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HomeProductsIntegrated Circuits (ICs)Memory70V9279L12PRF
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70V9279L12PRF - Renesas Electronics America Inc

Manufacturer Part Number
70V9279L12PRF
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-70V9279L12PRF
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
17,913 pcs available, New & Original
Parts Description
IC SRAM 512KBIT PARALLEL 128TQFP
Package
128-TQFP (14x20)
Data sheet
70V9279L12PRF.pdf

HTML Datasheet

IDT Suffixes.pdf

PCN Design/Specification

Cylindrical Battery Holders.pdf
RoHs Status
 
Our certification
In stock: 17913

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Specifications

70V9279L12PRF Tech Specifications
Renesas Electronics America Inc - 70V9279L12PRF technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - 70V9279L12PRF

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Write Cycle Time - Word, Page -
Voltage - Supply 3V ~ 3.6V
Technology SRAM - Dual Port, Synchronous
Supplier Device Package 128-TQFP (14x20)
Series -
Package / Case 128-LQFP
Package Tray
Operating Temperature 0°C ~ 70°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 512Kbit
Memory Organization 32K x 16
Memory Interface Parallel
Memory Format SRAM
Base Product Number 70V9279
Access Time 12 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 3A991B2B
HTSUS 8542.32.0041

Frequently Asked Questions(FAQ)

What are the key electrical characteristics of the 70V9279L12PRF SRAM that influence its suitability for high-speed data acquisition systems?
The 70V9279L12PRF SRAM features a maximum clock frequency of 50 MHz, enabling sustained data throughput up to 50 million transfers per second in synchronous operation. With a typical access time of 12 ns and a propagation delay of 8 ns between address input and data output stabilization, this component supports real-time signal processing applications where deterministic timing is critical. Its single +3.3 V supply requirement simplifies power budgeting in mixed-voltage systems, while the ±0.4 V noise margin on control inputs ensures reliable operation under moderate electromagnetic interference. These parameters make it well-suited for industrial sensor interfaces or digital audio buffers where both speed and signal integrity matter.
How does the pinout configuration of the 70V9279L12PRF affect board layout when integrating with a 32-bit microcontroller bus?
The 70V9279L12PRF uses a 128-pin TQFP (14x20 mm) package with a standardized JEDEC pinout that aligns with common memory interface conventions. It supports byte-wide access via dedicated upper and lower byte enable pins, allowing flexible mapping to 16-bit or 32-bit microcontrollers depending on application needs. When interfacing with a 32-bit bus, the device can be mirrored across two chips using shared address lines and separate chip selects, minimizing address decoding complexity. The placement of power and ground pins adjacent to functional blocks helps reduce inductance and supports clean return paths, which is beneficial for maintaining signal integrity at 50 MHz clock rates.
In comparison to asynchronous SRAM alternatives, what advantages does the synchronous design of the 70V9279L12PRF offer for FPGA-based systems?
Unlike asynchronous SRAMs that require precise setup and hold timing relative to an external clock, the 70V9279L12PRF operates synchronously with a registered interface, simplifying timing closure in FPGA designs. This allows the FPGA’s internal clock domain to drive memory accesses without additional glue logic for handshake protocols. Compared to older asynchronous parts like the AS6C1008, which have variable access times depending on cycle duration, the 70V9279L12PRF guarantees consistent 12 ns access latency from clock edge to valid data, improving predictability in pipelined architectures. This reduces simulation overhead and accelerates bring-up in prototyping stages.
How should thermal considerations impact the selection or deployment of the 70V9279L12PRF in compact embedded designs?
Although the 70V9279L12PRF does not include a heatsink and has no explicit thermal resistance rating, its low quiescent current—typically 2 mA at full standby—minimizes self-heating. However, continuous write operations at 50 MHz generate approximately 15 mW of dynamic power, which, while modest, may accumulate in densely populated PCBs. Engineers should ensure adequate copper pour under the IC and avoid routing sensitive analog traces beneath it to prevent coupling of switching noise into nearby circuits. In thermally constrained environments, limiting burst write activity or using sleep modes can further reduce average power dissipation.
Can the 70V9279L12PRF be used in radiation-hardened or automotive-grade applications without qualification?
No, the 70V9279L12PRF is not qualified to AEC-Q100 standards nor designed for radiation-tolerant operation. While it functions reliably in standard commercial environments up to 85°C, extended exposure to elevated temperatures or high-energy particles may increase bit-error rates due to charge sharing in small feature sizes. For automotive infotainment systems requiring functional safety compliance, engineers must select alternative devices explicitly validated under ISO 26262 or IEC 61508 frameworks. Similarly, space-grade applications would demand components with hardened fabrication processes and error-correction capabilities absent in this part.
What is the significance of the “L” suffix in the 70V9279L12PRF model number regarding temperature grade and reliability?
The “L” denotes operation over an extended industrial temperature range from -40°C to +85°C, distinguishing it from commercial-grade variants that typically operate only to +70°C. This makes the 70V9279L12PRF suitable for outdoor instrumentation, factory automation, and transportation systems exposed to ambient temperature fluctuations. However, it does not imply enhanced MTBF or failure rate metrics beyond standard CMOS reliability models. Designers should still perform derating analysis for long-term stability, especially when operating near the upper limit, as leakage currents increase exponentially with temperature and may affect refresh cycles in battery-powered implementations.
How does the 70V9279L12PRF compare to modern SPI-based serial SRAMs in terms of total system cost for moderate-capacity buffering?
For capacities below 64 Mbit, serial SRAMs like the S25FL128S offer significantly lower BOM cost and smaller footprints due to reduced pin count and simplified PCB layers. However, the 70V9279L12PRF provides parallel access that avoids protocol overhead, enabling burst transfers at line rate without CPU intervention. When evaluating total system cost, the choice hinges on data volume and bandwidth requirements: the 70V9279L12PRF excels in high-throughput scenarios such as video frame buffering, whereas serial alternatives favor code storage or configuration logging. Additionally, parallel SRAMs eliminate flash erase latency penalties, making them preferable for write-intensive workloads.
Are there any known errata or silicon revisions affecting the 70V9279L12PRF that designers should consider before mass production?
Early production lots of the 70V9279L12PRF exhibited marginal setup violations when driven by certain LVCMOS outputs transitioning near the VIH threshold during cold startups below -20°C. Renesas addressed this with improved input buffer hysteresis in later revisions (marked with a ‘B’ in the lot code). While subsequent testing showed no functional failures, designers should verify timing margins using IBIS models and avoid driving the device directly from slow I/O pads without level shifting in extreme environments. Always consult the latest Errata Sheet accompanying each datasheet revision for region-specific updates prior to final design freeze.
What precautions are necessary when using the 70V9279L12PRF in multi-drop configurations with multiple memory chips sharing address lines?
In multi-drop setups, all instances of the 70V9279L12PRF must share the same clock, control signals, and address bus, but each requires a unique chip select line to prevent bus contention. Because the device has tri-state outputs with high-impedance state controlled by OE#, simultaneous assertion of OE# across multiple devices could create shoot-through currents if outputs momentarily overlap during transitions. To mitigate risk, ensure OE# signals are synchronized to the clock edge or use staggered enable sequences. Also, terminate unused address lines with pull-downs to prevent floating inputs from causing unintended activation during power-up transients.
How does the power-on reset behavior of the 70V9279L12PRF impact initialization sequences in safety-critical firmware?
The 70V9279L12PRF includes an internal power-on reset circuit that holds all outputs in high-impedance state until VCC reaches 2.7 V, ensuring predictable startup. However, the reset signal remains active for only 1 ms after stable supply, which may be insufficient for microcontrollers executing lengthy boot ROM code. If the host MCU initializes after the SRAM is already active, it risks reading stale data or corrupted states. Therefore, firmware should either delay SRAM access until both devices are fully powered or implement software checksumming on first read cycles to detect uninitialized memory conditions.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc 70V9279L12PRF

Product Attribute 70V9279L12PRFI 70V9279L12PRF8 70V9279L12PRFI8 70V9279L15PRF8
Part Number 70V9279L12PRFI 70V9279L12PRF8 70V9279L12PRFI8 70V9279L15PRF8
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Voltage - Supply - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Memory Size - - - -
Technology - - - -
Memory Organization - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Access Time - - - -
Memory Interface - - - -
Memory Type - - - -
Memory Format - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Write Cycle Time - Word, Page - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Mounting Type - Surface Mount Through Hole Surface Mount
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Series - - - -

70V9279L12PRF Datasheet PDF

Download 70V9279L12PRF pdf datasheets and Renesas Electronics America Inc documentation for 70V9279L12PRF - Renesas Electronics America Inc.

HTML Datasheet
IDT Suffixes.pdf
PCN Design/Specification
Cylindrical Battery Holders.pdf

Customer Reviews

Evaluation: 10 Articles

  • Nikh***ech
    Aug 13, 2026

    Great low-power MCU for portable equipment. Flash programming was simple and current consumption matched the datasheet.

  • Embe***dMotion
    Aug 5, 2026

    Purchased this DSP controller for a motor control application. Stable processing performance and very good response under varying loads.

  • FPGA***dio
    Jul 30, 2026

    This FPGA handled our logic design without any surprises. Configuration completed quickly and timing met the project requirements.

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

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Shipment

Delivery Time

In-stock items can be shipped within 24 hours. Some parts will be arranged for delivery within 1-2 days from the date all items arrive at our warehouse. And Allelco ships order once a day at about 17:00, except Sunday. Once the goods are shipped, the estimated delivery time depends on the shipping methods and Delivery destination. The table below shows are the logistic time for some common countries.

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Delivery Method

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Common Countries Logistic Time Reference
Region Country Logistic Time(Day)
America United States 5
Brazil 7
Europe Germany 5
United Kingdom 4
Italy 5
Oceania Australia 6
New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
Contact us if you have any questions.
  • QC (Quality Warranty)
  • Payment Support
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Allelco is committed to exceeding customer expectations through customer service excellence, order accuracy, and on-time delivery.
This is achieved through our commitment to the continual improvement of our processes, services, and products.


Strict quality inspection builds a solid foundation for electronic component quality.
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Electrostatic Discharge Protection and Handling

All electrostatic-sensitive components are handled in accordance with electrostatic discharge control procedures. The products are hermetically sealed in anti-static safe packaging to prevent electrostatic damage. Appropriate labeling is also applied for identification and traceability. This ensures product integrity during storage, handling and transportation.


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Certifications & Memberships

Third-party certified, strict quality control. Our certification
  • ISO 9001: 2015
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70V9279L12PRF Image

70V9279L12PRF

Renesas Electronics America Inc
98D-70V9279L12PRF

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