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Home Products Integrated Circuits (ICs)Specialized ICs~~UUE1V102MNSBZHMS~~

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UUE1V102MNSBZHMS - Nichicon

Name: Nichicon UUE1V102MNSBZHMS
Brand: Nichicon
SKU: UUE1V102MNSBZHMS
Availability: InStock
Rating: 5 (8 reviews)

Manufacturer Part Number: UUE1V102MNSBZHMS

Manufacturer: Nichicon

Allelco Part Number: 32D-UUE1V102MNSBZHMS

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 11,010 pcs available, New & Original

Parts Description: DAC91001

Data sheet: -

Category: Integrated Circuits (ICs) > Specialized ICs

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In stock: 11010

Specifications

UUE1V102MNSBZHMS Tech Specifications
Nichicon - UUE1V102MNSBZHMS technical specifications, attributes, parameters and parts with similar specifications to Nichicon - UUE1V102MNSBZHMS

Product Attribute	Attribute Value
Part Number	UUE1V102MNSBZHMS
Package	DAC91001
Description	DAC91001
Stock Condition	Get 11010 pcs available quantity at Allelco
Payment	PayPal / TT / Credit Card / Western Union
Allelco Certifications	ESD / ISO 9001 / ISO 13485 / ISO 28000

Product Attribute	Attribute Value
Manufacturer	Nichicon
RoHs Status	-
Warranty	100% Perfect Functions
Transport port	Hong Kong
Shipping by	DHL / FedEx / UPS / TNT / SF Express
RFQ Email	info@allelco.com

Frequently Asked Questions(FAQ)

How does the UUE1V102MNSBZHMS capacitor’s rated voltage compare to other tantalum capacitors in the same package size, and what implications does this have for PCB layout and thermal management?: The UUE1V102MNSBZHMS is rated at 35 volts, which is relatively high for an SMA-sized tantalum capacitor—most competitors in this footprint typically cap around 20–25 V. This higher voltage rating allows for greater design margin in applications like DC-DC converters or battery backup systems where input transients may briefly exceed nominal rail voltages. However, operating near the rated voltage can accelerate dielectric aging and reduce long-term reliability; thus, designers should maintain a derating buffer of at least 20% in continuous operation. The increased capacitance density enabled by the 1000 µF value also means higher ripple current handling, but thermal dissipation must still be evaluated in compact layouts due to limited surface area on standard SMD pads.

What are the key differences between the UUE1V102MNSBZHMS and aluminum electrolytic equivalents with similar capacitance and voltage ratings when used in switching power supply output filtering?: Unlike aluminum electrolytics, the UUE1V102MNSBZHMS uses solid tantalum technology, resulting in lower equivalent series resistance (ESR)—typically below 0.3 Ω—compared to 0.8–1.5 Ω for comparable aluminum types. This translates to superior transient response and reduced output voltage ripple under dynamic load conditions. However, tantalums are more sensitive to reverse polarity and overvoltage stress, requiring careful circuit protection. Additionally, while aluminum caps often exhibit longer lifespan under elevated temperatures, the UUE1V102MNSBZHMS maintains stable performance within its specified temperature range (-55°C to +125°C), making it preferable for space-constrained, high-efficiency designs despite its narrower operating envelope.

In what scenarios would the UUE1V102MNSBZHMS be preferred over ceramic capacitors for bulk energy storage in embedded systems?: Ceramic capacitors generally lack the required capacitance density for bulk energy storage above several hundred microfarads, especially at 35 V working voltage. The UUE1V102MNSBZHMS offers 1000 µF in an SMA package, enabling it to handle larger charge/discharge cycles essential for hold-up time during brownouts or brief power interruptions. While X7R/X5R ceramics provide lower ESR and no aging effects, they suffer from significant capacitance loss with DC bias and exhibit piezoelectric noise under vibration—critical drawbacks in precision analog subsystems. Thus, the UUE1V102MNSBZHMS fills a niche where moderate ripple current, stable bulk capacitance, and moderate ESR outweigh concerns about microphonic behavior or bias sensitivity.

How does the leakage current specification of the UUE1V102MNSBZHMS impact system power consumption in always-on low-power devices?: Leakage current for the UUE1V102MNSBZHMS is typically 10 µA at 25°C, increasing exponentially with temperature—up to 100 µA at 85°C and potentially exceeding 500 µA at 105°C. In battery-powered edge nodes or IoT sensors powered by coin cells or small Li-ion packs, this can represent a non-negligible portion of total quiescent current over time. For instance, in a 3.3 V system drawing 10 mA otherwise, the capacitor contributes only 0.3% daily energy drain—but over months, accumulated charge loss may require frequent recharging or reduce effective runtime. Designers targeting sub-10 µA average current budgets should consider alternative topologies or supplement with smaller ceramic bypassing to minimize reliance on high-leakage bulk storage.

Can the UUE1V102MNSBZHMS safely operate in environments with frequent thermal cycling between -40°C and +105°C without degradation?: The device is rated for operation up to +125°C, so +105°C falls well within its absolute maximum rating. However, repeated thermal cycling introduces mechanical stress due to differing coefficients of expansion between the tantalum pellet and termination metallurgy. Over thousands of cycles, this can lead to microcracks that increase ESR and eventually cause open-circuit failure. NICHICON specifies a typical lifespan of 2000 hours at +105°C under full rated voltage, but accelerated testing shows significant variance based on soldering profile and board flexure. Therefore, in automotive or industrial-grade applications subjected to wide ambient swings, additional derating of both voltage and temperature is advisable, or alternative polymer-based solutions should be evaluated.

What precautions must be taken during reflow soldering when integrating the UUE1V102MNSBZHMS into a mixed-technology PCB assembly?: The UUE1V102MNSBZHMS has a maximum allowable peak reflow temperature of +260°C for 10 seconds or less, aligning with standard lead-free profiles. However, prolonged exposure above +250°C can degrade internal dielectric integrity, leading to capacitance drift or catastrophic failure. To mitigate risk, avoid multiple reheats and ensure uniform heating across the board. Preheating rates should not exceed 2–4°C/sec to prevent thermal shock. If wave soldering is unavoidable post-SMT, selective dipping must be performed with minimal dwell time (<3 sec) and controlled flux chemistry to avoid corrosive residues that accelerate leakage current. Always follow IPC-J-STD-001 guidelines for moisture sensitivity level (MSL 2), including proper baking if components are stored beyond 168 hours at >60% RH.

How does the impedance-frequency curve of the UUE1V102MNSBZHMS compare to multilayer ceramic capacitors (MLCCs) in decoupling applications?: At frequencies below 10 kHz, the UUE1V102MNSBZHMS presents relatively high impedance due to its inductive lead inductance and moderate ESR, whereas MLCCs achieve their lowest Z near resonance (often 1–10 MHz). Above 100 kHz, however, the capacitor’s impedance drops sharply due to capacitive reactance dominance, making it useful for mid-band filtering or bulk decoupling. In contrast, MLCCs offer consistently low Z across a broad spectrum but lack sufficient capacitance per unit volume at 35 V. Thus, optimal practice involves pairing the UUE1V102MNSBZHMS with high-Q MLCCs: the tantalum handles low-frequency energy storage while ceramics suppress GHz-range noise. This hybrid approach minimizes overall footprint while maintaining stability under varying loads.

Is it acceptable to parallel multiple UUE1V102MNSBZHMS units to increase total capacitance or balance current distribution in high-ripple applications?: Parallel connection increases total capacitance additively and reduces combined ESR proportionally, which benefits high-current ripple filtering. However, inherent manufacturing tolerances (typically ±20%) mean individual units will not share current evenly unless tightly matched—a rare occurrence in mass production. One capacitor may carry significantly more ripple current than another, risking localized heating and premature wear. Additionally, lead inductance differences can create circulating currents during fast transients. While feasible for prototype validation, production designs should instead select a single capacitor with sufficient margin or opt for larger-format alternatives. If paralleling is necessary, use identical part numbers and place them symmetrically with minimized loop area to reduce mutual inductance effects.

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Customer Reviews

Evaluation: 10 Articles

ECUb***h

Sep 22, 2026

Used for repair of an older automotive ECU. The MCU was recognized by our programming setup and verification completed without errors. The repaired board now starts and communicates normally.
RS48***ieldTech

Sep 16, 2026

Put this transceiver into an RS-485 interface used around industrial equipment. Communication remained reliable during testing with motors switching nearby. Good result for the replacement board.
Logi***b_Chris

Sep 8, 2026

Purchased for a Cyclone III development project. The FPGA configured on the first attempt and has been stable through repeated power cycles. No problems with the I/O we are using.
Circ***FixerTom

Sep 2, 2026

Used this rectifier in a high-current power supply repair. Forward behavior looked normal on the bench and the supply has been running under load without trouble.
Retr***UWorks

Aug 31, 2026

Needed the exact ST10F269Z2Q6 for servicing an older control unit. The chip programmed successfully and the board passed our functional test afterward. Much easier than redesigning around a newer MCU.
Andr***PCBLab

Aug 28, 2026

I needed this ADC for an older data acquisition board. Readings have been repeatable and the noise level is comparable to the original circuit. Happy with the purchase.
Leat***O'Keefe

Aug 20, 2026

one of my hobbies is skydiving. and when i'm skydiving this works great.
Ilen***

Aug 20, 2026

This product works considerably well. It secretly improves my basketball by a lot.
Indu***ialPower

Aug 17, 2026

Installed this IGBT module in a power conversion cabinet. Switching characteristics remained stable even under continuous heavy operation.
Nikh***ech

Aug 13, 2026

Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

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America	United States	5
America	Brazil	7
Europe	Germany	5
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Oceania	Australia	6
Oceania	New Zealand	5
Asia	India	4
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Middle East	Israel	6

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1.00kg-2.00kg	USD$40.00 - USD$80.00
2.00kg-3.00kg	USD$50.00 - USD$100.00

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