hours. For battery backup circuits, the UUE1V102MNS6ZD should be isolated via a diode after charge, or paired with ultra-low-leakage supercapacitors, to preserve stored energy over extended standby periods. Datasheet leakage values should be verified under actual operating temperature and voltage stress.
How should the UUE1V102MNS6ZD be specified in designs targeting automotive or military qualification standards?
The UUE1V102MNS6ZD meets RoHS environmental compliance but does not carry automotive (AEC-Q200) or military (MIL-SPEC) qualification markings from Nichicon. In automotive designs, equivalent Nichicon capacitors from the AEC-Q200 family (e.g., PZ series) provide enhanced screening, vibration testing (MIL-STD-810), and thermal cycling validation appropriate for underhood or high-vibration environments; substituting the UUE1V102MNS6ZD without qualification approval may violate design standards. For military or aerospace applications, the UUE1V102MNS6ZD cannot be used directly; mil-spec variants with extended temperature validation (–55°C to +125°C operational range verified, not merely specified) and lot traceability are required. Design-in decisions should confirm whether the UUE1V102MNS6ZD's 5000-hour@105°C rating and commercial-grade screening satisfy mission reliability requirements, or whether higher-grade alternatives justify the cost and availability tradeoff. Qualification documentation and thermal stress test data for the UUE1V102MNS6ZD should be requested from Nichicon before committing to high-reliability applications.

Parts with Similar Specifications

The three parts on the right have similar specifications to Nichicon UUE1V102MNS6ZD

Product Attribute UUE1V102MNS1ZD UUE1V102MRS1ZD UUE1V102MNS6MS UUE1V102MNS1MS
Part Number UUE1V102MNS1ZD UUE1V102MRS1ZD UUE1V102MNS6MS UUE1V102MNS1MS
Manufacturer Nichicon Nichicon Nichicon Nichicon
Surface Mount Land Size - - - -
Size / Dimension - - - -
Tolerance - - - -
Lead Spacing - - - -
Ripple Current @ Low Frequency - - - -
Lifetime @ Temp. - - - -
Ripple Current @ High Frequency - - - -
ESR (Equivalent Series Resistance) - - - -
Capacitance - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Polarization - - - -
Voltage - Rated - - - -
Mounting Type - Surface Mount Through Hole Surface Mount
Applications - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Height - Seated (Max) - - - -
Ratings - - - -
Series - - - -

UUE1V102MNS6ZD Datasheet PDF

Download UUE1V102MNS6ZD pdf datasheets and Nichicon documentation for UUE1V102MNS6ZD - Nichicon.

Datasheets
Aluminum Electrolytic Land, Reflow.pdf Chip Type Tape Spec.pdf
PCN Obsolescence/ EOL
Mult Devs 25/Mar/2020.pdf
HTML Datasheet
UUE Series.pdf

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Nichicon

UUE1V102MNS6ZD

Nichicon
98D-UUE1V102MNS6ZD

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