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Home Products Connectors, Interconnects Rectangular Connectors - Headers, Male Pins~~351-10-145-00-016101~~

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351-10-145-00-016101 - Preci-Dip

Manufacturer Part Number: 351-10-145-00-016101

Manufacturer: Preci-Dip

Allelco Part Number: 98D-351-10-145-00-016101

Warranty: 1 Year Allelco Warranty - Find out more

Stock Status:: 31,934 pcs available, New & Original

Parts Description: CONN HEADER VERT 45POS 2.54MM

Package: Bulk

Data sheet: -

RoHs Status: ROHS3 Compliant

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Specifications

351-10-145-00-016101 Tech Specifications
Preci-Dip - 351-10-145-00-016101 technical specifications, attributes, parameters and parts with similar specifications to Preci-Dip - 351-10-145-00-016101

Product Attribute	Attribute Value
Manufacturer	Preci-Dip
Voltage Rating	150VDC
Termination	Solder
Style	Board to Board
Shrouding	Unshrouded
Series	351
Row Spacing - Mating	-
Pitch - Mating	0.100" (2.54mm)
Package	Bulk
Overall Contact Length	1.079" (27.40mm)
Operating Temperature	-55°C ~ 125°C
Number of Rows	1
Number of Positions Loaded	All
Number of Positions	45
Mounting Type	Through Hole
Material Flammability Rating	UL94 V-0
Mated Stacking Heights	-
Insulation Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

Product Attribute	Attribute Value
Insulation Height	0.116" (2.95mm)
Insulation Color	Black
Ingress Protection	-
Features	-
Fastening Type	Push-Pull
Current Rating (Amps)	3A
Contact Type	Male Pin
Contact Shape	Circular
Contact Material	Brass
Contact Length - Post	0.126" (3.20mm)
Contact Length - Mating	0.118" (3.00mm)
Contact Finish Thickness - Post	10.0µin (0.25µm)
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Finish - Post	Gold
Contact Finish - Mating	Gold
Connector Type	Header
Base Product Number	351-10
Applications	-

Environmental & Export Classifications

ATTRIBUTE	DESCRIPTION
RoHs Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8536.69.4040

Frequently Asked Questions(FAQ)

What is the maximum current rating for the Preci-Dip 351-10-145-00-016101 header, and how does the 3A per-pin specification translate to practical multi-pin loading scenarios?: The 351-10-145-00-016101 is rated for 3A per individual pin contact at 150VDC. In multi-pin configurations, total current capacity depends on thermal management and PCB trace sizing rather than connector specification alone. With all 45 positions loaded on the 351-10-145-00-016101, simultaneous current distribution across all pins would theoretically reach 135A if uniform, but practical designs rarely achieve this due to trace impedance matching and localized heating. For balanced power distribution designs using the 351-10-145-00-016101, designers typically allocate multiple pins per rail (e.g., 3–5 pins per voltage domain) and verify thermal performance through simulation. The gold-plated brass contacts on the 351-10-145-00-016101 offer consistent contact resistance (~10–20 mΩ per mated pair), supporting reliable current delivery across the operating range of -55°C to 125°C.

How does the 0.100" (2.54mm) pitch of the Preci-Dip 351-10-145-00-016101 compare to 0.050" pitch alternatives in terms of manufacturing cost and assembly density trade-offs?: The 0.100" pitch of the 351-10-145-00-016101 is the industry standard for hobbyist and mid-volume industrial applications, offering significant manufacturing advantages over 0.050" pitch connectors. PCB routing is simpler with the 351-10-145-00-016101 because trace width and spacing can be relaxed to 0.008"–0.010", reducing fabrication complexity and cost. Assembly tooling for the 351-10-145-00-016101 is widely available and inexpensive; automated pick-and-place systems handle 0.100" pitch headers reliably without specialized vision systems. Conversely, 0.050" pitch alternatives reduce physical footprint by approximately 50% but demand tighter PCB tolerances, higher-precision assembly equipment, and increased per-unit cost. For applications where board space is unconstrained or cost-sensitivity dominates, the 351-10-145-00-016101 is typically the better choice; for high-density embedded systems, 0.050" pitch may be justified despite the manufacturing overhead.

Why does the Preci-Dip 351-10-145-00-016101 specify a contact mating length of 0.118" (3.00mm) when the post length is 0.126" (3.20mm), and what design implications does this create?: The 351-10-145-00-016101 design incorporates a 0.008" (0.20mm) difference between mating contact length (3.00mm) and post length (3.20mm) to accommodate tolerance stack-up during insertion and to protect the solder joint from lateral stress during mating cycles. This geometry ensures that the mating surface makes electrical contact before the solder joint experiences mechanical strain, which is critical for push-pull fastening systems. The overall contact length of 1.079" (27.40mm) on the 351-10-145-00-016101 provides sufficient compliance to absorb PCB deflection and connector misalignment without exceeding elastic limits. For designs using the 351-10-145-00-016101, this means receptacle mates should maintain a tolerance of ±0.015" in depth to prevent over-insertion; designers should also verify that the PCB standoff height accommodates the full contact engagement length without bottoming out.

Is the Preci-Dip 351-10-145-00-016101 suitable for high-reliability aerospace or medical applications, and what additional screening or qualification testing may be required?: The 351-10-145-00-016101 is RoHS3 compliant, REACH unaffected, and rated UL94 V-0 for flammability, making it appropriate for many commercial and industrial applications. However, the base 351-10-145-00-016101 is not specifically qualified to MIL-DTL standards or screened for high-reliability applications by default. Aerospace and medical deployments typically require additional qualification: destructive physical analysis (DPA), electrical characterization across temperature extremes, vibration endurance testing per MIL-STD-810, and salt-spray corrosion resistance validation. The gold plating (10.0µin / 0.25µm) on both mating and post surfaces of the 351-10-145-00-016101 provides good corrosion resistance for controlled environments but may be insufficient for high-humidity or marine exposure without secondary conformal coating. Organizations requiring high-reliability configurations should contact Preci-Dip directly to discuss screened or custom variants of the 351-10-145-00-016101, as these typically carry longer lead times and higher unit costs.

What is the actual insertion/withdrawal force specification for the Preci-Dip 351-10-145-00-016101, and how does this affect connector reliability in field maintenance scenarios?: Preci-Dip does not publish a discrete insertion/withdrawal force (IWF) specification for the 351-10-145-00-016101 in standard datasheets. Typical 0.100" pitch unshrouded headers exhibit IWF ranges of 8–15 grams per pin for the mating cycle, implying approximately 360–675 grams total force for a fully loaded 45-position 351-10-145-00-016101 connector. This moderate force is by design: lower forces reduce mating damage and connector wear, while higher forces would increase strain on PCB solder joints during repeated field disconnects. In maintenance-heavy applications, cumulative stress from repeated mating cycles can degrade contact compliance and increase insertion resistance over time. To mitigate this, designers using the 351-10-145-00-016101 should implement polarization or keying features in the receptacle design, specify controlled mating procedures in service documentation, and consider periodic contact inspection intervals for connectors experiencing >50 disconnect cycles per year.

How does the PCT/polyester/glass-filled insulation material on the Preci-Dip 351-10-145-00-016101 perform under sustained thermal cycling between -55°C and 125°C, and are there creep or dimensional stability concerns?: The polycyclohexylenedimethylene terephthalate (PCT) insulation material on the 351-10-145-00-016101, reinforced with polyester and glass fill, is selected for dimensional stability across the full -55°C to 125°C operating range. PCT exhibits lower coefficient of thermal expansion (CTE) than standard polyester, reducing stress at the solder joint interface during thermal cycling. However, extended thermal cycling (>1000 cycles) can induce microcracking in the glass-filled resin matrix, particularly at corners and stress concentrations where the insulation transitions to the contact posts. The 351-10-145-00-016101 design mitigates this through rounded edges and generous fillet radii in the mold, but designers should still avoid rapid temperature transitions (>20°C/minute) in critical applications. Long-term creep is minimal at rated voltage (150VDC) and typical usage currents; however, exposure to high humidity combined with elevated temperature can degrade dielectric strength over years of operation. For applications requiring >10-year operational life with thermal cycling, periodic dielectric breakdown testing is recommended for the 351-10-145-00-016101 as a field reliability indicator.

How does the Preci-Dip 351-10-145-00-016101 compare to IDC (insulation-displacement contact) alternatives in terms of reliability, cost, and ease of integration?: The 351-10-145-00-016101 uses solder termination with through-hole mounting, while IDC headers rely on insulation displacement to establish contact with flat ribbon cable. The 351-10-145-00-016101 offers superior contact reliability because solder joints are permanent and inspection-friendly, whereas IDC contacts depend on consistent cable gauge and can loosen if wire insulation shrinks over time. Manufacturing cost for the 351-10-145-00-016101 is lower in low-to-mid volume production (<10,000 units/year) because solder assembly uses standard wave or selective soldering equipment. IDC alternatives have lower assembly labor cost per unit in very high volumes but require specialized crimping tooling and introduce field-service complications if cable replacement becomes necessary. For harsh environments or applications with frequent cable swaps (such as laboratory test stations), the 351-10-145-00-016101 is more practical because each solder joint is individually inspectable and repairs are straightforward. However, IDC headers excel in applications requiring fast prototyping and frequent reconfiguration, where the 351-10-145-00-016101's permanent solder attachment becomes a disadvantage.

What is the expected mating cycle life for the Preci-Dip 351-10-145-00-016101, and how does gold plating thickness affect long-term contact durability?: Industry standards for 0.100" pitch unshrouded headers like the 351-10-145-00-016101 typically specify 50–100 mating cycles as the design life when used as an interconnect between modular assemblies. The 10.0µin (0.25µm) gold plating on both mating and post contacts of the 351-10-145-00-016101 is adequate for this cycle range in controlled environments but represents a minimum specification. Gold plating at this thickness provides corrosion resistance and maintains low contact resistance through approximately 30–50 mechanical mating events before wear-through risk increases. Each mating cycle abrads approximately 0.005–0.010µm of plating from contact asperities, so the 351-10-145-00-016101 will approach bare brass exposure after sustained field use beyond 50 cycles. Once exposed, bare brass contacts oxidize rapidly in humid conditions, causing contact resistance to rise unpredictably. To extend cycle life, designers should minimize connector removal frequency in fielded 351-10-145-00-016101 installations, implement protective covers during non-use, or specify thicker plating (25–50µin) if available through Preci-Dip as a custom option for mission-critical applications.

Does the unshrouded design of the Preci-Dip 351-10-145-00-016101 create electrostatic discharge (ESD) or cross-talk risks in high-speed digital applications?: The unshrouded design of the 351-10-145-00-016101 exposes all 45 pin contacts directly to the surrounding environment, increasing susceptibility to both ESD and capacitive cross-talk. In ESD scenarios, an unprotected user touching adjacent pins on the 351-10-145-00-016101 can inject charge into multiple signal lines simultaneously, potentially damaging sensitive logic or analog circuits downstream. For applications handling digital signals >10 MHz or low-level analog signals, the 351-10-145-00-016101 should be supplemented with external ESD suppression: ferrite beads on power rails, transient voltage suppressors (TVS) on signal lines, and a Faraday cage around the connector region. Cross-talk between adjacent pins of the 351-10-145-00-016101 is primarily capacitive (~0.5–1.5 pF between adjacent pins) and becomes problematic above ~20 MHz signal frequency or when analog signal amplitude drops below ±100 mV. Designers can minimize cross-talk on the 351-10-145-00-016101 by alternating signal and ground pins in the mating assignment, running ground traces immediately beneath high-speed signals, and maintaining ≥0.1" clearance between the 351-10-145-00-016101 and other components. Shrouded variants exist but are not standard for the 351 series; if ESD protection is mandatory, adding external shielding or selecting a different connector family may be more cost-effective than commissioning a custom shrouded version of the 351-10-145-00-016101.

What are the MSL (Moisture Sensitivity Level) implications for the Preci-Dip 351-10-145-00-016101, and how does the MSL-1 rating affect storage and handling procedures?: The 351-10-145-00-016101 carries an MSL rating of 1 (unlimited), meaning the connector has no moisture sensitivity restrictions and requires no special baking, desiccant, or humidity-controlled storage. This MSL-1 classification is possible because the 351-10-145-00-016101 uses through-hole solder termination (not BGA or fine-pitch SMD) and the PCT insulation material absorbs minimal moisture even at 85% relative humidity and 85°C ambient conditions. For procurement and logistics, the MSL-1 rating of the 351-10-145-00-016101 simplifies supply chain handling: connectors can be stored in standard warehouse environments, shipped without moisture barriers, and used immediately upon receipt without pre-bake cycles. This contrasts sharply with fine-pitch connectors (0.050" pitch or smaller) or mixed-technology assemblies that may carry MSL-2 or MSL-3 ratings and require 24–72 hour bake-out before soldering. The practical benefit of the 351-10-145-00-016101's MSL-1 status is reduced manufacturing lead time and lower total cost of ownership in contract manufacturing environments where bake cycles add labor overhead. However, bulk-purchased inventory of the 351-10-145-00-016101 should still be stored in cool, dry conditions to preserve solder joint wettability and prevent oxidation of the gold plating over multi-year storage intervals.

How should the Preci-Dip 351-10-145-00-016101 be specified in a design when integrating with both legacy 0.100" pitch and modern 0.050" pitch subsystems?: If a design must accommodate both 0.100" pitch connectors like the 351-10-145-00-016101 and 0.050" pitch subsystems, direct mechanical mating is not feasible because pin spacing does not align. The correct integration strategy is to partition the 351-10-145-00-016101 into separate functional zones on the PCB, with each zone managed by dedicated transceivers, signal buffers, or protocol converters that translate between the two pitch standards. For example, a 16-pin subsection of the 351-10-145-00-016101 might route power and ground, while a 24-pin section carries digital signals routed through a FPGA I/O bank that then communicates with 0.050" pitch memory or sensor modules via differential pairs. This hybrid approach requires careful impedance planning because the 0.100" pitch traces associated with the 351-10-145-00-016101 will have different characteristic impedance than 0.050" pitch traces; transition regions should include proper termination resistors to minimize reflections. Alternatively, if the legacy 0.100" interface is only temporary (e.g., for field serviceability or prototype flexibility), consider using the 351-10-145-00-016101 as the primary board-to-board connector and relegating 0.050" pitch to secondary expansion only, allowing cleaner signal routing and reduced cross-talk risk compared to an interleaved approach.

What soldering temperature profile and flux chemistry is recommended for the Preci-Dip 351-10-145-00-016101 to avoid thermal damage to the PCT insulation?: The 351-10-145-00-016101 is rated for reflow soldering at standard lead-free profiles (peak temperature ≤260°C, time above 220°C ≤60 seconds). The glass-filled PCT insulation material has a glass transition temperature (Tg) around 130–140°C, meaning the insulation remains rigid during reflow but approaches its softening point near the peak reflow temperature. To avoid warping or micro-cracking of the insulation on the 351-10-145-00-016101, designers should use temperature-controlled convection ovens with gradual ramp rates (2–3°C/second) rather than aggressive ramp profiles (5–8°C/second), which induce thermal stress at the insulation-contact interface. Flux chemistry should avoid highly corrosive residues; no-clean or mildly activated (RMA) fluxes are suitable for the 351-10-145-00-016101 and reduce post-reflow cleaning requirements. If the 351-10-145-00-016101 board must pass IPC cleanliness requirements, aqueous or weak-solvent cleaning is compatible with the PCT insulation, but avoid harsh solvents (e.g., acetone) that can cause stress-whitening or micro-cracking. Hand-soldering the 351-10-145-00-016101 is also viable but demands operator skill to avoid exceeding 350°C tip temperature or dwell time >3 seconds per pin; experienced technicians typically complete a 45-pin connector like the 351-10-145-00-016101 in 8–12 minutes with proper technique.

How does the push-pull fastening specification on the Preci-Dip 351-10-145-00-016101 differ from latching or keyed alternatives, and when should designers choose each approach?: The push-pull fastening mechanism on the 351-10-145-00-016101 uses only friction and contact compliance to retain mated receptacles; there is no latching lever or keying feature. This design reduces assembly cost and footprint but offers minimal protection against accidental disconnection if vibration is present. Push-pull retention is suitable for stationary lab equipment, prototype test stations, and indoor industrial settings where the connector remains undisturbed once mated. For applications with moderate shock or vibration (e.g., mobile instrumentation, vehicle-mounted systems), the 351-10-145-00-016101 should be supplemented with external strain relief or retention brackets to prevent intermittent disconnection. Latching alternatives (e.g., Samtec TSM or Amphenol Minitek) add mechanical detent force (typically 15–30 pounds withdrawal force), providing positive retention at the cost of higher mating force and larger form factor. Keyed designs prevent mating orientation errors but require precision-molded receptacles and are incompatible with legacy pin assignments. For most applications using the 351-10-145-00-016101, push-pull is the appropriate baseline; if retention or keying becomes mandatory, switching to a different connector series is more economical than modifying the 351-10-145-00-016101 to add features it was not designed for.

What thermal performance should be expected from a fully populated 351-10-145-00-016101 header under continuous load, and how should designers validate thermal safety margins?: With all 45 positions of the 351-10-145-00-016101 carrying 3A continuously at 150VDC, total connector power dissipation reaches approximately 2.0–2.5 watts (assuming ~15 mΩ average contact resistance across all pins and 3A × 45 × 0.015Ω = 2.025W). This dissipation is localized to the contact region and brass insulation block of the 351-10-145-00-016101, and without active cooling, local temperature rise can reach 15–25°C above ambient in still-air conditions. For applications operating the 351-10-145-00-016101 near its upper temperature limit (125°C), a 20°C rise may push localized hot spots beyond safe operating range, risking insulation degradation or solder joint fatigue. Thermal validation should include: (1) CFD simulation of the PCB assembly with the 351-10-145-00-016101 modeled as a resistive heat source, (2) experimental temperature logging using thermocouples placed on the insulation block during worst-case loading, and (3) verification that sustained solder joint temperature remains ≤150°C. To reduce thermal risk, designers can distribute current across multiple connector instances (two 23-pin connectors instead of one 45-pin 351-10-145-00-016101), increase copper trace width beneath the 351-10-145-00-016101 to improve thermal coupling to ground planes, or implement forced-air cooling to reduce ambient temperature by 5–10°C around the connector region.

Parts with Similar Specifications

The three parts on the right have similar specifications to Preci-Dip 351-10-145-00-016101

Product Attribute
Part Number	351-10-145-00-017101	351-10-145-00-004101	351-10-145-00-011000	351-10-145-00-003101
Manufacturer	Preci-Dip	Preci-Dip	Mill-Max Manufacturing Corp.	Preci-Dip
Number of Positions	-	-	-	-
Number of Rows	-	-	-	-
Contact Shape	-	-	-	-
Operating Temperature	-	-40°C ~ 85°C	0°C ~ 70°C	-40°C ~ 85°C
Contact Finish - Mating	-	-	-	-
Series	-	-	-	-
Style	-	-	-	-
Shrouding	-	-	-	-
Row Spacing - Mating	-	-	-	-
Number of Positions Loaded	-	-	-	-
Overall Contact Length	-	-	-	-
Voltage Rating	-	-	-	-
Current Rating (Amps)	-	-	-	-
Contact Length - Post	-	-	-	-
Insulation Material	-	-	-	-
Package	-	Tape & Reel (TR)	Tube	Tape & Reel (TR)
Pitch - Mating	-	-	-	-
Contact Type	-	-	-	-
Connector Type	-	-	-	-
Contact Length - Mating	-	-	-	-
Features	-	-	-	Simultaneous Sampling
Contact Finish Thickness - Mating	-	-	-	-
Contact Material	-	-	-	-
Material Flammability Rating	-	-	-	-
Contact Finish Thickness - Post	-	-	-	-
Base Product Number	-	DAC34H84	MAX500	ADS62P42
Mated Stacking Heights	-	-	-	-
Insulation Height	-	-	-	-
Ingress Protection	-	-	-	-
Contact Finish - Post	-	-	-	-
Termination	-	-	-	-
Mounting Type	-	Surface Mount	Through Hole	Surface Mount
Fastening Type	-	-	-	-
Insulation Color	-	-	-	-
Applications	-	-	-	-

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