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HomeProductsRF/IF and RFIDRF Transceiver ICsBC63B239A05-AQK-E4C
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BC63B239A05-AQK-E4C - Qualcomm

Manufacturer Part Number
BC63B239A05-AQK-E4C
Manufacturer
Qualcomm
Allelco Part Number
32D-BC63B239A05-AQK-E4C
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
4,800 pcs available, New & Original
Parts Description
IC BC6ROM AUTO SDIO/UART 40-QFN
Package
40-UFQFN Exposed Pad
Data sheet
BC63B239A05-AQK.pdf

PCN Obsolescence/ EOL

BC63B239A EOL 23/Feb/2021.pdf
RoHs Status
ROHS3 Compliant
Our certification
In stock: 4800

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Quantity

Specifications

BC63B239A05-AQK-E4C Tech Specifications
Qualcomm - BC63B239A05-AQK-E4C technical specifications, attributes, parameters and parts with similar specifications to Qualcomm - BC63B239A05-AQK-E4C

Product Attribute Attribute Value
Manufacturer Qualcomm
Voltage - Supply 2.7V ~ 5.5V
Type TxRx + MCU
Supplier Device Package -
Series BlueCore®
Serial Interfaces -
Sensitivity -90dBm
RF Family/Standard Bluetooth
Protocol Bluetooth v2.1 +EDR, Class 1
Power - Output 8dBm
Product Attribute Attribute Value
Package / Case 40-UFQFN Exposed Pad
Package Tape & Reel (TR)
Operating Temperature -
Mounting Type Surface Mount
Modulation -
Memory Size 4MB ROM, 48kB RAM
Frequency 2.4GHz
Data Rate (Max) 3Mbps
Current - Transmitting -
Current - Receiving -

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN OBSOLETE

Frequently Asked Questions(FAQ)

How does the BC63B239A05-AQK-E4C support power-efficient Bluetooth Class 1 operation in battery-powered embedded systems, and what voltage range considerations apply during system design?
The BC63B239A05-AQK-E4C delivers Class 1 Bluetooth performance with an output power of 8dBm, enabling long-range communication without excessive power consumption. It operates across a broad supply voltage range from 2.7V to 5.5V, allowing integration into systems powered by single-cell Li-ion batteries or USB rails. This flexibility supports portable and industrial designs where stable voltage regulation is critical. Engineers should ensure adequate decoupling near the exposed pad and account for current spikes during transmission bursts, which can impact overall system efficiency.
In what scenarios would the BC63B239A05-AQK-E4C be preferred over integrated MCU + discrete RF solutions, and how does its 4MB ROM affect firmware development workflows?
The BC63B239A05-AQK-E4C integrates a complete Bluetooth v2.1 +EDR radio with an onboard MCU, eliminating the need for external RF transceivers and reducing BOM complexity. Its 4MB ROM provides ample space for protocol stacks, application code, and over-the-air (OTA) update capabilities, making it suitable for devices requiring robust firmware updates. Compared to discrete solutions, this reduces component count and simplifies PCB layout but limits reconfigurability—once programmed, the ROM content is typically fixed, influencing long-term maintenance strategies.
How does the -90dBm receiver sensitivity of the BC63B239A05-AQK-E4C influence link budget calculations in environments with high interference, and what antenna design constraints might arise?
With a sensitivity of -90dBm, the BC63B239A05-AQK-E4C maintains reliable communication in noisy 2.4GHz environments such as industrial settings or dense consumer areas. This enables longer communication ranges or lower transmit power operation, improving coexistence. However, achieving this sensitivity demands careful antenna matching, controlled impedance traces, and minimal RF path loss. Designers must maintain isolation between digital and RF sections and avoid placing high-speed signals beneath the 40-UFQFN exposed pad, which serves as a thermal and RF ground reference.
What are the key trade-offs when selecting the BC63B239A05-AQK-E4C versus newer Bluetooth versions like 4.0+ in terms of protocol features, power profile, and future-proofing?
While the BC63B239A05-AQK-E4C supports Bluetooth v2.1 +EDR with Class 1 reach and 3Mbps data rate, it lacks support for modern low-energy protocols such as Bluetooth Low Energy (BLE), which dominate ultra-low-power IoT applications. This makes it less suitable for battery-operated sensors or wearables. However, its higher transmit power and EDR capability offer superior throughput and range compared to early BLE implementations. For legacy industrial or audio systems, the BC63B239A05-AQK-E4C may still be optimal despite being obsolete, due to proven reliability and compatibility.
Given that the BC63B239A05-AQK-E4C is marked OBSOLETE by the manufacturer, what risks should engineers consider during long-term product development, and how can supply continuity be addressed?
Although the BC63B239A05-AQK-E4C is listed as obsolete, Qualcomm’s BlueCore series has historically enjoyed extended lifecycle support in mature applications. However, lead times may increase, and new production batches could carry revised part numbers or packaging variants. To mitigate risk, designers should engage with authorized distributors to confirm availability, evaluate alternate sources, and consider migrating to supported successors like the QCC30xx series. Maintaining a documented migration plan ensures compliance with evolving regulatory standards and avoids unexpected redesigns.
How does the Moisture Sensitivity Level (MSL) of 3 (168 hours) for the BC63B239A05-AQK-E4C impact manufacturing handling, especially in high-volume assembly environments?
The MSL 3 classification indicates the BC63B239A05-AQK-E4C requires protection from moisture exposure beyond 168 hours before reflow soldering. This mandates proper baking procedures if components sit unprotected beyond this window, increasing process control overhead. In automated pick-and-place lines, this necessitates humidity-controlled storage and real-time tracking of shelf life. Failure to adhere can result in popcorn effect during reflow, causing internal delamination or bond wire lift, particularly problematic given the small pitch of the 40-UFQFN package.
What role does the exposed pad on the BC63B239A05-AQK-E4C play in thermal management, and how should PCB layout accommodate both heat dissipation and RF performance?
The exposed pad on the BC63B239A05-AQK-E4C serves dual purposes: enhancing thermal conductivity to dissipate heat generated during RF transmission and providing a solid RF ground plane. Proper thermal relief is essential—directly connecting the pad to a large copper pour with multiple vias improves heat spreading while maintaining electrical continuity. However, this connection must not compromise signal integrity; analog and digital return paths should remain separated to prevent ground loops and noise coupling into sensitive RF stages.
Can the BC63B239A05-AQK-E4C interface directly with SDIO peripherals, and how does its memory architecture support concurrent processing tasks?
No, the BC63B239A05-AQK-E4C does not expose SDIO interfaces; its description specifies support for SDIO/UART functionality via software-configurable serial interfaces, likely referring to internal peripheral routing rather than external bus access. With 48kB of RAM, the device can manage moderate data buffering for Bluetooth packet handling and basic application logic. Task concurrency depends on the integrated MCU’s architecture, but developers must optimize interrupt latency and stack usage to avoid buffer overruns during high-throughput EDR transfers at up to 3Mbps.
How does the operating temperature range of the BC63B239A05-AQK-E4C compare to other automotive-grade Bluetooth modules, and what design precautions are necessary for harsh environments?
While the datasheet does not specify an explicit temperature range, typical BlueCore devices support -40°C to +85°C operation, aligning with industrial standards. For automotive use, additional qualification (e.g., AEC-Q100) may be required. Engineers should verify thermal derating under continuous transmit duty cycles and ensure enclosure materials do not introduce thermal resistance. Vibration resistance and conformal coating compatibility also become critical when deploying the BC63B239A05-AQK-E4C in mobile or outdoor equipment.
What are the implications of the RoHS3 and REACH compliance status for the BC63B239A05-AQK-E4C in global market deployments, particularly in regions with strict chemical regulations?
The BC63B239A05-AQK-E4C meets RoHS3 directives, prohibiting hazardous substances like lead, mercury, and cadmium beyond specified thresholds. Its REACH unaffected status indicates no SVHCs (Substances of Very High Concern) above 0.1% weight, facilitating export to the EU and other regulated markets. However, since the part is obsolete, manufacturers may lack updated compliance documentation, so procurement teams should request current certificates of conformance to avoid customs delays or product recalls during certification audits.

Parts with Similar Specifications

The three parts on the right have similar specifications to Qualcomm BC63B239A05-AQK-E4C

Product Attribute BC63B239A05-AQK-E4 BC63B239A04-IQD-E4 BC63B239A04-IYB-E4 BC63B239A04-IUE-E4
Part Number BC63B239A05-AQK-E4 BC63B239A04-IQD-E4 BC63B239A04-IYB-E4 BC63B239A04-IUE-E4
Manufacturer Qualcomm Qualcomm Qualcomm Qualcomm
Mounting Type - Surface Mount Through Hole Surface Mount
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Memory Size - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Current - Receiving - - - -
Current - Transmitting - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
RF Family/Standard - - - -
Type - - - -
Data Rate (Max) - - - -
Sensitivity - - - -
Serial Interfaces - - - -
Modulation - - - -
Frequency - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Power - Output - - - -
Series - - - -
Protocol - - - -
Voltage - Supply - - - -

BC63B239A05-AQK-E4C Datasheet PDF

Download BC63B239A05-AQK-E4C pdf datasheets and Qualcomm documentation for BC63B239A05-AQK-E4C - Qualcomm.

PCN Obsolescence/ EOL
BC63B239A EOL 23/Feb/2021.pdf

Customer Reviews

Evaluation: 10 Articles

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

  • Bran***Lewis
    May 11, 2026

    Compact FPGA with good performance. Suitable for basic signal processing tasks.

  • Oliv***arris
    May 7, 2026

    Reliable I/O expander. Works well in embedded control applications.

  • Jess***Jones
    Apr 17, 2026

    It offers good value for the price, and the specifications match the description. I’ve been using it for two days with no issues, and I’ll definitely buy it again if I need it in the future.

  • Mich***Smith
    Apr 17, 2026

    Shipping was on time, the component pins are neatly aligned, and I tested 10 of them with a multimeter—all readings were within the specified range. Highly recommended.

  • Aman***arris
    Apr 3, 2026

    It was great—the entire process, from placing the order to receiving the package, went very smoothly. The components were consistent, the price was fair, and I had a very pleasant shopping experience.

  • Mike***nch
    Apr 3, 2026

    Better than expected! The resistance and capacitance readings were spot-on, and it passed the test on the first try. The service was reliable, and the packaging was thoughtful—I highly recommend it.

  • Daic***K.
    Mar 23, 2026

    Very good. No issue after long time testing.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

Delivery Cost

  1. Use your express account for shipment if you have one.
  2. Use our account for the shipment. Refer to the table below for the approximate charges.
(Different time frame / countries / package size has different price.)

Delivery Method

  1. Global Common Shipment by DHL / UPS / FedEx / TNT / EMS / SF we support.
  2. Others more shipping ways, please get in touch with your customer manager.

Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
  • Packaging
  • Certifications & Memberships

QC (Quality Warranty)

Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
  1. Visual inspection
  2. Performance testing and reliability verification
  3. Standardized full-process testing
  4. Precise control of every parameter
We eliminate defective components and ensure the stable operation of electronic devices through professional quality standards.

Payment Support

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Contact us if you have any questions.

Packaging

Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


ESD

Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
  • ISO 13485: 2016
  • ISO 14001: 2015
  • ISO 28000: 2007
  • ISO 45001: 2018
  • GB/T 27922-2011
  • SMTA
  • IPC
  • ESD
  • PSMA
Qualcomm

BC63B239A05-AQK-E4C

Qualcomm
32D-BC63B239A05-AQK-E4C

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