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Home Products Connectors, Interconnects Rectangular Connectors - Headers, Male Pins~~351-10-145-00-004101~~

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351-10-145-00-004101 - Preci-Dip

Manufacturer Part Number: 351-10-145-00-004101

Manufacturer: Preci-Dip

Allelco Part Number: 98D-351-10-145-00-004101

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 47,252 pcs available, New & Original

Parts Description: CONN HEADER VERT 45POS 2.54MM

Package: Bulk

Data sheet: -

RoHs Status: ROHS3 Compliant

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In stock: 47252

Unit Price: $9.134
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Specifications

351-10-145-00-004101 Tech Specifications
Preci-Dip - 351-10-145-00-004101 technical specifications, attributes, parameters and parts with similar specifications to Preci-Dip - 351-10-145-00-004101

Product Attribute	Attribute Value
Manufacturer	Preci-Dip
Voltage Rating	150VDC
Termination	Solder
Style	Board to Board
Shrouding	Unshrouded
Series	351
Row Spacing - Mating	-
Pitch - Mating	0.100" (2.54mm)
Package	Bulk
Overall Contact Length	0.575" (14.60mm)
Operating Temperature	-55°C ~ 125°C
Number of Rows	1
Number of Positions Loaded	All
Number of Positions	45
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Mated Stacking Heights	-
Insulation Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

Product Attribute	Attribute Value
Insulation Height	0.116" (2.95mm)
Insulation Color	Black
Ingress Protection	-
Features	-
Fastening Type	Push-Pull
Current Rating (Amps)	3A
Contact Type	Male Pin
Contact Shape	Circular
Contact Material	Brass
Contact Length - Post	0.126" (3.20mm)
Contact Length - Mating	0.118" (3.00mm)
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Finish - Post	Gold
Contact Finish - Mating	Gold
Connector Type	Header
Base Product Number	351-10
Applications	-

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8536.69.4040

Frequently Asked Questions(FAQ)

What are the key differences between the Preci-Dip 351-10-145-00-004101 and standard 0.1" headers used in prototyping versus production applications?: The Preci-Dip 351-10-145-00-004101 is designed for board-to-board interconnection with a 45-position single-row configuration at 2.54mm pitch. Unlike generic prototype headers, this connector features gold-plated contacts (10.0µin thickness on both mating and post surfaces) and brass construction, which provides superior corrosion resistance and contact reliability in industrial environments. The through-hole solder termination with push-pull fastening distinguishes it from friction-fit alternatives. With a 3A current rating per position and 150VDC rating, the 351-10-145-00-004101 accommodates moderate-power signal and power distribution tasks. The polycyclohexylenedimethylene terephthalate (PCT) insulation rated UL94 V-0 meets flame-retardant requirements for safety-critical applications, whereas many low-cost headers use lower-grade materials.

Can the Preci-Dip 351-10-145-00-004101 be used in high-vibration or shock-prone environments, and what mechanical considerations apply?: The 351-10-145-00-004101 uses push-pull fastening with through-hole mounting, which provides mechanical stability superior to press-fit or friction-lock alternatives in vibration-intensive applications. The contact length specifications (0.118" mating depth, 0.126" post length, 0.575" overall) ensure consistent engagement depth that resists intermittent contact issues common in shaking or thermal cycling scenarios. However, the unshrouded design of the 351-10-145-00-004101 means individual conductors lack positional keying, so designers must verify PCB layout precision and use strain relief or cable management to prevent mechanical flexing at the solder joints. The operating temperature range of -55°C to 125°C accommodates thermal shock cycles, but repeated mechanical stress on the 0.1" pitch leads requires attention to PCB copper trace thickness and via placement near the header footprint.

How does the contact resistance of the Preci-Dip 351-10-145-00-004101 affect signal integrity in high-speed digital applications?: The 351-10-145-00-004101 employs gold-plated brass contacts with 10.0µin (0.25µm) mating surface plating, which provides excellent contact resistance characteristics (typically <20 mΩ per contact pair in normal conditions). For low-speed digital signals and analog measurements, this contact resistance is negligible. However, in high-speed digital applications (>10 MHz clock rates) or precision analog measurement chains, the cumulative contact resistance across 45 positions in the 351-10-145-00-004101 can introduce measurable voltage drops if carrying significant current, potentially degrading signal-to-noise ratios. Designers should distribute return paths across multiple ground positions rather than concentrating all ground contacts, and use separate signal and power planes when the 351-10-145-00-004101 carries mixed-signal traffic. The push-pull mating design ensures repeatable contact force, mitigating contact resistance drift from repeated connection/disconnection cycles.

What is the practical current-carrying capacity of individual positions on the Preci-Dip 351-10-145-00-004101 when used in power distribution applications?: The 351-10-145-00-004101 carries a 3A per-position current rating at 150VDC. In practice, this rating is achievable in free-air conditions; however, thermal dissipation becomes a limiting factor when multiple adjacent positions on the 351-10-145-00-004101 simultaneously carry near-rated current, because the positions are packed at 0.1" (2.54mm) spacing and heat dissipation is limited by the insulation material (PCT with glass filler). For continuous operation near 3A on multiple channels, thermal analysis should account for copper trace width on the PCB and spacing between power vs. return pins in the 351-10-145-00-004101 layout. Practical designs typically derate to 2–2.5A per position when three or more power positions are in use adjacent to each other. Pulsed or intermittent current can approach the full 3A rating without thermal concerns. The 150VDC rating provides headroom for industrial supply voltages but should not be confused with AC impulse withstand capability, which is not specified for the 351-10-145-00-004101.

How does the Preci-Dip 351-10-145-00-004101 compare to ribbon cable connectors or edge-card connectors for parallel bus applications?: The 351-10-145-00-004101 offers advantages over ribbon cable connectors (IDC type) in terms of individual contact replaceability and mechanical robustness, since each pin is soldered independently to the PCB, eliminating the risk of ribbon conductor fracture or intermittent ribbon-to-PCB connection. Unlike edge-card connectors, the 351-10-145-00-004101 does not require precise PCB edge tolerance control or edge-plating processes, reducing manufacturing cost and complexity. The 351-10-145-00-004101 is well-suited to parallel bus applications (up to 45 signals) on PCBs where connector real estate permits a linear header, but it lacks the space efficiency of edge connectors. For high-density backplane applications, ribbon connectors or miniature pitch connectors outperform the 351-10-145-00-004101; for moderate-bandwidth parallel buses and general I/O expansion, the 351-10-145-00-004101 provides superior reliability and serviceability.

What solder joint reliability and thermal fatigue characteristics should designers expect from the Preci-Dip 351-10-145-00-004101 in temperature-cycling environments?: The 351-10-145-00-004101 is rated for -55°C to 125°C operation, spanning a 180°C thermal window typical of industrial and automotive specifications. The contact post length (0.126" into the PCB plus 0.575" total overall) provides reasonable stress distribution during thermal cycling, reducing the risk of solder crack initiation compared to shorter post designs. However, the 0.1" pitch of the 351-10-145-00-004101 means thermal expansion mismatches between the brass contacts, PCT insulation, and copper PCB traces can introduce localized stress. Designs using the 351-10-145-00-004101 should employ lead-free solder (SAC305 or equivalent) with appropriate reflow profiles to ensure intermetallic layer control; BGA rework experience suggests 3–5 thermal cycles to -55°C/+125°C are typical acceptance thresholds. Vibration combined with thermal cycling accelerates fatigue—applications requiring >10 years MTBF should verify solder joint fatigue life through accelerated thermal cycling test data specific to the 351-10-145-00-004101 footprint geometry.

Is the Preci-Dip 351-10-145-00-004101 suitable for automated pick-and-place assembly, and what design considerations apply?: The 351-10-145-00-004101 is a through-hole component intended for wave soldering or selective soldering rather than reflow. Automated pick-and-place machines can position the 351-10-145-00-004101 with reasonable accuracy (±0.05" typical), but the connector must be mechanically secured (via adhesive or mechanical retention) during soldering to prevent floating or misalignment. The unshrouded 45-position design of the 351-10-145-00-004101 means vision system alignment can use the outer row edges as fiducials. For high-volume assembly, using solder paste masks designed for through-hole wave soldering is more reliable than attempting selective soldering on all 45 positions of the 351-10-145-00-004101. PCB-level handling and mechanical supports are necessary to prevent bending the leads of the 351-10-145-00-004101 during the assembly process, particularly the outer end contacts which experience highest mechanical stress.

What moisture and humidity ingress protection does the Preci-Dip 351-10-145-00-004101 provide, and when should conformal coating be considered?: The 351-10-145-00-004101 has Moisture Sensitivity Level (MSL) 1, meaning it requires no baking or special moisture conditioning prior to assembly—it can be stored indefinitely in standard warehouse conditions. However, MSL 1 classification applies to the component itself, not the assembled board. The unshrouded, open-contact design of the 351-10-145-00-004101 leaves the solder joints and PCB copper traces exposed to environmental moisture. In corrosive industrial environments (salt spray, humidity >80% RH continuous), conformal coating (acrylic or silicone) applied over the 351-10-145-00-004101 solder joints significantly extends reliability by preventing dendritic growth and corrosion bridging between adjacent 0.1" pitch leads. The PCT insulation material itself resists moisture absorption due to its glass-filled formulation, but the exposed solder interface remains the weak point. For indoor consumer or office environments, conformal coating is typically unnecessary; for outdoor or high-humidity applications, coating the 351-10-145-00-004101 and surrounding PCB area is recommended.

How many mating/unmating cycles can the Preci-Dip 351-10-145-00-004101 withstand before contact wear becomes unacceptable?: The 351-10-145-00-004101 is not typically specified with a mating cycle count (life expectancy in connect/disconnect operations). This is because the 351-10-145-00-004101 is designed for board-to-board interconnection or backplane applications where the connector is mated once during assembly and remains fixed. If the 351-10-145-00-004101 is used in field-replaceable module applications requiring repeated mating, the push-pull fastening mechanism provides mechanical durability comparable to industrial D-sub or similar connectors (typically >100 mating cycles before fastening wear becomes noticeable). The gold plating (10.0µin) on the mating contacts ensures contact resistance remains stable over repeated cycles, but the solder joints on the PCB side cannot withstand mechanical flexing from repeated mating without eventual fatigue failure. For applications requiring frequent disconnection, using a daughtercard with solder-on-edge connectors or a mezzanine-style socket adapter can isolate the 351-10-145-00-004101 soldered joints from mechanical stress.

What are the electromagnetic interference (EMI) and shielding considerations when using the Preci-Dip 351-10-145-00-004101 for mixed-signal applications?: The 351-10-145-00-004101 is an unshrouded, unshielded header with no integrated Faraday cage or EMI filtering. In mixed-signal applications mixing digital clocks, RF signals, and analog sensors, the 45 unshielded positions of the 351-10-145-00-004101 can act as radiators for conducted and radiated noise. To mitigate EMI effects, designers should (1) dedicate multiple adjacent positions on the 351-10-145-00-004101 to ground returns, spacing them evenly along the 45-position array to minimize loop areas; (2) route high-frequency signal traces (clock, RF) away from analog inputs in the PCB layer stack immediately under the 351-10-145-00-004101; and (3) consider adding a shielding can or Faraday cage around the mated connector region if the 351-10-145-00-004101 carries sensitive analog signals near digital switching edges. For EMC-regulated applications (CE, FCC), the unshrouded geometry of the 351-10-145-00-004101 may require additional PCB-level filtering or shielding design work compared to shielded connectors.

Can the Preci-Dip 351-10-145-00-004101 be soldered using lead-free solder, and what reflow parameters are recommended?: The 351-10-145-00-004101 is fully compatible with lead-free solder processes (SAC305, SAC405, or equivalent). The brass contacts and PCT insulation material have melting points well above the lead-free reflow peak temperature (~250°C for SAC alloys). For wave or selective soldering of the 351-10-145-00-004101, a solder temperature of 260°C ±5°C for 3–5 seconds ensures reliable wetting without damaging the gold plating or PCT insulation. Lead-free solder produces a more brittle intermetallic joint compared to lead-tin eutectic, so the mechanical stress distribution through the 351-10-145-00-004101 post geometry becomes more critical—ensure PCB copper pad design provides adequate stress relief at the solder fillet transition. Hand soldering of the 351-10-145-00-004101 is possible but tedious across 45 positions; selective or wave soldering is strongly recommended to ensure consistent joint quality across all contacts.

How should the PCB footprint for the Preci-Dip 351-10-145-00-004101 be designed to minimize solder bridging and ensure reliable manufacturing?: The 0.1" (2.54mm) pitch of the 351-10-145-00-004101 is prone to solder bridging between adjacent pads if PCB pad sizes or trace routing are not carefully controlled. Recommended PCB pad diameter is 0.040"–0.045" to accommodate the 0.032" nominal lead diameter of the 351-10-145-00-004101 with solder fillet clearance. Via placement should position at least one via per pad of the 351-10-145-00-004101, located ≥0.05" away from the solder pad edge, to prevent solder wicking and ensure controlled pad-to-trace thermal coupling. Wave soldering of the 351-10-145-00-004101 is improved by using a solder mask defined (SMD) design where the pad edge is just covered by solder mask, leaving a small opening at the lead entry point; this reduces solder bridging probability. For selective or manual soldering, staggering the 351-10-145-00-004101 leads slightly (±0.01" in depth on alternating groups of leads) can ease visual inspection and rework access. Test points should not be placed between adjacent positions of the 351-10-145-00-004101 to preserve board routing flexibility.

What is the expected lifespan of the gold plating on the Preci-Dip 351-10-145-00-004101 contacts in extended storage or shelf-life applications?: The 351-10-145-00-004101 features 10.0µin (0.25µm) gold plating over brass, a standard industrial specification. Gold plating of this thickness does not degrade significantly during storage under normal warehouse conditions (temperature 15–25°C, humidity 30–70% RH). However, shelf life is primarily limited by potential tarnishing of the underlying brass if the gold plating develops microporosity or is mechanically damaged. The RoHS3 and REACH compliance of the 351-10-145-00-004101 ensures the base brass material and gold plating meet environmental standards, with no lead or other restricted substances that could accelerate corrosion. For long-term storage (>5 years), storing the 351-10-145-00-004101 in sealed bags with desiccant or nitrogen purging prevents moisture-driven degradation of the brass substrate. Once soldered into a PCB, the 351-10-145-00-004101 solder joints and contact surfaces are protected from atmospheric corrosion by the conformal coat or potting compound, extending effective system life to 10–20 years in typical industrial environments.

Parts with Similar Specifications

The three parts on the right have similar specifications to Preci-Dip 351-10-145-00-004101

Product Attribute
Part Number	351-10-145-00-003101	351-10-145-00-005101	351-10-145-00-017101	351-10-144-00-005101
Manufacturer	Preci-Dip	Preci-Dip	Preci-Dip	Preci-Dip
Termination	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Features	-	-	-	Simultaneous Sampling
Current Rating (Amps)	-	-	-	-
Contact Length - Mating	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Number of Positions	-	-	-	-
Contact Finish - Mating	-	-	-	-
Ingress Protection	-	-	-	-
Pitch - Mating	-	-	-	-
Contact Material	-	-	-	-
Material Flammability Rating	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Insulation Material	-	-	-	-
Overall Contact Length	-	-	-	-
Fastening Type	-	-	-	-
Connector Type	-	-	-	-
Contact Finish - Post	-	-	-	-
Applications	-	-	-	-
Number of Positions Loaded	-	-	-	-
Insulation Height	-	-	-	-
Contact Shape	-	-	-	-
Row Spacing - Mating	-	-	-	-
Contact Length - Post	-	-	-	-
Mated Stacking Heights	-	-	-	-
Contact Finish Thickness - Mating	-	-	-	-
Voltage Rating	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Insulation Color	-	-	-	-
Style	-	-	-	-
Contact Finish Thickness - Post	-	-	-	-
Shrouding	-	-	-	-
Series	-	-	-	-
Contact Type	-	-	-	-
Number of Rows	-	-	-	-

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