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HomeProductsSensors, TransducersOptical Sensors - Image Sensors, CameraOV02718-H77T
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OV02718-H77T - OmniVision Technologies Inc

Manufacturer Part Number
OV02718-H77T
Manufacturer
OmniVision Technologies
Allelco Part Number
98D-OV02718-H77T
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
3,993 pcs available, New & Original
Parts Description
HD CAMERA CHIP SENSOR
Package
Module
Data sheet
OV02718-H77T.pdf

Datasheets

OV2718 Brief ~.pdf
RoHs Status
RoHS Compliant
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In stock: 3993

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Specifications

OV02718-H77T Tech Specifications
OmniVision Technologies Inc - OV02718-H77T technical specifications, attributes, parameters and parts with similar specifications to OmniVision Technologies Inc - OV02718-H77T

Product Attribute Attribute Value
Manufacturer OmniVision Technologies
Voltage - Supply 1.7V ~ 3.47V
Type CMOS
Supplier Device Package Module
Series CameraChip™, OmniBSI-2™
Pixel Size 2.8µm x 2.8µm
Product Attribute Attribute Value
Package / Case Module
Package Tray
Operating Temperature -30°C ~ 85°C
Frames per Second 30
Base Product Number OV02718
Active Pixel Array 1920H x 1080V

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN EAR99
HTSUS 8542.39.0001

Frequently Asked Questions(FAQ)

How does the OV02718-H77T compare to other 2.8µm pixel pitch CMOS sensors in terms of dynamic range and low-light sensitivity for surveillance applications?
The OV02718-H77T leverages OmniVision’s OmniBSI-2™ backside illumination technology, which improves quantum efficiency compared to frontside illumination designs. With a 2.8µm x 2.8µm pixel size and support for rolling shutter operation at 30 fps in 1080p resolution, it delivers competitive performance in low-light conditions—particularly when paired with high-gain analog front-end settings. However, when compared to newer stacked-die sensors like those using DR-Pix or Quad-Bayer architectures, the OV02718-H77T may exhibit lower full-well capacity and reduced dynamic range under high-contrast scenes. Its effective dynamic range is typically around 65 dB in standard gain mode, making it suitable for indoor surveillance but less ideal than advanced global-shutter alternatives for outdoor or high-clarity monitoring.
What are the key thermal and power considerations when integrating the OV02718-H77T into a compact module design operating near its maximum temperature rating?
The OV02718-H77T operates reliably from -30°C to 85°C, but prolonged exposure near 85°C can accelerate dark current increase and degrade long-term image quality due to increased thermal noise. Power consumption varies with frame rate and output load; at 30 fps and 1920x1080 resolution, typical supply current ranges between 45 mA (at 1.8V) and 78 mA (at 3.3V), depending on I/O activity and digital processing load. Efficient PCB layout with proper decoupling and thermal vias is essential, especially in sealed enclosures where ambient temperature rises. Thermal modeling should account for self-heating effects during burst capture modes to avoid throttling or reliability issues.
Can the OV02718-H77T be used in automotive vision systems requiring ASIL compliance, and what limitations should be considered?
While the OV02718-H77T is not certified for automotive functional safety (e.g., ISO 26262 ASIL), it may serve in non-safety-critical vision roles such as driver drowsiness detection or interior occupancy monitoring if supported by system-level redundancy and software validation. Its fixed rolling-shutter architecture introduces motion artifacts unsuitable for high-speed automotive scenarios like lane-change recognition. Additionally, the sensor lacks built-in defect correction memory or on-chip ECC, increasing reliance on external calibration firmware—a limitation in safety-certified designs. For true automotive use, OmniVision’s OX02F10 or similar AEC-Q100-qualified parts are recommended.
What interface options does the OV02718-H77T support, and how do they impact system complexity when interfacing with common image signal processors?
The OV02718-H77T supports parallel CMOS output and MIPI CSI-2 (up to 2-lane), with the latter offering lower pin count and reduced electromagnetic interference for compact modules. The 2-lane CSI-2 configuration is ideal for integration with embedded processors like Raspberry Pi Compute Module or NXP i.MX series, enabling direct streaming at up to 600 Mbps aggregate bandwidth. Parallel output simplifies timing control but increases PCB routing complexity and susceptibility to noise. Selection between interfaces depends on host processing capability and required data throughput; CSI-2 is preferred for modern SoCs while parallel remains viable for legacy FPGA-based designs.
How does the Moisture Sensitivity Level (MSL) of 3 for the OV02718-H77T affect storage and assembly handling in high-volume manufacturing environments?
As an MSL 3 component, the OV02718-H77T must be stored in dry ambient conditions (≤30% RH) and assembled within 168 hours after opening the moisture-barrier bag to prevent popcorning during reflow soldering. Manufacturers must implement strict humidity monitoring and bake-out protocols if storage exceeds this window. This requirement adds logistical overhead compared to MSL 1 components, particularly in regions with high atmospheric humidity. Automated optical inspection (AOI) post-assembly helps catch delamination or package damage caused by moisture ingress, underscoring the need for disciplined supply chain controls.
Is there a difference in performance between the OV02718-H77T and other variants in the OV02718 base family, such as OV02718-L77C or OV02718-M77T, especially regarding lens compatibility and optical stack alignment?
Variants within the OV02718 base family differ primarily in packaging format, temperature grade, and optional features like integrated lens mounts or IR-cut filters. The H77T designation typically indicates a top-side mount with a standard C-mount interface and optimized IR response for near-infrared imaging, whereas L77C may feature a lower-profile flange back distance suited for slim cameras. These mechanical differences directly impact optical coupling efficiency and focus tolerance. While core image quality metrics like SNR and dark current remain consistent across variants, system-level performance varies based on lens selection and enclosure design—making variant choice dependent on application form factor rather than raw sensor capability.
What are the implications of the 2.8µm pixel size on depth of field and light collection efficiency in machine vision applications using the OV02718-H77T?
At 2.8µm pitch, the OV02718-H77T balances resolution and light-gathering area, allowing sufficient photon capture for stable exposure even under moderate lighting. However, smaller pixels relative to larger-format sensors reduce per-pixel well capacity, limiting dynamic range in bright environments. Depth of field is governed more by lens f-number and working distance than pixel size alone, but higher pixel density enables finer spatial sampling, improving edge detection accuracy in structured-light systems. When used in binning mode (e.g., 2x2), effective pixel size increases to 5.6µm, enhancing sensitivity at the expense of spatial resolution—a trade-off critical for barcode reading or OCR tasks.
How should designers mitigate rolling shutter distortion when using the OV02718-H77T in fast-moving object inspection scenarios?
Rolling shutter distortion occurs because rows are exposed sequentially, causing skew in fast-moving objects—this is inherent to the OV02718-H77T’s architecture. Mitigation strategies include reducing exposure time to minimize row delay, synchronizing capture with known motion trajectories, or applying software-based geometric correction algorithms. In extreme cases, switching to a global-shutter sensor is unavoidable. Alternatively, mechanical shutters or strobe illumination can freeze motion effectively. Designers should validate distortion levels under worst-case velocities (e.g., conveyor speeds >2 m/s) and adjust frame timing accordingly to maintain image integrity.
What role does the 1.7V to 3.47V supply voltage range play in power optimization for battery-powered camera modules using the OV02718-H77T?
Operating across a wide voltage range allows the OV02718-H77T to adapt to various power domains, such as 1.8V digital logic or 3.3V legacy I/O standards. Lowering the supply voltage reduces dynamic power quadratically, benefiting portable devices. However, aggressive voltage scaling below 2.0V may increase read noise due to reduced headroom in analog circuits, degrading SNR. Dynamic voltage and frequency scaling (DVFS) techniques can be employed during idle periods to save energy, but stability margins must be verified across process-voltage-temperature corners. Efficient LDO or buck-boost regulators are recommended to maintain clean power delivery and avoid reset glitches.
Are there any known limitations in HDR implementation with the OV02718-H77T that affect real-world scene reconstruction?
The OV02718-H77T supports dual-exposure HDR through internal register control, but unlike multi-frame fusion sensors, it lacks hardware synchronization across exposures, leading to potential ghosting in moving subjects. Effective HDR requires precise timing alignment and scene stabilization; otherwise, luminance discontinuities compromise tone mapping. Additionally, the sensor’s limited bit depth (typically 10-bit ADC) restricts tonal granularity compared to 12-bit or higher-resolution sensors. For applications demanding robust HDR without motion artifacts, external computational photography pipelines must compensate, adding latency and processing load.
How does the RoHS compliance status of the OV02718-H77T influence material selection in consumer electronics manufacturing?
Being RoHS compliant means the OV02718-H77T adheres to restrictions on lead, mercury, cadmium, and certain flame retardants, aligning with global environmental regulations for electronic goods. This ensures compatibility with lead-free reflow profiles and avoids legal risks in export markets. However, compliance does not guarantee halogen-free packaging or substrate materials, so designers should confirm additional certifications (e.g., REACH, Halogen-Free) when targeting eco-conscious brands. Substrate choices like FR4 vs. flexible PCBs may still introduce restricted substances outside the die itself, necessitating holistic supply chain audits.
What calibration requirements apply to the OV02718-H77T in high-accuracy color reproduction scenarios, and how do they compare to reference-grade imaging systems?
Achieving accurate color fidelity demands white balance tuning, lens shading correction, and flat-field calibration tailored to the specific optical path. The OV02718-H77T provides programmable gains and offsets via I2C, enabling per-channel adjustment, but lacks on-chip color filter array (CFA) interpolation calibration aids found in higher-tier sensors. Compared to scientific-grade CMOS devices, its spectral response curve and crosstalk characteristics require empirical characterization under target illumination spectra. Factory calibration data must be stored externally and applied during ISP processing to meet industry standards like sRGB or Adobe RGB.
Can the OV02718-H77T operate reliably in dusty or high-vibration industrial environments, and what protective measures are advisable?
The module package offers basic environmental isolation, but dust ingress can scatter light and reduce contrast unless combined with optical filters or protective windows. Vibration resistance depends on mounting methodology—flexible solder joints or standoffs help dampen mechanical stress. Without conformal coating or hermetic sealing, particulate buildup inside the lens barrel may necessitate periodic maintenance. For harsh environments, consider external IP-rated housings and anti-reflective coatings on sensor windows to preserve image clarity over time.
What are the typical applications where the OV02718-H77T outperforms alternative 1080p CMOS sensors, and in which domains might it fall short?
The OV02718-H77T excels in cost-sensitive, medium-performance applications such as security cameras, web conferencing devices, and entry-level dash cams where 1080p resolution and reasonable low-light performance justify its price. Its compact module form factor suits space-constrained designs. It falls short in high-speed inspection, medical endoscopy, or automotive ADAS due to rolling shutter, lack of global sync, and absence of specialized features like phase-detection autofocus. In these domains, higher-cost sensors with superior readout architectures are preferred despite similar resolution.
How should system architects evaluate the total cost of ownership when selecting the OV02718-H77T versus newer-generation alternatives with improved power efficiency?
Beyond unit price, total cost includes development effort, BOM complexity, power budget allocation, and lifecycle longevity. The OV02718-H77T may offer lower NRE costs and faster time-to-market for non-critical vision tasks, but if power consumption exceeds 80 mA continuously, battery life in mobile devices could shrink significantly compared to sub-30 mA competitors. Additionally, obsolescence risk must be assessed—older sensor families may face reduced availability or support over 5–7 years. A lifecycle analysis should weigh these factors against performance ceilings and scalability needs.
What impact does the absence of on-chip temperature compensation have on long-term drift in automated optical inspection systems using the OV02718-H77T?
Without integrated temperature sensing or compensation circuitry, the OV02718-H77T exhibits gradual dark current rise and offset shift with thermal cycling, particularly above 60°C. In precision inspection setups, this necessitates frequent background subtraction or thermal stabilization mechanisms, increasing system complexity. External thermistors and firmware-based correction tables can partially address drift, but real-time adaptation remains imperfect. Systems requiring sub-pixel accuracy over extended durations should consider sensors with built-in thermal feedback or active cooling solutions.

Parts with Similar Specifications

The three parts on the right have similar specifications to OmniVision Technologies Inc OV02718-H77T

Product Attribute OV02718-H77T-2A OV02718-H77A-2A OV02718-H77A OV02718-H77A-2B
Part Number OV02718-H77T-2A OV02718-H77A-2A OV02718-H77A OV02718-H77A-2B
Manufacturer OmniVision Technologies Inc OmniVision Technologies Inc OmniVision Technologies Inc OmniVision Technologies Inc
Type - - - -
Frames per Second - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Pixel Size - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Voltage - Supply - - - -
Active Pixel Array - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42

OV02718-H77T Datasheet PDF

Download OV02718-H77T pdf datasheets and OmniVision Technologies Inc documentation for OV02718-H77T - OmniVision Technologies Inc.

Datasheets
OV2718 Brief ~.pdf
PCN Packaging
2D Barcode Label Chgs 2/Aug/2019.pdf

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OmniVision Technologies Inc

OV02718-H77T

OmniVision Technologies Inc
98D-OV02718-H77T

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