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HomeProductsIntegrated Circuits (ICs)Memory70V9279L12PRFI
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70V9279L12PRFI - Renesas Electronics America Inc

Manufacturer Part Number
70V9279L12PRFI
Manufacturer
Renesas Electronics Corporation
Allelco Part Number
98D-70V9279L12PRFI
Warranty
1 Year Allelco Warranty - Find out more
Stock Status:
11,745 pcs available, New & Original
Parts Description
IC SRAM 512KBIT PARALLEL 128TQFP
Package
128-TQFP (14x20)
Data sheet
70V9279L12PRFI.pdf

PCN Design/Specification

All Dev Label Chg 1/Dec/2022.pdf
RoHs Status
 
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In stock: 11745

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Specifications

70V9279L12PRFI Tech Specifications
Renesas Electronics America Inc - 70V9279L12PRFI technical specifications, attributes, parameters and parts with similar specifications to Renesas Electronics America Inc - 70V9279L12PRFI

Product Attribute Attribute Value
Manufacturer Renesas Electronics Corporation
Write Cycle Time - Word, Page -
Voltage - Supply 3V ~ 3.6V
Technology SRAM - Dual Port, Synchronous
Supplier Device Package 128-TQFP (14x20)
Series -
Package / Case 128-LQFP
Package Tray
Operating Temperature -40°C ~ 85°C (TA)
Product Attribute Attribute Value
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 512Kbit
Memory Organization 32K x 16
Memory Interface Parallel
Memory Format SRAM
Base Product Number 70V9279
Access Time 12 ns

Environmental & Export Classifications

ATTRIBUTE DESCRIPTION
RoHs Status RoHS non-compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991B2B
HTSUS 8542.32.0041

Frequently Asked Questions(FAQ)

What are the key electrical and timing characteristics of the 70V9279L12PRFI dual-port SRAM that influence system-level performance in industrial control applications?
The 70V9279L12PRFI operates at a supply voltage range of 3 V to 3.6 V, which aligns with common industrial power architectures. Its access time of 12 ns enables deterministic data retrieval critical for real-time control loops, while the dual-port architecture allows simultaneous read/write operations from two independent interfaces—reducing contention and improving throughput in multi-processor or I/O-intensive systems. This combination supports high-speed data buffering without introducing significant latency penalties.
How does the memory organization of the 70V9279L12PRFI compare to single-port synchronous SRAM alternatives when designing shared memory buffers in embedded systems?
With an organization of 32K x 16 bits, the 70V9279L12PRFI provides substantial addressable space suitable for complex state machines or multi-tasking stacks. Compared to single-port variants like the 70V9279L7PRFGI, its dual-port design eliminates arbitration logic overhead typically required in shared-memory systems. In scenarios involving concurrent access by a CPU and a peripheral DMA controller, this reduces software complexity and avoids bottlenecks during high-bandwidth transfers, though it comes at higher pin count and cost.
What are the implications of the 70V9279L12PRFI’s operating temperature range and Moisture Sensitivity Level (MSL) 3 classification for deployment in harsh environments?
Rated from -40°C to 85°C, the 70V9279L12PRFI meets standard industrial temperature requirements, making it viable for automotive edge devices or factory automation gear exposed to ambient thermal fluctuations. However, MSL 3 indicates it requires dry packaging within 168 hours of exposure to ambient humidity, necessitating careful handling during PCB assembly. Failure to adhere to JEDEC J-STD-033 guidelines could result in popcorning or delamination under thermal stress, compromising long-term reliability.
Can the 70V9279L12PRFI be used as a direct replacement for legacy single-port SRAMs in existing FPGA co-processing designs?
While functionally compatible due to parallel interface support and similar timing, the 70V9279L12PRFI introduces additional write enable signals and port-select logic absent in single-port devices. Direct substitution without firmware adaptation may cause bus conflicts if both ports attempt simultaneous writes. Engineers should verify signal mapping and update control logic to leverage the dual-port capability safely, rather than treating it as a drop-in replacement.
What design considerations arise from the RoHS non-compliant status of the 70V9279L12PRFI when targeting global markets?
The RoHS non-compliance means the 70V9279L12PRFI contains restricted substances such as lead above allowable thresholds, prohibiting its use in EU-regulated products unless exempt under Annex III. Designers must evaluate whether end-system certification (e.g., CE marking) permits this exception or if migration to compliant substitutes like the 70V9279L7PRFGI is necessary. Supply chain documentation must explicitly confirm exemption status to avoid regulatory non-conformance.
How does the ECCN classification of 3A991B2B for the 70V9279L12PRFI affect international procurement and export controls?
Classified under ECCN 3A991B2B, the device is subject to U.S. Export Administration Regulations (EAR) due to potential military applications. Importers and distributors in certain jurisdictions may require additional licensing documentation when shipping units outside controlled territories. This classification also influences sourcing strategies, as some authorized distributors restrict availability based on buyer location or end-use declarations.
In what scenarios would the 128-TQFP package of the 70V9279L12PRFI offer advantages over smaller footprint alternatives like SOIC or TSSOP packages?
The 128-pin TQFP (14x20 mm) provides sufficient I/O density for full utilization of the 32K x 16-bit memory interface without requiring multiplexed addressing. For designs demanding uncompressed parallel buses between processors and memory, this package simplifies routing compared to compact alternatives that often sacrifice pin count for size reduction. It also offers better thermal dissipation than ultra-miniature packages, supporting sustained operation under moderate load.
What trade-offs exist between using the 70V9279L12PRFI versus discrete dual-port memory solutions built from multiple chips?
Integrating the 70V9279L12PRFI reduces board space, BOM count, and inter-chip skew issues inherent in multi-die designs. However, custom discrete implementations allow finer tuning of timing margins and voltage domains per port, which might be preferable in ultra-low-power or radiation-hardened applications. The integrated solution trades flexibility for integration benefits, making it ideal where area and synchronization are prioritized over specialization.

Parts with Similar Specifications

The three parts on the right have similar specifications to Renesas Electronics America Inc 70V9279L12PRFI

Product Attribute 70V9279L12PRFI8 70V9279L12PRF8 70V9279L12PRF 70V9279L15PRF
Part Number 70V9279L12PRFI8 70V9279L12PRF8 70V9279L12PRF 70V9279L15PRF
Manufacturer Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc Renesas Electronics America Inc
Memory Interface - - - -
Voltage - Supply - - - -
Package - Tape & Reel (TR) Tube Tape & Reel (TR)
Mounting Type - Surface Mount Through Hole Surface Mount
Series - - - -
Write Cycle Time - Word, Page - - - -
Base Product Number - DAC34H84 MAX500 ADS62P42
Technology - - - -
Access Time - - - -
Package / Case - 196-LFBGA 16-DIP (0.300', 7.62mm) 64-VFQFN Exposed Pad
Memory Type - - - -
Supplier Device Package - 196-NFBGA (12x12) 16-PDIP 64-VQFN (9x9)
Memory Size - - - -
Memory Format - - - -
Operating Temperature - -40°C ~ 85°C 0°C ~ 70°C -40°C ~ 85°C
Memory Organization - - - -

70V9279L12PRFI Datasheet PDF

Download 70V9279L12PRFI pdf datasheets and Renesas Electronics America Inc documentation for 70V9279L12PRFI - Renesas Electronics America Inc.

PCN Design/Specification
All Dev Label Chg 1/Dec/2022.pdf

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Customer Reviews

Evaluation: 10 Articles

  • Nord***mbedded
    Jul 20, 2026

    Reliable FPGA with predictable behavior. Configuration and testing went smoothly, making development faster than expected.

  • Arch***ct
    Jul 15, 2026

    Used this device in a communication signal processing board. Stable timing and no unexpected issues during implementation.

  • FPGA***lorer88
    Jul 7, 2026

    The FPGA works properly and all functions operate as expected. Documentation required some additional research, but overall it is a usable device for smaller signal processing projects.

  • Nath***oleman
    Jun 29, 2026

    Used this sensor component in an industrial automation setup. Detection accuracy was consistent and installation was straightforward.

  • Emil***rperTech
    Jun 23, 2026

    Works exactly as described. I used it as a USB-to-SPI bridge in a small MCU development project and communication was stable from the first setup.

  • Liam***terTech
    Jun 15, 2026

    Used this CPLD in a logic control project. Programming was straightforward and signal timing matched the design requirements.

  • Nath***rooks
    Jun 11, 2026

    Installed this power component in a converter board. Output remained stable under different load conditions and thermal performance was better than expected.

  • Dani***alkerTech
    Jun 1, 2026

    Product works, but setup took more effort than expected. Once configured the MCU ran reliably, although documentation support felt older compared with newer platforms. Fine for maintenance projects.

  • Yuki***aka88
    May 26, 2026

    信号通信プロジェクトでこのRS-485トランシーバーを使用しました。設置は簡単で、長距離ケーブルでも通信は安定していました。消費電力も、以前使用していたものより低くなっています。

  • Stev***aker
    May 20, 2026

    Solid diode for power rectification. Works well in switching circuits.

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Brazil 7
Europe Germany 5
United Kingdom 4
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New Zealand 5
Asia India 4
Japan 4
Middle East Israel 6
DHL & FedEx Shipment Charges Reference
Shipment charges(KG) Reference DHL(USD$)
0.00kg-1.00kg USD$30.00 - USD$60.00
1.00kg-2.00kg USD$40.00 - USD$80.00
2.00kg-3.00kg USD$50.00 - USD$100.00
Note:
The above table is for reference only. There may have some data bias for the uncontrollable factors.
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70V9279L12PRFI Image

70V9279L12PRFI

Renesas Electronics America Inc
98D-70V9279L12PRFI

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