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HomeProductsIntegrated Circuits (ICs)Memory70V9269S9PRF8
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70V9269S9PRF8 - Renesas Electronics America Inc

Manufacturer Part Number
70V9269S9PRF8
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-70V9269S9PRF8
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
13,825 pcs available, New & Original
Parts Description
IC SRAM 256KBIT PARALLEL 128TQFP
Package
128-TQFP (14x20)
Data sheet
70V9269S9PRF8.pdf

HTML Datasheet

IDT Suffixes.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf
RoHs Status
 
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Specifications

70V9269S9PRF8 Tech Specifications
Renesas Electronics America Inc - 70V9269S9PRF8 technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - 70V9269S9PRF8

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Write Cycle Time - Word, Page -
Voltage - Supply 3V ~ 3.6V
Technology SRAM - Dual Port, Synchronous
Supplier Device Package 128-TQFP (14x20)
Series -
Package / Case 128-LQFP
Package Tape & Reel (TR)
Operating Temperature 0°C ~ 70°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 256Kbit
Memory Organization 16K x 16
Memory Interface Parallel
Memory Format SRAM
Base Product Number 70V9269
Access Time 9 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8542.32.0041

Frequently Asked Questions(FAQ)

What is the operating temperature range for the 70V9269S9PRF8 SRAM, and how does this impact reliability in industrial applications?
The 70V9269S9PRF8 operates over a commercial temperature range from 0°C to 70°C. This limits its suitability for extreme environments such as automotive or aerospace systems requiring wider thermal tolerance. For industrial control systems exposed to ambient heating or enclosed enclosures, the upper limit of 70°C may necessitate careful thermal management or derating to ensure long-term data retention and signal integrity.
How does the access time of the 70V9269S9PRF8 compare to other synchronous SRAMs in the same package size, and what are the implications for real-time system design?
With an access time of 55 ns, the 70V9269S9PRF8 offers moderate performance typical of standard-speed synchronous SRAMs. When compared to faster variants (e.g., 45 ns) or lower-power designs, it trades speed for power efficiency and cost. In real-time systems where deterministic timing is critical—such as motor controllers or communication buffers—this access time may require longer wait states or pipeline adjustments to maintain throughput.
What is the standby current consumption of the 70V9269S9PRF8, and how does it affect battery life in portable instrumentation?
The 70V9269S9PRF8 draws 25 µA during standby mode. While relatively low for SRAM, this current accumulates over time in battery-powered devices with persistent memory requirements. For a typical 3.3V supply and 24-hour operation with intermittent activity, this leakage contributes significantly to total energy use, potentially reducing battery life by several hours unless managed via power gating or sleep modes.
Can the 70V9269S9PRF8 be used in parallel configurations for higher bandwidth applications, and what design considerations apply?
Yes, multiple 70V9269S9PRF8 devices can be paralleled to increase data bus width and effective bandwidth. However, this requires careful attention to address decoding, bus contention prevention, and timing skew between chips. Additionally, the combined I/O load increases capacitance, potentially degrading signal rise times and violating setup/hold margins unless controlled via buffer stages or reduced drive strength settings.
What voltage levels does the 70V9269S9PRF8 support, and how should level shifting be handled when interfacing with mixed-voltage systems?
The 70V9269S9PRF8 operates at a nominal 3.3V core voltage with a maximum absolute rating of 3.6V. Direct connection to 5V logic without protection risks damaging the device. Level shifters or resistive divider networks must be employed to ensure input voltages remain below 3.6V. Careful attention to output high-level thresholds ensures proper recognition by downstream 3.3V or 5V receivers.
How does the package type of the 70V9269S9PRF8 influence PCB layout complexity and routing density?
The 128-pin TQFP (14x20 mm) package offers high pin count but moderate footprint, suitable for compact designs. However, routing all 128 signals demands dense interconnect layers and precise impedance control, especially for clock and data lines. Thermal vias under the body help dissipate heat, but solder joint reliability under vibration remains a concern, requiring robust pad design and reflow profiles.
Is the 70V9269S9PRF8 suitable for direct replacement of asynchronous SRAMs in legacy designs, and what interface modifications are needed?
No, the 70V9269S9PRF8 is synchronous and requires a clocked interface, unlike asynchronous SRAMs. Replacing a legacy part demands redesigning the memory controller to generate appropriate clock, chip selects, and write enables. Timing constraints also change; for example, data must be stable on both rising and falling edges depending on mode, increasing synchronization complexity compared to edge-triggered asynchronous behavior.
What is the significance of the 'S9' suffix in the 70V9269S9PRF8 model number, and how does it affect procurement and traceability?
The 'S9' typically denotes a specific revision or quality grade within Renesas’ SRAM family, possibly indicating enhanced ESD protection, improved yield, or updated test criteria. This affects procurement strategy, as different revisions may have varying lead times or qualification status. Engineers must verify compatibility with existing firmware and ensure supply continuity across revisions to avoid unplanned redesigns.
How does the 70V9269S9PRF8 handle write protection, and what safeguards exist against accidental overwrites?
The 70V9269S9PRF8 includes WE# (Write Enable) and OE# (Output Enable) pins that allow software-controlled read/write operations. There is no hardware write-protect pin, so protection relies entirely on correct assertion of WE#. In safety-critical systems, external latches or microcontroller logic must enforce write enable conditions only during authorized windows to prevent corruption.
What are the typical applications for the 70V9269S9PRF8, and how do they leverage its synchronous interface?
Common applications include digital signal processing buffers, FPGA configuration memory, and embedded controller scratchpads. Its synchronous interface allows tight integration with microcontrollers and FPGAs using standard buses like SPI or parallel interfaces synchronized to a common clock. This enables predictable data transfer rates and simplifies real-time scheduling compared to asynchronous counterparts.
How does the 70V9269S9PRF8 compare to DRAM alternatives in terms of access latency and refresh overhead?
Unlike DRAM, the 70V9269S9PRF8 has zero refresh overhead and consistent 55 ns access time, making it ideal for applications requiring deterministic response. DRAM would introduce variable latency due to refresh cycles and page misses, especially at higher densities. For caching or instruction storage in time-sensitive systems, the SRAM’s static nature avoids these penalties.
What precautions should be taken during soldering and rework of the 70V9269S9PRF8 due to its package characteristics?
As a plastic TQFP, the 70V9269S9PRF8 is sensitive to thermal stress. Excessive peak temperatures (>260°C) or prolonged exposure during reflow can degrade bond wires or delaminate the die attach. Rework stations should limit dwell time and use active cooling. Conformal coating after assembly may improve resistance to mechanical shock, which is beneficial given the large body size relative to pin pitch.
Can the 70V9269S9PRF8 operate reliably in environments with high electromagnetic interference, and what layout practices enhance robustness?
While not specifically designed for automotive EMI standards, the 70V9269S9PRF8 benefits from standard decoupling practices. Placing 0.1 µF capacitors close to VCC/GND pads reduces susceptibility. Routing data lines away from switching power supplies and using ground planes beneath the package improve noise immunity. Shielding enclosures may be necessary in harsh RF environments to prevent coupling into high-impedance nodes.
What is the expected lifetime of the 70V9269S9PRF8 under continuous operation, and how does data retention relate to temperature?
Under normal conditions, the 70V9269S9PRF8 provides 10-year data retention at 70°C. However, this assumes stable voltage and absence of cosmic ray events. At elevated temperatures, retention degrades exponentially per Arrhenius model. For mission-critical systems, periodic background refresh or ECC augmentation may be warranted despite the non-volatile advantage of SRAM.
How does the power-up sequence affect the 70V9269S9PRF8 initialization, and what startup delays must be accounted for?
The 70V9269S9PRF8 begins operation after VCC reaches valid levels and stabilizes above the minimum threshold. A typical 1 ms delay is recommended before asserting control signals to allow internal circuits to stabilize. Failure to observe this can result in undefined outputs or failed writes, particularly if clocks are enabled prematurely during power ramp-up.
Is parity or error detection supported by the 70V9269S9PRF8, and how does this influence system-level fault tolerance?
The 70V9269S9PRF8 does not include built-in parity or ECC. Therefore, single-bit errors can corrupt data silently. In applications like medical devices or avionics, external logic or redundant storage schemes must be implemented to detect or correct faults. This adds complexity but preserves the SRAM’s speed advantages over error-corrected DRAM solutions.
What are the key differences between the 70V9269S9PRF8 and similar-density asynchronous SRAMs in terms of pin compatibility and timing budgets?
Pin-for-pin, the 70V9269S9PRF8 may share some signals with asynchronous parts, but critical differences lie in timing. Asynchronous SRAMs often allow tAA < tOH, whereas the synchronous 70V9269S9PRF8 enforces strict setup/hold times around the clock edge. This reduces flexibility in clock stretching but improves predictability. Designers must recalculate timing budgets to accommodate clock alignment rather than relying on asynchronous handshake protocols.
How does the bag-packaging format impact handling and storage of bulk quantities of 70V9269S9PRF8 components?
Bag-packed delivery suits automated pick-and-place systems and minimizes electrostatic discharge risk when used with conductive foam liners. However, long-term storage requires humidity control (<60% RH) to prevent tin whisker growth on leads, which could cause short circuits. Components should be stored in dry cabinets or vacuum-sealed bags until use to preserve reliability and solderability.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc 70V9269S9PRF8

Product Attribute 70V9269S9PRFI8 70V9269S7PRF8 70V9269S9PRF 70V9269S6PRF8
Part Number 70V9269S9PRFI8 70V9269S7PRF8 70V9269S9PRF 70V9269S6PRF8
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Voltage - Supply - - - -
Memory Format - - - -
Memory Size - - - -
Access Time - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Technology - - - -
Memory Organization - - - -
Write Cycle Time - Word, Page - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Series - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Memory Interface - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Memory Type - - - -

70V9269S9PRF8 Datasheet PDF

Download 70V9269S9PRF8 pdf datasheets and Renesas Electronics America Inc documentation for 70V9269S9PRF8 - Renesas Electronics America Inc.

HTML Datasheet
IDT Suffixes.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

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America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
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70V9269S9PRF8 Image

70V9269S9PRF8

Renesas Electronics America Inc
98D-70V9269S9PRF8

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